
WCI1608CPR12GDG INPAQ Technology Co., Ltd

Description: CHIP IND 1608,120NH,G,32Q,0.3A,4
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: 0603 (1608 Metric)
Size / Dimension: 0.071" L x 0.044" W (1.80mm x 1.12mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -25°C ~ 125°C
DC Resistance (DCR): 650mOhm Max
Q @ Freq: 32 @ 150MHz
Frequency - Self Resonant: 1.3GHz
Material - Core: Ceramic
Inductance Frequency - Test: 150 MHz
Supplier Device Package: 0603
Height - Seated (Max): 0.040" (1.02mm)
Inductance: 120 nH
Current Rating (Amps): 300 mA
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
4000+ | 0.06 EUR |
8000+ | 0.06 EUR |
12000+ | 0.05 EUR |
20000+ | 0.05 EUR |
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Technische Details WCI1608CPR12GDG INPAQ Technology Co., Ltd
Description: CHIP IND 1608,120NH,G,32Q,0.3A,4, Tolerance: ±2%, Packaging: Tape & Reel (TR), Package / Case: 0603 (1608 Metric), Size / Dimension: 0.071" L x 0.044" W (1.80mm x 1.12mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Wirewound, Operating Temperature: -25°C ~ 125°C, DC Resistance (DCR): 650mOhm Max, Q @ Freq: 32 @ 150MHz, Frequency - Self Resonant: 1.3GHz, Material - Core: Ceramic, Inductance Frequency - Test: 150 MHz, Supplier Device Package: 0603, Height - Seated (Max): 0.040" (1.02mm), Inductance: 120 nH, Current Rating (Amps): 300 mA.
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WCI1608CPR12GDG | Hersteller : INPAQ Technology Co., Ltd |
![]() Tolerance: ±2% Packaging: Cut Tape (CT) Package / Case: 0603 (1608 Metric) Size / Dimension: 0.071" L x 0.044" W (1.80mm x 1.12mm) Mounting Type: Surface Mount Shielding: Unshielded Type: Wirewound Operating Temperature: -25°C ~ 125°C DC Resistance (DCR): 650mOhm Max Q @ Freq: 32 @ 150MHz Frequency - Self Resonant: 1.3GHz Material - Core: Ceramic Inductance Frequency - Test: 150 MHz Supplier Device Package: 0603 Height - Seated (Max): 0.040" (1.02mm) Inductance: 120 nH Current Rating (Amps): 300 mA |
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