
WCI2012CPR12GDG INPAQ Technology Co., Ltd

Description: CHIP IND 2012,120NH,G,50Q,0.4A,3
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: 0805 (2012 Metric)
Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -25°C ~ 125°C
DC Resistance (DCR): 510mOhm Max
Q @ Freq: 50 @ 250MHz
Frequency - Self Resonant: 1.1GHz
Material - Core: Ceramic
Inductance Frequency - Test: 150 MHz
Supplier Device Package: 0805
Height - Seated (Max): 0.060" (1.52mm)
Inductance: 120 nH
Current Rating (Amps): 400 mA
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
3000+ | 0.06 EUR |
6000+ | 0.05 EUR |
9000+ | 0.05 EUR |
15000+ | 0.05 EUR |
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Technische Details WCI2012CPR12GDG INPAQ Technology Co., Ltd
Description: CHIP IND 2012,120NH,G,50Q,0.4A,3, Tolerance: ±2%, Packaging: Tape & Reel (TR), Package / Case: 0805 (2012 Metric), Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Wirewound, Operating Temperature: -25°C ~ 125°C, DC Resistance (DCR): 510mOhm Max, Q @ Freq: 50 @ 250MHz, Frequency - Self Resonant: 1.1GHz, Material - Core: Ceramic, Inductance Frequency - Test: 150 MHz, Supplier Device Package: 0805, Height - Seated (Max): 0.060" (1.52mm), Inductance: 120 nH, Current Rating (Amps): 400 mA.
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WCI2012CPR12GDG | Hersteller : INPAQ Technology Co., Ltd |
![]() Packaging: Cut Tape (CT) Tolerance: ±2% Package / Case: 0805 (2012 Metric) Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm) Mounting Type: Surface Mount Shielding: Unshielded Type: Wirewound Operating Temperature: -25°C ~ 125°C DC Resistance (DCR): 510mOhm Max Q @ Freq: 50 @ 250MHz Frequency - Self Resonant: 1.1GHz Material - Core: Ceramic Inductance Frequency - Test: 150 MHz Supplier Device Package: 0805 Height - Seated (Max): 0.060" (1.52mm) Inductance: 120 nH Current Rating (Amps): 400 mA |
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