
WP21-S030VA1-R8000 JAE Electronics

Board to Board & Mezzanine Connectors 30P SKT 0.35mm pitch 0.6mm stacking hght
auf Bestellung 2979 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
2+ | 2.13 EUR |
10+ | 1.5 EUR |
100+ | 1.4 EUR |
250+ | 1.3 EUR |
500+ | 1.22 EUR |
2500+ | 1.15 EUR |
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Technische Details WP21-S030VA1-R8000 JAE Electronics
Description: CONN RCPT 30POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.014" (0.35mm), Height Above Board: 0.023" (0.59mm), Contact Finish Thickness: 4.00µin (0.100µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote WP21-S030VA1-R8000 nach Preis ab 1.25 EUR bis 2.18 EUR
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WP21-S030VA1-R8000 | Hersteller : JAE Electronics |
![]() Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.023" (0.59mm) Contact Finish Thickness: 4.00µin (0.100µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
auf Bestellung 564 Stücke: Lieferzeit 10-14 Tag (e) |
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WP21-S030VA1-R8000 Produktcode: 195785
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WP21-S030VA1-R8000 | Hersteller : JAE Electronics |
![]() Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.023" (0.59mm) Contact Finish Thickness: 4.00µin (0.100µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |