Technische Details XC3S400AN-5FGG400C XILINX
Description: IC FPGA 311 I/O 400FBGA, Packaging: Tray, Package / Case: 400-BGA, Mounting Type: Surface Mount, Number of Gates: 400000, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 1.14V ~ 1.26V, Number of Logic Elements/Cells: 8064, Supplier Device Package: 400-FBGA (21x21), Number of LABs/CLBs: 896, Total RAM Bits: 368640, Number of I/O: 311, DigiKey Programmable: Not Verified.
Weitere Produktangebote XC3S400AN-5FGG400C
| Foto | Bezeichnung | Hersteller | Beschreibung |
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XC3S400AN-5FGG400C | AMD |
 Description: IC FPGA 311 I/O 400FBGAPackaging: Tray Package / Case: 400-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 400-FBGA (21x21) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 311 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| XC3S400AN-5FGG400C |
|
Hersteller: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH