WS991LT500T4C Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 139.13 EUR |
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Technische Details WS991LT500T4C Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE WS, Packaging: Bulk, Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4), Type: Solder Paste, Melting Point: 280°F (138°C), Form: Cartridge, 17.64 oz (500g), Process: Lead Free, Flux Type: Water Soluble, Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.
Weitere Produktangebote WS991LT500T4C
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
WS991LT500T4C | Hersteller : Chip Quik | Solder Thermally Stable Solder Paste WS (Water-Soluble) Sn42/Bi57.6/Ag0.4 T4 (500g cartridge) |
Produkt ist nicht verfügbar |