Technische Details XCKU035-2SFVA784I AMD / Xilinx
Description: IC FPGA 468 I/O 784FCBGA, Packaging: Bulk, Package / Case: 784-BFBGA, FCCSP, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 100°C (TJ), Voltage - Supply: 0.922V ~ 0.979V, Number of Logic Elements/Cells: 444343, Supplier Device Package: 784-FCCSPBGA (23x23), Number of LABs/CLBs: 25391, Total RAM Bits: 19456000, Number of I/O: 468, DigiKey Programmable: Not Verified.
Weitere Produktangebote XCKU035-2SFVA784I nach Preis ab 3590.84 EUR bis 3590.84 EUR
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XCKU035-2SFVA784I | AMD |
 Description: IC FPGA 468 I/O 784FCBGAPackaging: Bulk Package / Case: 784-BFBGA, FCCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 444343 Supplier Device Package: 784-FCCSPBGA (23x23) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Number of I/O: 468 DigiKey Programmable: Not Verified |
auf Bestellung 167 Stücke: Lieferzeit 10-14 Tag (e) |
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Hersteller: AMD
Description: IC FPGA 468 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 784-FCCSPBGA (23x23)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 468
DigiKey Programmable: Not Verified
Description: IC FPGA 468 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 784-FCCSPBGA (23x23)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 468
DigiKey Programmable: Not Verified
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 3590.84 EUR |