WCI1608CP68NGDG INPAQ Technology Co., Ltd
Hersteller: INPAQ Technology Co., LtdDescription: CHIP IND 1608,68NH,G,37Q,0.6A,4K
Packaging: Cut Tape (CT)
Tolerance: ±2%
Package / Case: 0603 (1608 Metric)
Size / Dimension: 0.071" L x 0.044" W (1.80mm x 1.12mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -25°C ~ 125°C
DC Resistance (DCR): 340mOhm Max
Q @ Freq: 37 @ 200MHz
Frequency - Self Resonant: 1.7GHz
Material - Core: Ceramic
Inductance Frequency - Test: 200 MHz
Supplier Device Package: 0603
Height - Seated (Max): 0.040" (1.02mm)
Inductance: 68 nH
Current Rating (Amps): 600 mA
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 77+ | 0.23 EUR |
| 83+ | 0.21 EUR |
| 98+ | 0.18 EUR |
| 111+ | 0.16 EUR |
| 121+ | 0.15 EUR |
| 250+ | 0.13 EUR |
| 500+ | 0.12 EUR |
| 1000+ | 0.096 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details WCI1608CP68NGDG INPAQ Technology Co., Ltd
Description: CHIP IND 1608,68NH,G,37Q,0.6A,4K, Packaging: Cut Tape (CT), Tolerance: ±2%, Package / Case: 0603 (1608 Metric), Size / Dimension: 0.071" L x 0.044" W (1.80mm x 1.12mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Wirewound, Operating Temperature: -25°C ~ 125°C, DC Resistance (DCR): 340mOhm Max, Q @ Freq: 37 @ 200MHz, Frequency - Self Resonant: 1.7GHz, Material - Core: Ceramic, Inductance Frequency - Test: 200 MHz, Supplier Device Package: 0603, Height - Seated (Max): 0.040" (1.02mm), Inductance: 68 nH, Current Rating (Amps): 600 mA.