WB60FV60ALZ WeEn Semiconductor(Hong Kong)Co.,Limited
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Technische Details WB60FV60ALZ WeEn Semiconductor(Hong Kong)Co.,Limited
Description: WB60FV60AL/NAU000/NO MARK*CHIPS, Packaging: Bulk, Package / Case: Die, Mounting Type: Surface Mount, Speed: Fast Recovery =< 500ns, > 200mA (Io), Reverse Recovery Time (trr): 55 ns, Technology: Standard, Current - Average Rectified (Io): 60A, Supplier Device Package: Wafer, Operating Temperature - Junction: -40°C ~ 175°C, Voltage - DC Reverse (Vr) (Max): 600 V, Voltage - Forward (Vf) (Max) @ If: 2 V @ 60 A, Current - Reverse Leakage @ Vr: 10 µA @ 600 V.
Weitere Produktangebote WB60FV60ALZ
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| WB60FV60ALZ | Hersteller : WeEn Semiconductors |
 Description: WB60FV60AL/NAU000/NO MARK*CHIPSPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 55 ns Technology: Standard Current - Average Rectified (Io): 60A Supplier Device Package: Wafer Operating Temperature - Junction: -40°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 2 V @ 60 A Current - Reverse Leakage @ Vr: 10 µA @ 600 V |
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