Technische Details XCKU3P-1SFVB784I AMD / Xilinx
Description: IC FPGA 256 I/O 784FCBGA, Packaging: Tray, Package / Case: 784-BFBGA, FCBGA, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 100°C (TJ), Voltage - Supply: 0.825V ~ 0.876V, Number of Logic Elements/Cells: 355950, Supplier Device Package: 784-FCBGA (23x23), Number of LABs/CLBs: 20340, Total RAM Bits: 31641600, Number of I/O: 256, DigiKey Programmable: Not Verified.
Weitere Produktangebote XCKU3P-1SFVB784I
| Foto | Bezeichnung | Hersteller | Beschreibung |
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XCKU3P-1SFVB784I | AMD |
Description: IC FPGA 256 I/O 784FCBGAPackaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 256 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| XCKU3P-1SFVB784I |
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Hersteller: AMD
Description: IC FPGA 256 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC FPGA 256 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH


