WCI2012CPR12GDG INPAQ Technology Co., Ltd
Hersteller: INPAQ Technology Co., Ltd
Description: CHIP IND 2012,120NH,G,50Q,0.4A,3
Current Rating (Amps): 400 mA
Inductance: 120 nH
Height - Seated (Max): 0.060" (1.52mm)
Supplier Device Package: 0805
Inductance Frequency - Test: 150 MHz
Material - Core: Ceramic
Frequency - Self Resonant: 1.1GHz
Q @ Freq: 50 @ 250MHz
DC Resistance (DCR): 510mOhm Max
Operating Temperature: -25°C ~ 125°C
Type: Wirewound
Shielding: Unshielded
Mounting Type: Surface Mount
Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm)
Package / Case: 0805 (2012 Metric)
Tolerance: ±2%
Packaging: Tape & Reel (TR)
| Anzahl | Preis |
|---|---|
| 3000+ | 0.058 EUR |
| 6000+ | 0.054 EUR |
| 9000+ | 0.053 EUR |
| 15000+ | 0.05 EUR |
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Technische Details WCI2012CPR12GDG INPAQ Technology Co., Ltd
Description: CHIP IND 2012,120NH,G,50Q,0.4A,3, Current Rating (Amps): 400 mA, Inductance: 120 nH, Height - Seated (Max): 0.060" (1.52mm), Supplier Device Package: 0805, Inductance Frequency - Test: 150 MHz, Material - Core: Ceramic, Frequency - Self Resonant: 1.1GHz, Q @ Freq: 50 @ 250MHz, DC Resistance (DCR): 510mOhm Max, Operating Temperature: -25°C ~ 125°C, Type: Wirewound, Shielding: Unshielded, Mounting Type: Surface Mount, Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm), Package / Case: 0805 (2012 Metric), Tolerance: ±2%, Packaging: Tape & Reel (TR).
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WCI2012CPR12GDG | Hersteller : INPAQ Technology Co., Ltd |
Description: CHIP IND 2012,120NH,G,50Q,0.4A,3 Tolerance: ±2% Packaging: Cut Tape (CT) Package / Case: 0805 (2012 Metric) Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm) Mounting Type: Surface Mount Shielding: Unshielded Type: Wirewound Operating Temperature: -25°C ~ 125°C DC Resistance (DCR): 510mOhm Max Q @ Freq: 50 @ 250MHz Frequency - Self Resonant: 1.1GHz Material - Core: Ceramic Inductance Frequency - Test: 150 MHz Supplier Device Package: 0805 Height - Seated (Max): 0.060" (1.52mm) Inductance: 120 nH Current Rating (Amps): 400 mA |
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