Hersteller: WAGO Corporation
Description: 1-CONDUCTOR THR FEMALE HEADER; 1
Features: Push Button Actuated
Packaging: Box
Color: Gray
Mounting Type: Through Hole
Number of Positions: 10
Pitch: 0.138" (3.50mm)
Type: Header, Female Sockets
Operating Temperature: -60°C ~ 100°C
Termination Style: Solder
Current - IEC: 10A
Number of Levels: 1
Wire Gauge or Range - AWG: 14-24 AWG
Wire Gauge or Range - mm²: 0.2-1.5mm²
Positions Per Level: 10
Header Orientation: 90°, Right Angle
Contact Mating Finish: Tin
Current - UL: 10 A
Voltage - IEC: 320 V
Voltage - UL: 300 V

Hersteller: LeaderTech
EMI Gaskets, Sheets, Absorbers & Shielding 50-CBSA-2.5X3.75X0.50--50S28--Circuit Board Shield--Formed Fence and Cover--Assembled

Hersteller: LMB / Heeger
Racks & Rack Cabinet Accessories Chassis Only D W H 5 x 5 x 3

Hersteller: LMB / Heeger
Racks & Rack Cabinet Accessories Perforated Cap Cover Chassis D W H 5 x 5 x 3

Hersteller: LMB / Heeger
Enclosures, Boxes & Cases CHASSIS BOX W/COVER

Hersteller: LMB / Heeger
Racks & Rack Cabinets Small Cabinet N Series D W H 5 x 5 x 5

Hersteller: LMB / Heeger
Racks & Rack Cabinets Small Cabinet N Series D W H 5 x 5 x 5

Hersteller: J.S.T. Deutschland GmbH
Conn Shrouded Header HDR 10 POS 2mm Solder ST Thru-Hole Box

Hersteller: Qualcomm (RF front-end (RFFE) filters)
Description: SAW RES 423.2200MHZ SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, No Lead
Size / Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Mounting Type: Surface Mount
Insertion Loss: 1.2dB
Frequency - Center: 423.22MHz
Height (Max): 0.053" (1.35mm)
Part Status: Obsolete

Hersteller: Qualcomm (RF front-end (RFFE) filters)
Description: SAW RES 423.2200MHZ SMD
Packaging: Cut Tape (CT)
Package / Case: 8-SMD, No Lead
Size / Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Mounting Type: Surface Mount
Insertion Loss: 1.2dB
Frequency - Center: 423.22MHz
Height (Max): 0.053" (1.35mm)
Part Status: Obsolete

Hersteller: ITT Cannon, LLC
Description: CONN PLUG HSNG MALE 22POS INLINE
Features: Backshell, Coupling Nut
Packaging: Bulk
Connector Type: Plug Housing
Mounting Type: Free Hanging (In-Line)
Shielding: Unshielded
Number of Positions: 22
Type: For Male Pins
Orientation: N (Normal)
Shell Size - Insert: 28-11
Contact Type: Crimp
Fastening Type: Reverse Bayonet Lock
Ingress Protection: IP67 - Dust Tight, Waterproof
Contact Size: 12 (4), 16 (18)
Housing Color: Olive Drab
Shell Material: Aluminum Alloy
Shell Finish: Chromate over Cadmium
Qualification: MIL-DTL-5015

Hersteller: ITT Cannon
Circular MIL Spec Connector

Hersteller: Siemens
Description: CONTACTOR,LIGHTING,20A,10-POLE,O
Features: Auxiliary Contacts
Packaging: Box
Mounting Type: Chassis Mount
Coil Voltage: 110 ~ 120VAC
Termination Style: Screw Terminal
Contact Form: 10PST-NO (10 Form A)
Contact Rating (Current): 20 A
Switching Voltage: 600VAC - Max

Hersteller: Hirose Electric Co Ltd
Description: CONN HEADER SMD 8POS 2MM
Features: Board Guide, Solder Retention
Packaging: Tube
Connector Type: Header
Voltage Rating: 250VAC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 8
Number of Rows: 1
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Beige
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Contact Shape: Circular
Insulation Height: 0.232" (5.90mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon

Hersteller: 3M
Description: CONN DIN PLUG 48POS PCB RA GOLD
Features: Board Lock
Packaging: Bulk
Connector Type: Plug, Male Pins
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 48
Pitch: 0.100" (2.54mm)
Style: C/2 (1/2 C)
Number of Positions Loaded: 32
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 3

Hersteller: Hirose Electric Co Ltd
Description: CONN FFC FPC TOP 18POS 0.5MM R/A
Packaging: Tape & Reel (TR)
Features: Zero Insertion Force (ZIF)
Contact Finish: Gold
Voltage Rating: 50V
Mounting Type: Surface Mount, Right Angle
Number of Positions: 18
Pitch: 0.020" (0.50mm)
Operating Temperature: -40°C ~ 85°C
Termination: Solder
Height Above Board: 0.079" (2.00mm)
Locking Feature: Flip Lock
Material Flammability Rating: UL94 V-0
Actuator Material: Polyphenylene Sulfide (PPS)
Contact Material: Phosphor Bronze
FFC, FCB Thickness: 0.30mm
Housing Material: Polyamide (PA), Nylon
Cable End Type: Straight
Flat Flex Type: FFC, FPC
Connector/Contact Type: Contacts, Top
Part Status: Active

Hersteller: NXP Semiconductors
MCU 32-bit ARM Cortex M4F RISC 512KB Flash 3.3V/5V Automotive 64-Pin QFP Tray

Hersteller: NXP Semiconductors
MCU 32-bit ARM Cortex M4F RISC 1MB Flash 3.3V/5V Automotive 100-Pin LQFP T/R

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified

Hersteller: NXP Semiconductors
MCU 32-bit ARM Cortex M4F RISC 1MB Flash 3.3V/5V Automotive 100-Pin LQFP Tray

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified

Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU S32K146, M4F, Flash 1M, RAM 128KB

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified

Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU S32K146 32-bit MCU, ARM Cortex-M4F

Hersteller: NXP Semiconductors
MCU 32-bit ARM Cortex M4F RISC 2MB Flash 3.3V/5V Automotive 144-Pin LQFP Tray

Hersteller: NXP Semiconductors
MCU 32-bit ARM Cortex M4F RISC 2MB Flash 3.3V/5V Automotive 100-Pin LBGA Tray

Hersteller: Hongfa
45375590091

Hersteller: Hongfa
45375590048

Hersteller: Infineon Technologies
AUTOMOTIVE_COOLMOS

Hersteller: Infineon Technologies
Description: AUTOMOTIVE_COOLMOS
Packaging: Tape & Reel (TR)
Package / Case: 22-PowerBSOP Module
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 136A (Tc)
Rds On (Max) @ Id, Vgs: 17mOhm @ 61.6A, 10V
Power Dissipation (Max): 694W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 3.08mA
Supplier Device Package: PG-HDSOP-22-1
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 236 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 12338 pF @ 400 V
Grade: Automotive
Qualification: AEC-Q101

Hersteller: Infineon Technologies
Description: AUTOMOTIVE_COOLMOS
Packaging: Cut Tape (CT)
Package / Case: 22-PowerBSOP Module
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 136A (Tc)
Rds On (Max) @ Id, Vgs: 17mOhm @ 61.6A, 10V
Power Dissipation (Max): 694W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 3.08mA
Supplier Device Package: PG-HDSOP-22-1
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 236 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 12338 pF @ 400 V
Qualification: AEC-Q101

Hersteller: Infineon Technologies
Trans IGBT Chip N-CH 1200V 130A 469000mW 3-Pin(3+Tab) TO-247AD Tube

Hersteller: ams-OSRAM USA INC.
Description: LED OSLON SIGNAL RED 625NM SMD
Packaging: Tape & Reel (TR)
Package / Case: 1212 (3030 Metric)
Color: Red
Wavelength: 625nm (Typ)
Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Mounting Type: Surface Mount
Voltage - Forward (Vf) (Typ): 2.15V
Current - Test: 350mA
Viewing Angle: 125°
Current - Max: 1A
Supplier Device Package: SMD
Lumens/Watt @ Current - Test: 77 lm/W
Height - Seated (Max): 0.072" (1.82mm)
Temperature - Test: 25°C
Luminous Flux @ Current/Temperature: 58lm (Typ)

Hersteller: NXP Semiconductors
Application Processors -0.3V to 3.6V 40-Pin HVQFN EP Tray

Hersteller: NXP Semiconductors
MCU 16-bit HCS12 CISC 64KB Flash 2.5V/5V Automotive 112-Pin LQFP Tray

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified

Hersteller: NXP Semiconductors
SOC ARM Cortex A53/ARM Cortex M4 485-Pin LFBGA Tray

Hersteller: NXP Semiconductors
MCU 32-bit ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 144-Pin MAP-BGA Tray

Hersteller: NXP Semiconductors
MPU PowerQUICC II MPC82xx Processor RISC 32bit 0.13um 400MHz 3.3V 516-Pin TEBGA Tray

Hersteller: NXP Semiconductors
MPU PowerQUICC II Pro MPC8306 Processor RISC 32bit 0.09um 266MHz 56V 369-Pin MAP-BGA Tray

Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM

Hersteller: STMicroelectronics
Description: MODULE SCR BACK TO BACK ISOTOP
Packaging: Tube
Package / Case: ISOTOP
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Structure: 1-Phase Controller - All SCRs
Current - Hold (Ih) (Max): 80 mA
Current - Gate Trigger (Igt) (Max): 50 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 600A, 630A
Number of SCRs, Diodes: 2 SCRs
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 70 A
Voltage - Off State: 800 V

Hersteller: NXP Semiconductors
Multi-Coil Wireless Charging Transmitter ICs

Hersteller: NXP USA Inc.
Description: 5W MULTI-COIL CONS QFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive

Hersteller: NXP Semiconductors
Wireless Charging ICs 32bit,64k Flash,IFR pgm

Hersteller: Infineon Technologies
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 128M-bit 128M/64M/32M x 1/2-bit/4-bit 8ns Automotive AEC-Q100 16-Pin SOIC W T/R

Hersteller: Panduit Corp
Description: COPPER PATCH CORD, CAT 6A, GREEN
Packaging: Bulk
Features: Latch Lock, Molded Plugs
Connector Type: Plug to Plug
Color: Green
Mounting Type: Free Hanging (In-Line)
Length: 10.00' (3.05m)
Shielding: Shielded
Style: Cat6a LSZH Environmental
Number of Positions/Contacts: 8p8c (RJ45, Ethernet)
Cable Type: Round Cable

Hersteller: TDK Corporation
Description: FIXED IND 680UH 320MA 1.5 OHM TH
Packaging: Cut Tape (CT)
Tolerance: ±10%
Package / Case: Radial, Vertical Cylinder
Size / Dimension: 0.335" Dia (8.50mm)
Mounting Type: Through Hole
Shielding: Unshielded
Operating Temperature: -20°C ~ 85°C
DC Resistance (DCR): 1.5Ohm Max
Q @ Freq: 15 @ 796kHz
Frequency - Self Resonant: 1.6MHz
Current - Saturation (Isat): 320mA
Inductance Frequency - Test: 1 kHz
Height - Seated (Max): 0.346" (8.80mm)
Part Status: Obsolete
Inductance: 680 µH
Current Rating (Amps): 320 mA

Hersteller: TDK Corporation
Description: FIXED IND 680UH 320MA 1.5 OHM TH
Packaging: Tape & Box (TB)
Tolerance: ±10%
Package / Case: Radial, Vertical Cylinder
Size / Dimension: 0.335" Dia (8.50mm)
Mounting Type: Through Hole
Shielding: Unshielded
Operating Temperature: -20°C ~ 85°C
DC Resistance (DCR): 1.5Ohm Max
Q @ Freq: 15 @ 796kHz
Frequency - Self Resonant: 1.6MHz
Current - Saturation (Isat): 320mA
Inductance Frequency - Test: 1 kHz
Height - Seated (Max): 0.346" (8.80mm)
Part Status: Obsolete
Inductance: 680 µH
Current Rating (Amps): 320 mA

Hersteller: TE Connectivity / Raychem
Circular MIL Spec Strain Reliefs & Adapters TX41AC00-2012

Hersteller: TE Connectivity AMP Connectors
Description: CONN BCK ADPT SZ20 21 1 3/16-18
Packaging: Bulk
Features: Tinel Lock
Color: Silver
Material: Aluminum Alloy
Shielding: Unshielded
Thread Size: 1 3/16-18 UNEF
Type: Backshell, Heat Shrink Adapter
Shell Size - Insert: 20, 21
Cable Exit: 180°
Plating: Electroless Nickel
Diameter - Outside: 1.468" (37.29mm)