Technische Details XC3S20004FG900I XILINX
Description: IC FPGA 565 I/O 900FBGA, Packaging: Bulk, Package / Case: 900-BBGA, Mounting Type: Surface Mount, Number of Gates: 2000000, Operating Temperature: -40°C ~ 100°C (TJ), Voltage - Supply: 1.14V ~ 1.26V, Number of Logic Elements/Cells: 46080, Supplier Device Package: 900-FBGA (31x31), Number of LABs/CLBs: 5120, Total RAM Bits: 737280, Number of I/O: 565, DigiKey Programmable: Not Verified.
Weitere Produktangebote XC3S20004FG900I
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| XC3S2000-4FG900I | Hersteller : XILINX |
 06+ |
auf Bestellung 1100 Stücke: Lieferzeit 21-28 Tag (e) |
||
 |
XC3S2000-4FG900I | Hersteller : AMD |
Description: IC FPGA 565 I/O 900FBGA Packaging: Bulk Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 2000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 46080 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 5120 Total RAM Bits: 737280 Number of I/O: 565 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |