
WP27D-S030VA3-R15000 JAE Electronics

Board to Board & Mezzanine Connectors 10P 0.35MM PITCH 0.6MM B2B FPC SOCKET
auf Bestellung 13354 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
2+ | 1.66 EUR |
10+ | 1.35 EUR |
100+ | 1.29 EUR |
250+ | 1.17 EUR |
500+ | 1.12 EUR |
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Technische Details WP27D-S030VA3-R15000 JAE Electronics
Description: CONN RCPT 30POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.014" (0.35mm), Height Above Board: 0.028" (0.71mm), Contact Finish Thickness: 4.00µin (0.100µm), Mated Stacking Heights: 0.7mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote WP27D-S030VA3-R15000 nach Preis ab 1.24 EUR bis 2.16 EUR
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WP27D-S030VA3-R15000 | Hersteller : JAE Electronics |
![]() Packaging: Cut Tape (CT) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.028" (0.71mm) Contact Finish Thickness: 4.00µin (0.100µm) Mated Stacking Heights: 0.7mm Part Status: Active Number of Rows: 2 |
auf Bestellung 16282 Stücke: Lieferzeit 10-14 Tag (e) |
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WP27D-S030VA3-R15000 | Hersteller : JAE Electronics |
![]() Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.028" (0.71mm) Contact Finish Thickness: 4.00µin (0.100µm) Mated Stacking Heights: 0.7mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |