Technische Details XCV150-6FG456C Xilinx
Description: IC FPGA 260 I/O 456FBGA, Voltage - Supply: 2.375V ~ 2.625V, Operating Temperature: 0°C ~ 85°C (TJ), Number of Gates: 164674, Mounting Type: Surface Mount, Package / Case: 456-BBGA, Packaging: Tray, DigiKey Programmable: Not Verified, Number of I/O: 260, Total RAM Bits: 49152, Number of LABs/CLBs: 864, Supplier Device Package: 456-FBGA (23x23), Number of Logic Elements/Cells: 3888.
Weitere Produktangebote XCV150-6FG456C
| Foto | Bezeichnung | Hersteller | Beschreibung |
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XCV150-6FG456C | AMD |
 Description: IC FPGA 260 I/O 456FBGAVoltage - Supply: 2.375V ~ 2.625V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 164674 Mounting Type: Surface Mount Package / Case: 456-BBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 260 Total RAM Bits: 49152 Number of LABs/CLBs: 864 Supplier Device Package: 456-FBGA (23x23) Number of Logic Elements/Cells: 3888 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| XCV150-6FG456C |
|
Hersteller: AMD
Description: IC FPGA 260 I/O 456FBGA
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 164674
Mounting Type: Surface Mount
Package / Case: 456-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 260
Total RAM Bits: 49152
Number of LABs/CLBs: 864
Supplier Device Package: 456-FBGA (23x23)
Number of Logic Elements/Cells: 3888
Description: IC FPGA 260 I/O 456FBGA
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 164674
Mounting Type: Surface Mount
Package / Case: 456-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 260
Total RAM Bits: 49152
Number of LABs/CLBs: 864
Supplier Device Package: 456-FBGA (23x23)
Number of Logic Elements/Cells: 3888
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH