WS991LT500T4 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE WS
Melting Point: 281°F (138°C)
Type: Solder Paste
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Packaging: Bulk
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Flux Type: Water Soluble
Process: Lead Free
Mesh Type: 4
Form: Jar, 17.64 oz (500g)
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Technische Details WS991LT500T4 Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE WS, Melting Point: 281°F (138°C), Type: Solder Paste, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Packaging: Bulk, Shelf Life: 6 Months, Shelf Life Start: Date of Manufacture, Flux Type: Water Soluble, Process: Lead Free, Mesh Type: 4, Form: Jar, 17.64 oz (500g).
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| Foto | Bezeichnung | Hersteller | Beschreibung |
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WS991LT500T4 | Hersteller : Chip Quik |
Solder Thermally Stable Solder Paste WS (Water-Soluble) Sn42/Bi57.6/Ag0.4 T4 (500g jar) |
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