WCI1608CPR12GDG INPAQ Technology Co., Ltd
Hersteller: INPAQ Technology Co., Ltd
Description: CHIP IND 1608,120NH,G,32Q,0.3A,4
Mounting Type: Surface Mount
Size / Dimension: 0.071" L x 0.044" W (1.80mm x 1.12mm)
Package / Case: 0603 (1608 Metric)
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Current Rating (Amps): 300 mA
Inductance: 120 nH
Height - Seated (Max): 0.040" (1.02mm)
Supplier Device Package: 0603
Inductance Frequency - Test: 150 MHz
Material - Core: Ceramic
Frequency - Self Resonant: 1.3GHz
Q @ Freq: 32 @ 150MHz
DC Resistance (DCR): 650mOhm Max
Operating Temperature: -25°C ~ 125°C
Type: Wirewound
Shielding: Unshielded
| Anzahl | Preis |
|---|---|
| 4000+ | 0.059 EUR |
| 8000+ | 0.055 EUR |
| 12000+ | 0.054 EUR |
| 20000+ | 0.051 EUR |
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Technische Details WCI1608CPR12GDG INPAQ Technology Co., Ltd
Description: CHIP IND 1608,120NH,G,32Q,0.3A,4, Mounting Type: Surface Mount, Size / Dimension: 0.071" L x 0.044" W (1.80mm x 1.12mm), Package / Case: 0603 (1608 Metric), Tolerance: ±2%, Packaging: Tape & Reel (TR), Current Rating (Amps): 300 mA, Inductance: 120 nH, Height - Seated (Max): 0.040" (1.02mm), Supplier Device Package: 0603, Inductance Frequency - Test: 150 MHz, Material - Core: Ceramic, Frequency - Self Resonant: 1.3GHz, Q @ Freq: 32 @ 150MHz, DC Resistance (DCR): 650mOhm Max, Operating Temperature: -25°C ~ 125°C, Type: Wirewound, Shielding: Unshielded.
Weitere Produktangebote WCI1608CPR12GDG
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WCI1608CPR12GDG | Hersteller : INPAQ Technology Co., Ltd |
Description: CHIP IND 1608,120NH,G,32Q,0.3A,4Package / Case: 0603 (1608 Metric) Tolerance: ±2% Packaging: Cut Tape (CT) Current Rating (Amps): 300 mA Inductance: 120 nH Height - Seated (Max): 0.040" (1.02mm) Supplier Device Package: 0603 Inductance Frequency - Test: 150 MHz Material - Core: Ceramic Frequency - Self Resonant: 1.3GHz Q @ Freq: 32 @ 150MHz DC Resistance (DCR): 650mOhm Max Operating Temperature: -25°C ~ 125°C Type: Wirewound Shielding: Unshielded Mounting Type: Surface Mount Size / Dimension: 0.071" L x 0.044" W (1.80mm x 1.12mm) |
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