Technische Details XC3S250E-5FTG256C XILINX
Description: IC FPGA 172 I/O 256FTBGA, Packaging: Tray, Package / Case: 256-LBGA, Mounting Type: Surface Mount, Number of Gates: 250000, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 1.14V ~ 1.26V, Number of Logic Elements/Cells: 5508, Supplier Device Package: 256-FTBGA (17x17), Number of LABs/CLBs: 612, Total RAM Bits: 221184, Number of I/O: 172, DigiKey Programmable: Not Verified.
Weitere Produktangebote XC3S250E-5FTG256C
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XC3S250E-5FTG256C | Hersteller : AMD |
 Description: IC FPGA 172 I/O 256FTBGAPackaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 172 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S250E-5FTG256C | Hersteller : Xilinx |
FPGA - Field Programmable Gate Array XC3S250E-5FTG256C |
Produkt ist nicht verfügbar |