XR2A-0825 Omron Electronics Inc-EMC Div
Hersteller: Omron Electronics Inc-EMC DivDescription: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 183 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 5.43 EUR |
| 10+ | 4.73 EUR |
| 25+ | 4.53 EUR |
| 50+ | 4.43 EUR |
| 100+ | 4.23 EUR |
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Technische Details XR2A-0825 Omron Electronics Inc-EMC Div
Description: CONN IC DIP SOCKET 8POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote XR2A-0825
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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XR2A-0825 | Hersteller : Omron Electronics |
IC & Component Sockets IC Socket |
Produkt ist nicht verfügbar |