Technische Details XPC8260CZUHFBC FREESCALE
Description: IC MPU MPC82XX 166MHZ 480TBGA, Packaging: Tray, Package / Case: 480-LBGA Exposed Pad, Mounting Type: Surface Mount, Speed: 166MHz, Operating Temperature: -40°C ~ 105°C (TA), Core Processor: PowerPC G2, Voltage - I/O: 3.3V, Supplier Device Package: 480-TBGA (37.5x37.5), Ethernet: 10/100Mbps (3), Number of Cores/Bus Width: 1 Core, 32-Bit, Co-Processors/DSP: Communications; RISC CPM, RAM Controllers: DRAM, SDRAM, Graphics Acceleration: No, Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART.
Weitere Produktangebote XPC8260CZUHFBC
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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XPC8260CZUHFBC | NXP USA Inc. |
 Description: IC MPU MPC82XX 166MHZ 480TBGAPackaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 166MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
 |
XPC8260CZUHFBC | NXP Semiconductors |
Microprocessors - MPU POWERQUICC II HIP3 REV C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| XPC8260CZUHFBC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 166MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 166MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XPC8260CZUHFBC |
|
Hersteller: NXP Semiconductors
Microprocessors - MPU POWERQUICC II HIP3 REV C
Microprocessors - MPU POWERQUICC II HIP3 REV C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH