WCI1608CP56NGDG

WCI1608CP56NGDG INPAQ Technology Co., Ltd


WCI1608CP%20Series.pdf Hersteller: INPAQ Technology Co., Ltd
Description: CHIP IND 1608,56NH,G,38Q,0.6A,4K
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: 0603 (1608 Metric)
Size / Dimension: 0.071" L x 0.044" W (1.80mm x 1.12mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -25°C ~ 125°C
DC Resistance (DCR): 310mOhm Max
Q @ Freq: 38 @ 200MHz
Frequency - Self Resonant: 1.9GHz
Material - Core: Ceramic
Inductance Frequency - Test: 200 MHz
Supplier Device Package: 0603
Height - Seated (Max): 0.040" (1.02mm)
Inductance: 56 nH
Current Rating (Amps): 600 mA
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Technische Details WCI1608CP56NGDG INPAQ Technology Co., Ltd

Description: CHIP IND 1608,56NH,G,38Q,0.6A,4K, Packaging: Tape & Reel (TR), Tolerance: ±2%, Package / Case: 0603 (1608 Metric), Size / Dimension: 0.071" L x 0.044" W (1.80mm x 1.12mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Wirewound, Operating Temperature: -25°C ~ 125°C, DC Resistance (DCR): 310mOhm Max, Q @ Freq: 38 @ 200MHz, Frequency - Self Resonant: 1.9GHz, Material - Core: Ceramic, Inductance Frequency - Test: 200 MHz, Supplier Device Package: 0603, Height - Seated (Max): 0.040" (1.02mm), Inductance: 56 nH, Current Rating (Amps): 600 mA.

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WCI1608CP56NGDG WCI1608CP56NGDG Hersteller : INPAQ Technology Co., Ltd WCI1608CP%20Series.pdf Description: CHIP IND 1608,56NH,G,38Q,0.6A,4K
Packaging: Cut Tape (CT)
Tolerance: ±2%
Package / Case: 0603 (1608 Metric)
Size / Dimension: 0.071" L x 0.044" W (1.80mm x 1.12mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -25°C ~ 125°C
DC Resistance (DCR): 310mOhm Max
Q @ Freq: 38 @ 200MHz
Frequency - Self Resonant: 1.9GHz
Material - Core: Ceramic
Inductance Frequency - Test: 200 MHz
Supplier Device Package: 0603
Height - Seated (Max): 0.040" (1.02mm)
Inductance: 56 nH
Current Rating (Amps): 600 mA
Produkt ist nicht verfügbar