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Technische Details XC6SLX25-3FGG484C Xilinx
Description: IC FPGA 266 I/O 484FBGA, Packaging: Tray, Package / Case: 484-BBGA, Mounting Type: Surface Mount, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 1.14V ~ 1.26V, Number of Logic Elements/Cells: 24051, Supplier Device Package: 484-FBGA (23x23), Number of LABs/CLBs: 1879, Total RAM Bits: 958464, Part Status: Active, Number of I/O: 266, DigiKey Programmable: Not Verified.
Weitere Produktangebote XC6SLX25-3FGG484C nach Preis ab 171.48 EUR bis 171.48 EUR
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XC6SLX25-3FGG484C | AMD |
 Description: IC FPGA 266 I/O 484FBGAPackaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 24051 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 1879 Total RAM Bits: 958464 Part Status: Active Number of I/O: 266 DigiKey Programmable: Not Verified |
auf Bestellung 27 Stücke: Lieferzeit 10-14 Tag (e) |
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| XC6SLX25-3FGG484C |
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Hersteller: AMD
Description: IC FPGA 266 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 24051
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1879
Total RAM Bits: 958464
Part Status: Active
Number of I/O: 266
DigiKey Programmable: Not Verified
Description: IC FPGA 266 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 24051
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1879
Total RAM Bits: 958464
Part Status: Active
Number of I/O: 266
DigiKey Programmable: Not Verified
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 171.48 EUR |