Suchergebnisse für "935332" : 95
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Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
MCIMX6U6AVM10AC | NXP Semiconductors | SOC i.MX 6DualLite ARMCortex A9 40nm Automotive AEC-Q100 624-Pin LFBGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6U6AVM10AC | NXP Semiconductors | Processors - Application Specialised i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 800 MHz, MAPBGA 624 |
Produkt ist nicht verfügbar |
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MCIMX6U6AVM10ACR | NXP Semiconductors | Processors - Application Specialised i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 800 MHz, MAPBGA 624 |
Produkt ist nicht verfügbar |
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MCIMX6Y0CVM05AA | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active Additional Interfaces: I2C, SPI, UART |
Produkt ist nicht verfügbar |
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MCIMX6Y0CVM05AA | NXP Semiconductors | SOC i.MX 6ULL ARM Cortex A7 40nm 289-Pin LFBGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6Y0DVM05AA | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Additional Interfaces: I2C, SPI, UART Part Status: Active |
Produkt ist nicht verfügbar |
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MCIMX6Y0DVM05AA | NXP Semiconductors | SOC i.MX 6ULL ARM Cortex A7 40nm 289-Pin MAP-BGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6Y1DVK05AA | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 272MAPBGA Packaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Additional Interfaces: CAN, I2C, SPI, UART |
Produkt ist nicht verfügbar |
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MCIMX6Y1DVK05AA | NXP Semiconductors | SOC i.MX 6ULL ARM Cortex A7 40nm 272-Pin MAP-BGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6Y1DVK05AA | NXP Semiconductors | Processors - Application Specialised 528MHz,Ethernet x1, USB OTG x1, ADC x1, UART x4, SAI x1 ,ESAI x1, Timer x2, PWM x4, I2C x2, SPI x2 |
Produkt ist nicht verfügbar |
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PCA9540BDP/Q900J | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 8TSSOP Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 2.3V ~ 5.5V Applications: 2-Channel I2C Multiplexer Supplier Device Package: 8-TSSOP Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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S9S12ZVLS1F0MFM | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 19 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12ZVLS1F0MFM | NXP Semiconductors | MagniV 16-bit S12Zcore Microcontroller |
Produkt ist nicht verfügbar |
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S9S12ZVLS1F0MFM | NXP Semiconductors | 16-bit Microcontrollers - MCU MagniV 16-bit MCU, S12Z core, 16KB Flash, 25MHz, -40/+125degC, Automotive Qualified, QFN 32 |
Produkt ist nicht verfügbar |
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SP5746CHK1AMKU6R | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SP5746CHK1AMKU6R | NXP Semiconductors | MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 176-Pin LQFP EP T/R |
Produkt ist nicht verfügbar |
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SP5746CHK1AMKU6R | NXP Semiconductors | 32-bit Microcontrollers - MCU 32 Bit,DUAL CORE,3M FLASH,512K RAM, HSM, CAN FD |
Produkt ist nicht verfügbar |
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SP5746CHK1AMMH6R | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA Packaging: Tape & Reel (TR) Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SP5746CHK1AMMH6R | NXP Semiconductors | MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 100-Pin MAP-BGA T/R |
Produkt ist nicht verfügbar |
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SP5746CHK1AMMH6R | NXP Semiconductors | 32-bit Microcontrollers - MCU 32 Bit, DUAL CORE, 3M FLASH, 512K RAM, HSM, CAN FD |
Produkt ist nicht verfügbar |
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SP5746CHK1AMMJ6R | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SP5746CHK1AMMJ6R | NXP Semiconductors | MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V 256-Pin MAP-BGA T/R Automotive AEC-Q100 |
Produkt ist nicht verfügbar |
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SP5746CHK1AMMJ6R | NXP Semiconductors | 32-bit Microcontrollers - MCU 32 Bit, DUAL CORE, 3M FLASH, 512K RAM, HSM, CAN FD |
Produkt ist nicht verfügbar |
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SPC5602BK0CLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5602BK0CLL4 | NXP Semiconductors | 32-bit Microcontrollers - MCU NXP 32-bit MCU, Power Arch core, 256KB Flash, 48MHz, -40/+85degC, Automotive Grade, QFP 100 |
Produkt ist nicht verfügbar |
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SPC5746CHK1AMKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5746CHK1AMKU6 | NXP Semiconductors | MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 176-Pin LQFP EP Tray |
Produkt ist nicht verfügbar |
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SPC5746CHK1AMKU6 | NXP Semiconductors | 32-bit Microcontrollers - MCU 32 Bit,DUAL CORE,3M FLASH,512K RAM, HSM, CAN FD |
Produkt ist nicht verfügbar |
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SPC5746CHK1AMMH6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA Packaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5746CHK1AMMH6 | NXP Semiconductors | MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 100-Pin LBGA Tray |
Produkt ist nicht verfügbar |
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SPC5746CHK1AMMH6 | NXP Semiconductors | 32-bit Microcontrollers - MCU 32 Bit, DUAL CORE, 3M FLASH, 512K RAM, HSM, CAN FD |
Produkt ist nicht verfügbar |
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SPC5746CHK1AMMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5746CHK1AMMJ6 | NXP Semiconductors | MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 256-Pin MAP-BGA Tray |
Produkt ist nicht verfügbar |
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SPC5746CHK1AMMJ6 | NXP Semiconductors | 32-bit Microcontrollers - MCU 32 Bit, DUAL CORE, 3M FLASH, 512K RAM, HSM, CAN FD |
Produkt ist nicht verfügbar |
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SVF311R3K2CKU2 | NXP Semiconductors | Microprocessors - MPU Vybrid R 32-bit MPU, ARM Cortex-A5 core, ARM Cortex-M4 core, QFP 176 |
Produkt ist nicht verfügbar |
MCIMX6U6AVM10AC |
Hersteller: NXP Semiconductors
SOC i.MX 6DualLite ARMCortex A9 40nm Automotive AEC-Q100 624-Pin LFBGA Tray
SOC i.MX 6DualLite ARMCortex A9 40nm Automotive AEC-Q100 624-Pin LFBGA Tray
Produkt ist nicht verfügbar
MCIMX6U6AVM10AC |
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 800 MHz, MAPBGA 624
Processors - Application Specialised i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 800 MHz, MAPBGA 624
Produkt ist nicht verfügbar
MCIMX6U6AVM10ACR |
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 800 MHz, MAPBGA 624
Processors - Application Specialised i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 800 MHz, MAPBGA 624
Produkt ist nicht verfügbar
MCIMX6Y0CVM05AA |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, SPI, UART
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, SPI, UART
Produkt ist nicht verfügbar
MCIMX6Y0CVM05AA |
Hersteller: NXP Semiconductors
SOC i.MX 6ULL ARM Cortex A7 40nm 289-Pin LFBGA Tray
SOC i.MX 6ULL ARM Cortex A7 40nm 289-Pin LFBGA Tray
Produkt ist nicht verfügbar
MCIMX6Y0DVM05AA |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: I2C, SPI, UART
Part Status: Active
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
MCIMX6Y0DVM05AA |
Hersteller: NXP Semiconductors
SOC i.MX 6ULL ARM Cortex A7 40nm 289-Pin MAP-BGA Tray
SOC i.MX 6ULL ARM Cortex A7 40nm 289-Pin MAP-BGA Tray
Produkt ist nicht verfügbar
MCIMX6Y1DVK05AA |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Produkt ist nicht verfügbar
MCIMX6Y1DVK05AA |
Hersteller: NXP Semiconductors
SOC i.MX 6ULL ARM Cortex A7 40nm 272-Pin MAP-BGA Tray
SOC i.MX 6ULL ARM Cortex A7 40nm 272-Pin MAP-BGA Tray
Produkt ist nicht verfügbar
MCIMX6Y1DVK05AA |
Hersteller: NXP Semiconductors
Processors - Application Specialised 528MHz,Ethernet x1, USB OTG x1, ADC x1, UART x4, SAI x1 ,ESAI x1, Timer x2, PWM x4, I2C x2, SPI x2
Processors - Application Specialised 528MHz,Ethernet x1, USB OTG x1, ADC x1, UART x4, SAI x1 ,ESAI x1, Timer x2, PWM x4, I2C x2, SPI x2
Produkt ist nicht verfügbar
PCA9540BDP/Q900J |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC INTERFACE SPECIALIZED 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 8-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S9S12ZVLS1F0MFM |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12ZVLS1F0MFM |
Hersteller: NXP Semiconductors
MagniV 16-bit S12Zcore Microcontroller
MagniV 16-bit S12Zcore Microcontroller
Produkt ist nicht verfügbar
S9S12ZVLS1F0MFM |
Hersteller: NXP Semiconductors
16-bit Microcontrollers - MCU MagniV 16-bit MCU, S12Z core, 16KB Flash, 25MHz, -40/+125degC, Automotive Qualified, QFN 32
16-bit Microcontrollers - MCU MagniV 16-bit MCU, S12Z core, 16KB Flash, 25MHz, -40/+125degC, Automotive Qualified, QFN 32
Produkt ist nicht verfügbar
SP5746CHK1AMKU6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SP5746CHK1AMKU6R |
Hersteller: NXP Semiconductors
MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 176-Pin LQFP EP T/R
MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 176-Pin LQFP EP T/R
Produkt ist nicht verfügbar
SP5746CHK1AMKU6R |
Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 32 Bit,DUAL CORE,3M FLASH,512K RAM, HSM, CAN FD
32-bit Microcontrollers - MCU 32 Bit,DUAL CORE,3M FLASH,512K RAM, HSM, CAN FD
Produkt ist nicht verfügbar
SP5746CHK1AMMH6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SP5746CHK1AMMH6R |
Hersteller: NXP Semiconductors
MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 100-Pin MAP-BGA T/R
MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 100-Pin MAP-BGA T/R
Produkt ist nicht verfügbar
SP5746CHK1AMMH6R |
Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 32 Bit, DUAL CORE, 3M FLASH, 512K RAM, HSM, CAN FD
32-bit Microcontrollers - MCU 32 Bit, DUAL CORE, 3M FLASH, 512K RAM, HSM, CAN FD
Produkt ist nicht verfügbar
SP5746CHK1AMMJ6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SP5746CHK1AMMJ6R |
Hersteller: NXP Semiconductors
MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V 256-Pin MAP-BGA T/R Automotive AEC-Q100
MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V 256-Pin MAP-BGA T/R Automotive AEC-Q100
Produkt ist nicht verfügbar
SP5746CHK1AMMJ6R |
Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 32 Bit, DUAL CORE, 3M FLASH, 512K RAM, HSM, CAN FD
32-bit Microcontrollers - MCU 32 Bit, DUAL CORE, 3M FLASH, 512K RAM, HSM, CAN FD
Produkt ist nicht verfügbar
SPC5602BK0CLL4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5602BK0CLL4 |
Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU NXP 32-bit MCU, Power Arch core, 256KB Flash, 48MHz, -40/+85degC, Automotive Grade, QFP 100
32-bit Microcontrollers - MCU NXP 32-bit MCU, Power Arch core, 256KB Flash, 48MHz, -40/+85degC, Automotive Grade, QFP 100
Produkt ist nicht verfügbar
SPC5746CHK1AMKU6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5746CHK1AMKU6 |
Hersteller: NXP Semiconductors
MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 176-Pin LQFP EP Tray
MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 176-Pin LQFP EP Tray
Produkt ist nicht verfügbar
SPC5746CHK1AMKU6 |
Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 32 Bit,DUAL CORE,3M FLASH,512K RAM, HSM, CAN FD
32-bit Microcontrollers - MCU 32 Bit,DUAL CORE,3M FLASH,512K RAM, HSM, CAN FD
Produkt ist nicht verfügbar
SPC5746CHK1AMMH6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5746CHK1AMMH6 |
Hersteller: NXP Semiconductors
MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 100-Pin LBGA Tray
MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 100-Pin LBGA Tray
Produkt ist nicht verfügbar
SPC5746CHK1AMMH6 |
Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 32 Bit, DUAL CORE, 3M FLASH, 512K RAM, HSM, CAN FD
32-bit Microcontrollers - MCU 32 Bit, DUAL CORE, 3M FLASH, 512K RAM, HSM, CAN FD
Produkt ist nicht verfügbar
SPC5746CHK1AMMJ6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5746CHK1AMMJ6 |
Hersteller: NXP Semiconductors
MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 256-Pin MAP-BGA Tray
MCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V Automotive 256-Pin MAP-BGA Tray
Produkt ist nicht verfügbar
SPC5746CHK1AMMJ6 |
Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 32 Bit, DUAL CORE, 3M FLASH, 512K RAM, HSM, CAN FD
32-bit Microcontrollers - MCU 32 Bit, DUAL CORE, 3M FLASH, 512K RAM, HSM, CAN FD
Produkt ist nicht verfügbar
SVF311R3K2CKU2 |
Hersteller: NXP Semiconductors
Microprocessors - MPU Vybrid R 32-bit MPU, ARM Cortex-A5 core, ARM Cortex-M4 core, QFP 176
Microprocessors - MPU Vybrid R 32-bit MPU, ARM Cortex-A5 core, ARM Cortex-M4 core, QFP 176
Produkt ist nicht verfügbar
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