Technische Details VSC3312YYP-01 Microchip / Microsemi
Description: IC SWITCH 16X16 6.5GBPS 196FCBGA, Features: Advanced Signal Equalization, Packaging: Tray, Package / Case: 196-BGA, Mounting Type: Surface Mount, Applications: Backplane, Cable Interconnect, Supplier Device Package: 196-BGA, Voltage - Supply, Single (V+): 2.5V, Multiplexer/Demultiplexer Circuit: 12:12, Number of Channels: 12.
Weitere Produktangebote VSC3312YYP-01
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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VSC3312YYP-01 | Microchip Technology |
 Description: IC SWITCH 16X16 6.5GBPS 196FCBGAFeatures: Advanced Signal Equalization Packaging: Tray Package / Case: 196-BGA Mounting Type: Surface Mount Applications: Backplane, Cable Interconnect Supplier Device Package: 196-BGA Voltage - Supply, Single (V+): 2.5V Multiplexer/Demultiplexer Circuit: 12:12 Number of Channels: 12 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| VSC3312YYP-01 |
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Hersteller: Microchip Technology
Description: IC SWITCH 16X16 6.5GBPS 196FCBGA
Features: Advanced Signal Equalization
Packaging: Tray
Package / Case: 196-BGA
Mounting Type: Surface Mount
Applications: Backplane, Cable Interconnect
Supplier Device Package: 196-BGA
Voltage - Supply, Single (V+): 2.5V
Multiplexer/Demultiplexer Circuit: 12:12
Number of Channels: 12
Description: IC SWITCH 16X16 6.5GBPS 196FCBGA
Features: Advanced Signal Equalization
Packaging: Tray
Package / Case: 196-BGA
Mounting Type: Surface Mount
Applications: Backplane, Cable Interconnect
Supplier Device Package: 196-BGA
Voltage - Supply, Single (V+): 2.5V
Multiplexer/Demultiplexer Circuit: 12:12
Number of Channels: 12
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH