XC2299H200F100LABKXUMA1 Infineon Technologies
Hersteller: Infineon Technologies
Description: IC MCU 16/32B 1.6MB FLSH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 150
Part Status: Not For New Designs
Supplier Device Package: PG-LQFP-176-12
Peripherals: DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16/32-Bit
Data Converters: A/D 30x10b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 138K x 8
Program Memory Size: 1.6MB (1.6M x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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Technische Details XC2299H200F100LABKXUMA1 Infineon Technologies
Description: IC MCU 16/32B 1.6MB FLSH 176LQFP, DigiKey Programmable: Not Verified, Number of I/O: 150, Part Status: Not For New Designs, Supplier Device Package: PG-LQFP-176-12, Peripherals: DMA, I2S, POR, PWM, WDT, Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Core Size: 16/32-Bit, Data Converters: A/D 30x10b, Core Processor: C166SV2, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 125°C (TA), RAM Size: 138K x 8, Program Memory Size: 1.6MB (1.6M x 8), Speed: 100MHz, Mounting Type: Surface Mount, Package / Case: 176-LQFP Exposed Pad, Packaging: Tape & Reel (TR).