UPD60510BF1-HN4-M1-A Renesas Electronics Corporation
Hersteller: Renesas Electronics CorporationDescription: IC MCU 32BIT ROMLESS 324BGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: CANbus, CSI, Ethernet, I2C, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 324-BGA (19x19)
Number of I/O: 96
DigiKey Programmable: Not Verified
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Technische Details UPD60510BF1-HN4-M1-A Renesas Electronics Corporation
Description: IC MCU 32BIT ROMLESS 324BGA, Packaging: Tray, Package / Case: 324-BGA, Mounting Type: Surface Mount, Speed: 100MHz, RAM Size: 512K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM® Cortex®-M3, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V, Connectivity: CANbus, CSI, Ethernet, I2C, UART/USART, Peripherals: DMA, WDT, Supplier Device Package: 324-BGA (19x19), Number of I/O: 96, DigiKey Programmable: Not Verified.
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| UPD60510BF1-HN4-M1-A | Hersteller : Renesas Electronics |
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