Technische Details XCV300-4BG352I XILINX
Description: IC FPGA 260 I/O 352MBGA, Packaging: Tray, Package / Case: 352-LBGA Exposed Pad, Metal, Mounting Type: Surface Mount, Number of Gates: 322970, Operating Temperature: -40°C ~ 100°C (TJ), Voltage - Supply: 2.375V ~ 2.625V, Number of Logic Elements/Cells: 6912, Supplier Device Package: 352-MBGA (35x35), Number of LABs/CLBs: 1536, Total RAM Bits: 65536, Number of I/O: 260, DigiKey Programmable: Not Verified.
Weitere Produktangebote XCV300-4BG352I
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| XCV3004BG352I | Hersteller : XILINX |
auf Bestellung 142 Stücke: Lieferzeit 21-28 Tag (e) |
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| XCV300-4BG352I | Hersteller : AMD |
 Description: IC FPGA 260 I/O 352MBGAPackaging: Tray Package / Case: 352-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 322970 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 6912 Supplier Device Package: 352-MBGA (35x35) Number of LABs/CLBs: 1536 Total RAM Bits: 65536 Number of I/O: 260 DigiKey Programmable: Not Verified |
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