WP27D-S060VA3-R15000 JAE Electronics
Hersteller: JAE ElectronicsDescription: CONN RCPT 60POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Height Above Board: 0.028" (0.71mm)
Contact Finish Thickness: 4.00µin (0.100µm)
Mated Stacking Heights: 0.7mm
Part Status: Active
Number of Rows: 2
auf Bestellung 14835 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 3.91 EUR |
| 10+ | 3.4 EUR |
| 25+ | 3.25 EUR |
| 50+ | 3.18 EUR |
| 100+ | 3.03 EUR |
| 250+ | 2.75 EUR |
| 500+ | 2.53 EUR |
| 1000+ | 2.17 EUR |
| 2500+ | 2.02 EUR |
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Technische Details WP27D-S060VA3-R15000 JAE Electronics
Description: CONN RCPT 60POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.014" (0.35mm), Height Above Board: 0.028" (0.71mm), Contact Finish Thickness: 4.00µin (0.100µm), Mated Stacking Heights: 0.7mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote WP27D-S060VA3-R15000
| Foto | Bezeichnung | Hersteller | Beschreibung |
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WP27D-S060VA3-R15000 | Hersteller : JAE Electronics |
Description: CONN RCPT 60POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.014" (0.35mm) Height Above Board: 0.028" (0.71mm) Contact Finish Thickness: 4.00µin (0.100µm) Mated Stacking Heights: 0.7mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
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| WP27D-S060VA3-R15000 | Hersteller : JAE Electronics |
Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |