Technische Details XCV1000E-7FG860C XILINX
Description: IC FPGA 660 I/O 860FBGA, Packaging: Tray, Package / Case: 860-BGA Exposed Pad, Mounting Type: Surface Mount, Number of Gates: 1569178, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 1.71V ~ 1.89V, Number of Logic Elements/Cells: 27648, Supplier Device Package: 860-FBGA (42.5x42.5), Number of LABs/CLBs: 6144, Total RAM Bits: 393216, Number of I/O: 660, DigiKey Programmable: Not Verified.
Weitere Produktangebote XCV1000E-7FG860C
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| XCV1000E-7FG860C | Hersteller : AMD |
 Description: IC FPGA 660 I/O 860FBGAPackaging: Tray Package / Case: 860-BGA Exposed Pad Mounting Type: Surface Mount Number of Gates: 1569178 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.71V ~ 1.89V Number of Logic Elements/Cells: 27648 Supplier Device Package: 860-FBGA (42.5x42.5) Number of LABs/CLBs: 6144 Total RAM Bits: 393216 Number of I/O: 660 DigiKey Programmable: Not Verified |
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