XR2C-3205 OMRON
Hersteller: OMRON
Category: Precision sockets
Description: Socket: integrated circuits; 2.54mm; closed; THT; gold-plated
Type of Socket: integrated circuits
Terminal pitch: 2.54mm
Connector variant: closed
Electrical mounting: THT
Contact plating: gold-plated
Contact material: beryllium copper
Max. contact resistance:: 20mΩ
Flammability rating: UL94V-0
Max. operating current: 1A
Produktrezensionen
Produktbewertung abgeben
Technische Details XR2C-3205 OMRON
Description: CONN SOCKET SIP 32POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 32 (1 x 32), Operating Temperature: -55°C ~ 125°C, Type: SIP, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote XR2C-3205 nach Preis ab 8.63 EUR bis 10.36 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XR2C-3205 | Omron Electronics Inc-EMC Div |
Description: CONN SOCKET SIP 32POS GOLD Part Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (1 x 32) Operating Temperature: -55°C ~ 125°C Type: SIP Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
auf Bestellung 95 Stücke: Lieferzeit 10-14 Tag (e) |
|
| XR2C-3205 |
|
Hersteller: Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 32POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (1 x 32)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN SOCKET SIP 32POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (1 x 32)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 95 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.36 EUR |
| 10+ | 9.37 EUR |
| 25+ | 8.75 EUR |
| 50+ | 8.63 EUR |