Technische Details XC2S1006FG456C XILINX
Description: IC FPGA 196 I/O 456FBGA, Packaging: Tray, Package / Case: 456-BBGA, Mounting Type: Surface Mount, Number of Gates: 100000, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 2.375V ~ 2.625V, Number of Logic Elements/Cells: 2700, Supplier Device Package: 456-FBGA (23x23), Number of LABs/CLBs: 600, Total RAM Bits: 40960, Number of I/O: 196, DigiKey Programmable: Not Verified.
Weitere Produktangebote XC2S1006FG456C
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| XC2S100-6FG456C | Hersteller : XILINX |
 06+ |
auf Bestellung 1100 Stücke: Lieferzeit 21-28 Tag (e) |
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XC2S100-6FG456C | Hersteller : AMD |
Description: IC FPGA 196 I/O 456FBGA Packaging: Tray Package / Case: 456-BBGA Mounting Type: Surface Mount Number of Gates: 100000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 2700 Supplier Device Package: 456-FBGA (23x23) Number of LABs/CLBs: 600 Total RAM Bits: 40960 Number of I/O: 196 DigiKey Programmable: Not Verified |
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