SP5746CHK1AMMJ6R NXP Semiconductors
Hersteller: NXP SemiconductorsMCU 32-bit e200z2/e200z4 RISC 3MB Flash 5V 256-Pin MAP-BGA T/R Automotive AEC-Q100
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Technische Details SP5746CHK1AMMJ6R NXP Semiconductors
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA, Packaging: Tape & Reel (TR), Package / Case: 256-LBGA, Mounting Type: Surface Mount, Speed: 80MHz/160MHz, Program Memory Size: 3MB (3M x 8), RAM Size: 512K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: e200z2, e200z4, Data Converters: A/D 80x10b, 64x12b, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG, Peripherals: DMA, LVD, POR, WDT, Supplier Device Package: 256-MAPPBGA (17x17), Number of I/O: 178, DigiKey Programmable: Not Verified.
Weitere Produktangebote SP5746CHK1AMMJ6R
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SP5746CHK1AMMJ6R | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SP5746CHK1AMMJ6R | Hersteller : NXP Semiconductors |
32-bit Microcontrollers - MCU 32 Bit, DUAL CORE, 3M FLASH, 512K RAM, HSM, CAN FD |
Produkt ist nicht verfügbar |