Technische Details XC7S75-1FGGA676I AMD / Xilinx
Description: IC FPGA 400 I/O 676FPBGA, Packaging: Tray, Package / Case: 676-BGA, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 100°C (TJ), Voltage - Supply: 0.95V ~ 1.05V, Number of Logic Elements/Cells: 76800, Supplier Device Package: 676-FPBGA (27x27), Number of LABs/CLBs: 6000, Total RAM Bits: 4331520, Part Status: Active, Number of I/O: 400, DigiKey Programmable: Not Verified.
Weitere Produktangebote XC7S75-1FGGA676I nach Preis ab 215.92 EUR bis 215.92 EUR
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XC7S75-1FGGA676I | AMD |
 Description: IC FPGA 400 I/O 676FPBGAPackaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 76800 Supplier Device Package: 676-FPBGA (27x27) Number of LABs/CLBs: 6000 Total RAM Bits: 4331520 Part Status: Active Number of I/O: 400 DigiKey Programmable: Not Verified |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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Hersteller: AMD
Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 4331520
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 4331520
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 215.92 EUR |