X2600H

X2600H Lumissil Microsystems


X2600_DS.pdf
Hersteller: Lumissil Microsystems
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Supplier Device Package: 209-FBGA (11x11)
Voltage - I/O: 1.8V, 3.3V
Core Processor: RISC-V, XBurst® 2
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 209-TFBGA
Packaging: Cut Tape (CT)
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG (2)
auf Bestellung 1759 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.94 EUR
10+12.38 EUR
25+11.53 EUR
100+10.49 EUR
250+9.96 EUR
500+9.62 EUR
Mindestbestellmenge: 2
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Technische Details X2600H Lumissil Microsystems

Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ, Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART, Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2, Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB, Graphics Acceleration: No, RAM Controllers: DDR3, DDR3L, Number of Cores/Bus Width: 2 Core, 32-Bit, USB: USB 2.0 OTG (2), Supplier Device Package: 209-FBGA (11x11), Voltage - I/O: 1.8V, 3.3V, Core Processor: RISC-V, XBurst® 2, Operating Temperature: -40°C ~ 85°C (TA), Speed: 1.2GHz, Mounting Type: Surface Mount, Package / Case: 209-TFBGA, Packaging: Tape & Reel (TR).

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X2600H X2600H Hersteller : Lumissil Microsystems X2600_DS.pdf Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG (2)
Supplier Device Package: 209-FBGA (11x11)
Voltage - I/O: 1.8V, 3.3V
Core Processor: RISC-V, XBurst® 2
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 209-TFBGA
Packaging: Tape & Reel (TR)
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Im Einkaufswagen  Stück im Wert von  UAH