WP27D-P030VA1-R15000 JAE Electronics
Hersteller: JAE Electronics
Description: CONN PLUG 30POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Plug, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.014" (0.35mm)
Height Above Board: 0.022" (0.57mm)
Contact Finish Thickness: 4.00µin (0.100µm)
Mated Stacking Heights: 0.7mm
Number of Rows: 2
Description: CONN PLUG 30POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Plug, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.014" (0.35mm)
Height Above Board: 0.022" (0.57mm)
Contact Finish Thickness: 4.00µin (0.100µm)
Mated Stacking Heights: 0.7mm
Number of Rows: 2
auf Bestellung 5013 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
8+ | 3.51 EUR |
10+ | 3.07 EUR |
25+ | 2.94 EUR |
50+ | 2.88 EUR |
100+ | 2.75 EUR |
250+ | 2.49 EUR |
500+ | 2.29 EUR |
1000+ | 1.96 EUR |
2500+ | 1.83 EUR |
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Technische Details WP27D-P030VA1-R15000 JAE Electronics
Description: CONN PLUG 30POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Plug, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.014" (0.35mm), Height Above Board: 0.022" (0.57mm), Contact Finish Thickness: 4.00µin (0.100µm), Mated Stacking Heights: 0.7mm, Number of Rows: 2.
Weitere Produktangebote WP27D-P030VA1-R15000
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
WP27D-P030VA1-R15000 | Hersteller : JAE Electronics | Board to Board & Mezzanine Connectors 28/2 PLG .35MM PTCH 0.7mm stcking 2pin3A |
auf Bestellung 6576 Stücke: Lieferzeit 14-28 Tag (e) |
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WP27D-P030VA1-R15000 | Hersteller : JAE Electronics |
Description: CONN PLUG 30POS SMD GOLD Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Plug, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.022" (0.57mm) Contact Finish Thickness: 4.00µin (0.100µm) Mated Stacking Heights: 0.7mm Number of Rows: 2 |
Produkt ist nicht verfügbar |