W63AH6NBVADI Winbond Electronics
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 64M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 64M x 16
DigiKey Programmable: Not Verified
auf Bestellung 181 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 11.02 EUR |
10+ | 10.06 EUR |
25+ | 9.87 EUR |
40+ | 9.8 EUR |
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Technische Details W63AH6NBVADI Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA, Packaging: Tray, Package / Case: 178-VFBGA, Mounting Type: Surface Mount, Memory Size: 1Gbit, Memory Type: Volatile, Operating Temperature: -40°C ~ 85°C (TC), Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V, Technology: SDRAM - Mobile LPDDR3, Clock Frequency: 1.066 GHz, Memory Format: DRAM, Supplier Device Package: 178-VFBGA (11x11.5), Part Status: Active, Write Cycle Time - Word, Page: 15ns, Memory Interface: HSUL_12, Access Time: 5.5 ns, Memory Organization: 64M x 16, DigiKey Programmable: Not Verified.