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STM1001TWX6F/BKN STMicroelectronics Description: STM1001TWX6F/BKN
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ST25DV16KC-IE6S3 ST25DV16KC-IE6S3 STMicroelectronics st25dv04kc.pdf Description: DYNAMIC NFC/RFID TAG IC WITH 16-
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Part Status: Active
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ST25DV16KC-IE6S3 ST25DV16KC-IE6S3 STMicroelectronics st25dv04kc.pdf Description: DYNAMIC NFC/RFID TAG IC WITH 16-
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Part Status: Active
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ST25DV16KC-IE6T3 ST25DV16KC-IE6T3 STMicroelectronics st25dv04kc.pdf Description: DYNAMIC NFC/RFID TAG IC WITH 16-
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-TSSOP
Part Status: Active
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ST25DV16KC-IE6T3 ST25DV16KC-IE6T3 STMicroelectronics st25dv04kc.pdf Description: DYNAMIC NFC/RFID TAG IC WITH 16-
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-TSSOP
Part Status: Active
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12+1.53 EUR
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250+1.38 EUR
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ST25DV16KC-IE8T3 ST25DV16KC-IE8T3 STMicroelectronics st25dv04kc.pdf Description: DYNAMIC NFC/RFID TAG IC WITH 16-
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-TSSOP
Part Status: Active
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ST25DV16KC-IE8T3 ST25DV16KC-IE8T3 STMicroelectronics st25dv04kc.pdf Description: DYNAMIC NFC/RFID TAG IC WITH 16-
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-TSSOP
Part Status: Active
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ACST12-7ST ACST12-7ST STMicroelectronics acst12.pdf Description: TRIAC SENS GATE 700V 12A TO220
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Hold (Ih) (Max): 30 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 120A, 126A
Voltage - Gate Trigger (Vgt) (Max): 1 V
Supplier Device Package: TO-220
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 700 V
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ACST12-7CT ACST12-7CT STMicroelectronics acst12.pdf Description: TRIAC 700V 12A TO220
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Hold (Ih) (Max): 50 mA
Current - Gate Trigger (Igt) (Max): 35 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 120A, 126A
Voltage - Gate Trigger (Vgt) (Max): 1 V
Supplier Device Package: TO-220
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 700 V
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STP57N65M5 STP57N65M5 STMicroelectronics en.DM00049152.pdf Description: MOSFET N-CH 650V 42A TO220
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 63mOhm @ 21A, 10V
Power Dissipation (Max): 250W (Tc)
Vgs(th) (Max) @ Id: 5V @ 250µA
Supplier Device Package: TO-220
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±25V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 98 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4200 pF @ 100 V
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STH260N6F6-2 STH260N6F6-2 STMicroelectronics en.DM00027880.pdf Description: MOSFET N-CH 60V 180A H2PAK-2
Input Capacitance (Ciss) (Max) @ Vds: 11800 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 183 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: H2Pak-2
Vgs(th) (Max) @ Id: 4V @ 250µA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 2.4mOhm @ 60A, 10V
Current - Continuous Drain (Id) @ 25°C: 180A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
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STH260N6F6-2 STH260N6F6-2 STMicroelectronics en.DM00027880.pdf Description: MOSFET N-CH 60V 180A H2PAK-2
Input Capacitance (Ciss) (Max) @ Vds: 11800 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 183 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: H2Pak-2
Vgs(th) (Max) @ Id: 4V @ 250µA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 2.4mOhm @ 60A, 10V
Current - Continuous Drain (Id) @ 25°C: 180A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Cut Tape (CT)
auf Bestellung 978 Stücke:
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STW60N65M5 STW60N65M5 STMicroelectronics en.CD00291091.pdf Description: MOSFET N-CH 650V 46A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 46A (Tc)
Rds On (Max) @ Id, Vgs: 59mOhm @ 23A, 10V
Power Dissipation (Max): 255W (Tc)
Vgs(th) (Max) @ Id: 5V @ 250µA
Supplier Device Package: TO-247-3
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±25V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 139 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6810 pF @ 100 V
Voltage Coupled to Gate Charge (Qg) (Max) @ Vgs: 10
Voltage Coupled to Input Capacitance (Ciss) (Max) @ Vds: 100
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TSZ124IPT/TH STMicroelectronics Description: TSZ124IPT/TH
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STD2NK90Z-1 STD2NK90Z-1 STMicroelectronics en.CD00043981.pdf Description: MOSFET N-CH 900V 2.1A IPAK
Packaging: Tube
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 2.1A (Tc)
Rds On (Max) @ Id, Vgs: 6.5Ohm @ 1.05A, 10V
Power Dissipation (Max): 70W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 50µA
Supplier Device Package: IPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 27 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 485 pF @ 25 V
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M24C04-FMH6TG M24C04-FMH6TG STMicroelectronics en.DM00071277.pdf Description: IC EEPROM 4KBIT I2C 5UFDFPN
Packaging: Tape & Reel (TR)
Package / Case: 5-UFDFN
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 5-UFDFPN (1.7x1.4)
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
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M24C04-FMH6TG M24C04-FMH6TG STMicroelectronics en.DM00071277.pdf Description: IC EEPROM 4KBIT I2C 5UFDFPN
Packaging: Cut Tape (CT)
Package / Case: 5-UFDFN
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 5-UFDFPN (1.7x1.4)
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
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SPC58NH92C5RMI0X SPC58NH92C5RMI0X STMicroelectronics spc58nh92e7.pdf Description: IC MCU 32BIT 10MB FLASH 386FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 386-FBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 10MB (10M x 8)
RAM Size: 1.0625M x 8
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Data Converters: A/D 100x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: CANbus, eMMC/SD/SDIO, Ethernet, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals: DMA
Supplier Device Package: 386-FPBGA (19x19)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC58NH92C5RMI0X SPC58NH92C5RMI0X STMicroelectronics spc58nh92e7.pdf Description: IC MCU 32BIT 10MB FLASH 386FPBGA
Packaging: Cut Tape (CT)
Package / Case: 386-FBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 10MB (10M x 8)
RAM Size: 1.0625M x 8
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Data Converters: A/D 100x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: CANbus, eMMC/SD/SDIO, Ethernet, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals: DMA
Supplier Device Package: 386-FPBGA (19x19)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC58NH92E7RMI0X SPC58NH92E7RMI0X STMicroelectronics spc58nh92e7.pdf Description: IC MCU 32BIT 10MB FLASH 176ELQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 10MB (10M x 8)
RAM Size: 1.0625M x 8
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Data Converters: A/D 100x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: CANbus, eMMC/SD/SDIO, Ethernet, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals: DMA
Supplier Device Package: 176-eLQFP (24x24)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC58NH92E7RMI0X SPC58NH92E7RMI0X STMicroelectronics spc58nh92e7.pdf Description: IC MCU 32BIT 10MB FLASH 176ELQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 10MB (10M x 8)
RAM Size: 1.0625M x 8
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Data Converters: A/D 100x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: CANbus, eMMC/SD/SDIO, Ethernet, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals: DMA
Supplier Device Package: 176-eLQFP (24x24)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC58NH92C3RMI0X SPC58NH92C3RMI0X STMicroelectronics spc58nh92e7.pdf Description: IC MCU 32BIT 10MB FLASH 302FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 302-FBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 10MB (10M x 8)
RAM Size: 1.0625M x 8
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Data Converters: A/D 100x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: CANbus, eMMC/SD/SDIO, Ethernet, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals: DMA
Supplier Device Package: 302-FPBGA (17x17)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC58NH92C3RMI0X SPC58NH92C3RMI0X STMicroelectronics spc58nh92e7.pdf Description: IC MCU 32BIT 10MB FLASH 302FPBGA
Packaging: Cut Tape (CT)
Package / Case: 302-FBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 10MB (10M x 8)
RAM Size: 1.0625M x 8
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Data Converters: A/D 100x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: CANbus, eMMC/SD/SDIO, Ethernet, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals: DMA
Supplier Device Package: 302-FPBGA (17x17)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC58NH-DISP SPC58NH-DISP STMicroelectronics spc58nh-disp.pdf Description: DISCOVERY KIT FOR SPC58 H LINE
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Board Type: Evaluation Platform
Utilized IC / Part: SPC58NH92C5
Platform: Discovery
Part Status: Active
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VD6283TX-SATEL VD6283TX-SATEL STMicroelectronics vd6283tx-satel.pdf Description: VD6283 BREAKOUT BOARD 6-CHANNEL
Packaging: Bulk
Interface: I2C
Contents: Board(s)
Voltage - Supply: 1.8V ~ 5V
Sensor Type: Light, Ambient
Utilized IC / Part: VD6283
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
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STIPN1M50T-H STIPN1M50T-H STMicroelectronics en.DM00264415.pdf Description: MOSFET IPM 500V 1A 26-PWRDIP MOD
Voltage: 500 V
Current: 1 A
Voltage - Isolation: 1000Vrms
Configuration: 3 Phase Inverter
Type: MOSFET
Mounting Type: Through Hole
Package / Case: 26-PowerDIP Module (0.846", 21.48mm)
Packaging: Tube
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STIPN2M50T-H STIPN2M50T-H STMicroelectronics STIPN2M50T-H_Rev6_Feb2020.pdf Description: POWER DRVR MOD 500V 2A 26DIP MOD
Voltage: 500 V
Current: 2 A
Part Status: Active
Voltage - Isolation: 1000Vrms
Configuration: 3 Phase Inverter
Type: MOSFET
Mounting Type: Through Hole
Package / Case: 26-PowerDIP Module (0.846", 21.48mm)
Packaging: Tube
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STD2NK100Z/BKN STMicroelectronics Description: STD2NK100Z/BKN
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STO65N60DM6 STO65N60DM6 STMicroelectronics sto65n60dm6.pdf Description: N-CHANNEL 600 V, 67 MOHM TYP., 4
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 46A (Tc)
Rds On (Max) @ Id, Vgs: 76mOhm @ 23A, 10V
Power Dissipation (Max): 320W (Tc)
Vgs(th) (Max) @ Id: 4.75V @ 250µA
Supplier Device Package: TOLL (HV)
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±25V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 65.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2500 pF @ 100 V
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STO65N60DM6 STO65N60DM6 STMicroelectronics sto65n60dm6.pdf Description: N-CHANNEL 600 V, 67 MOHM TYP., 4
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 46A (Tc)
Rds On (Max) @ Id, Vgs: 76mOhm @ 23A, 10V
Power Dissipation (Max): 320W (Tc)
Vgs(th) (Max) @ Id: 4.75V @ 250µA
Supplier Device Package: TOLL (HV)
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±25V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 65.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2500 pF @ 100 V
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SPC574S64E3CEFAR SPC574S64E3CEFAR STMicroelectronics spc574s64e3.pdf Description: IC MCU 32BIT 1.5MB FLSH 100ETQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-eTQFP (14x14)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.135V ~ 5.25V
Core Size: 32-Bit Dual-Core
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 140MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
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SPC574S64E3CEFAR SPC574S64E3CEFAR STMicroelectronics spc574s64e3.pdf Description: IC MCU 32BIT 1.5MB FLSH 100ETQFP
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-eTQFP (14x14)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.135V ~ 5.25V
Core Size: 32-Bit Dual-Core
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 140MHz
DigiKey Programmable: Not Verified
Mounting Type: Surface Mount
Package / Case: 100-TQFP Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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SPC574S64E3CEFAY SPC574S64E3CEFAY STMicroelectronics spc574s60e3.pdf Description: IC MCU 32BIT 1.5MB FLSH 100ETQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 140MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.135V ~ 5.25V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-eTQFP (14x14)
Grade: Automotive
Number of I/O: 64
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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STU9N60M2 STU9N60M2 STMicroelectronics en.DM00080324.pdf Description: MOSFET N-CH 600V 5.5A IPAK
Packaging: Tube
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc)
Rds On (Max) @ Id, Vgs: 780mOhm @ 3A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-251 (IPAK)
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±25V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 320 pF @ 100 V
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SPC58EE80E7QMHAY SPC58EE80E7QMHAY STMicroelectronics SPC58EEx%2C_SPC58NEx.pdf Description: IC MCU 32BIT 4MB FLASH 176QFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.2V, 3.3V, 5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA
Supplier Device Package: 176-eLQFP (24x24)
Grade: Automotive
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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AEK-CON-SENSOR1 AEK-CON-SENSOR1 STMicroelectronics aek-con-sensor1.pdf Description: CONNECTOR BOARD FOR SPC5 MCU DIS
Packaging: Bulk
Function: Connector Board
Type: Interface
Contents: Board(s)
Utilized IC / Part: SPC58EC80E5
Part Status: Active
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SPC582B50E1AD00X SPC582B50E1AD00X STMicroelectronics spc582b60e1.pdf Description: IC MCU 32BIT 512KB FLASH 64ETQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 64-eTQFP (10x10)
Grade: Automotive
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC582B50E1AD00X SPC582B50E1AD00X STMicroelectronics spc582b60e1.pdf Description: IC MCU 32BIT 512KB FLASH 64ETQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 64-eTQFP (10x10)
Grade: Automotive
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC58EE84E7QMSAR SPC58EE84E7QMSAR STMicroelectronics spc58ne84c3.pdf Description: IC MCU 32BIT 6MB FLASH 176QFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 608K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.2V, 3.3V, 5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA
Supplier Device Package: 176-eLQFP (24x24)
Grade: Automotive
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC58EE84E7QMSAR SPC58EE84E7QMSAR STMicroelectronics spc58ne84c3.pdf Description: IC MCU 32BIT 6MB FLASH 176QFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 608K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.2V, 3.3V, 5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA
Supplier Device Package: 176-eLQFP (24x24)
Grade: Automotive
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC582B60E1CD00X SPC582B60E1CD00X STMicroelectronics spc582b60e1.pdf Description: IC MCU 32BIT 1MB FLASH 64ETQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 64-eTQFP (10x10)
Grade: Automotive
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC582B60E1CD00X SPC582B60E1CD00X STMicroelectronics spc582b60e1.pdf Description: IC MCU 32BIT 1MB FLASH 64ETQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 64-eTQFP (10x10)
Grade: Automotive
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC58EC80E3QMC0Y SPC58EC80E3QMC0Y STMicroelectronics spc58ec80e3.pdf Description: IC MCU 32BIT 4MB FLASH 100QFP
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SPC582B50E1CG00X SPC582B50E1CG00X STMicroelectronics spc582b60e1.pdf Description: IC MCU 32BIT 512KB FLASH 64ETQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 64-eTQFP (10x10)
Grade: Automotive
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC582B50E1CG00X SPC582B50E1CG00X STMicroelectronics spc582b60e1.pdf Description: IC MCU 32BIT 512KB FLASH 64ETQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 64-eTQFP (10x10)
Grade: Automotive
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC582B50E3CD00X SPC582B50E3CD00X STMicroelectronics spc582b60e1.pdf Description: IC MCU 32BIT 512KB FLSH 100ETQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 100-eTQFP (14x14)
Grade: Automotive
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC582B50E3CD00X SPC582B50E3CD00X STMicroelectronics spc582b60e1.pdf Description: IC MCU 32BIT 512KB FLSH 100ETQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 100-eTQFP (14x14)
Grade: Automotive
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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STM32L4S9VIT6 STM32L4S9VIT6 STMicroelectronics en.DM00366449.pdf Description: IC MCU 32BIT 2MB FLASH 100LQFP
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STM32L4S9ZIJ6TR STM32L4S9ZIJ6TR STMicroelectronics Description: IC MCU 32BIT 2MB FLASH 144UFBGA
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STM32L4S9ZIT6 STM32L4S9ZIT6 STMicroelectronics en.DM00366449.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
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MD2001FX MD2001FX STMicroelectronics en.CD00160932.pdf Description: TRANS NPN 700V 12A ISOWATT-218FX
Packaging: Tube
Package / Case: ISOWATT218FX
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.8V @ 1.5A, 6A
Current - Collector Cutoff (Max): 200µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 4.5 @ 6A, 5V
Supplier Device Package: ISOWATT-218FX
Part Status: Active
Current - Collector (Ic) (Max): 12 A
Voltage - Collector Emitter Breakdown (Max): 700 V
Power - Max: 58 W
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STPSC15H12G2Y-TR STPSC15H12G2Y-TR STMicroelectronics stpsc15h12g2y-tr.pdf Description: DIODE SIL CARB 1.2KV 15A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1200pF @ 0V, 1MHz
Current - Average Rectified (Io): 15A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 90 µA @ 1200 V
Qualification: AEC-Q101
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STPSC15H12G2Y-TR STPSC15H12G2Y-TR STMicroelectronics stpsc15h12g2y-tr.pdf Description: DIODE SIL CARB 1.2KV 15A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1200pF @ 0V, 1MHz
Current - Average Rectified (Io): 15A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 90 µA @ 1200 V
Qualification: AEC-Q101
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STPSC15H12G2-TR STPSC15H12G2-TR STMicroelectronics stpsc15h12g2-tr.pdf Description: DIODE SIC 1.2KV 15A D2PAK HV
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1200pF @ 0V, 1MHz
Current - Average Rectified (Io): 15A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 5 A
Current - Reverse Leakage @ Vr: 90 µA @ 1200 V
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STPSC15H12G2-TR STPSC15H12G2-TR STMicroelectronics stpsc15h12g2-tr.pdf Description: DIODE SIC 1.2KV 15A D2PAK HV
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1200pF @ 0V, 1MHz
Current - Average Rectified (Io): 15A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 5 A
Current - Reverse Leakage @ Vr: 90 µA @ 1200 V
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STPSC20H12G2Y-TR STPSC20H12G2Y-TR STMicroelectronics stpsc20h12-y.pdf Description: DIODE SIC 1.2KV 20A D2PAK HV
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: Zero Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1650pF @ 0V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 20 A
Current - Reverse Leakage @ Vr: 120 µA @ 1200 V
Qualification: AEC-Q101
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STPSC20H12G2Y-TR STPSC20H12G2Y-TR STMicroelectronics stpsc20h12-y.pdf Description: DIODE SIC 1.2KV 20A D2PAK HV
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: Zero Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1650pF @ 0V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 20 A
Current - Reverse Leakage @ Vr: 120 µA @ 1200 V
Qualification: AEC-Q101
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STPSC20H12G2-TR STPSC20H12G2-TR STMicroelectronics stpsc20h12g2-tr.pdf Description: DIODE SIL CARB 1.2KV 20A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1650pF @ 0V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 20 A
Current - Reverse Leakage @ Vr: 120 µA @ 1200 V
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STPSC20H12G2-TR STPSC20H12G2-TR STMicroelectronics stpsc20h12g2-tr.pdf Description: DIODE SIL CARB 1.2KV 20A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1650pF @ 0V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 20 A
Current - Reverse Leakage @ Vr: 120 µA @ 1200 V
auf Bestellung 1000 Stücke:
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L4931ABD50-TR L4931ABD50-TR STMicroelectronics en.CD00000971.pdf Description: IC REG LINEAR 5V 250MA 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 250mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 1 mA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: 8-SOIC
Voltage - Output (Min/Fixed): 5V
Part Status: Active
PSRR: 70dB ~ 55dB (120Hz ~ 10kHz)
Voltage Dropout (Max): 0.8V @ 250mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 6 mA
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STM1001TWX6F/BKN
Hersteller: STMicroelectronics
Description: STM1001TWX6F/BKN
Produkt ist nicht verfügbar
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ST25DV16KC-IE6S3 st25dv04kc.pdf
ST25DV16KC-IE6S3
Hersteller: STMicroelectronics
Description: DYNAMIC NFC/RFID TAG IC WITH 16-
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Part Status: Active
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ST25DV16KC-IE6S3 st25dv04kc.pdf
ST25DV16KC-IE6S3
Hersteller: STMicroelectronics
Description: DYNAMIC NFC/RFID TAG IC WITH 16-
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 2763 Stücke:
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ST25DV16KC-IE6T3 st25dv04kc.pdf
ST25DV16KC-IE6T3
Hersteller: STMicroelectronics
Description: DYNAMIC NFC/RFID TAG IC WITH 16-
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-TSSOP
Part Status: Active
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ST25DV16KC-IE6T3 st25dv04kc.pdf
ST25DV16KC-IE6T3
Hersteller: STMicroelectronics
Description: DYNAMIC NFC/RFID TAG IC WITH 16-
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 3910 Stücke:
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Anzahl Preis
11+1.64 EUR
12+1.53 EUR
25+1.49 EUR
50+1.46 EUR
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500+1.35 EUR
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ST25DV16KC-IE8T3 st25dv04kc.pdf
ST25DV16KC-IE8T3
Hersteller: STMicroelectronics
Description: DYNAMIC NFC/RFID TAG IC WITH 16-
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-TSSOP
Part Status: Active
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ST25DV16KC-IE8T3 st25dv04kc.pdf
ST25DV16KC-IE8T3
Hersteller: STMicroelectronics
Description: DYNAMIC NFC/RFID TAG IC WITH 16-
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 1898 Stücke:
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Anzahl Preis
10+1.77 EUR
25+1.72 EUR
50+1.68 EUR
100+1.65 EUR
250+1.6 EUR
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ACST12-7ST acst12.pdf
ACST12-7ST
Hersteller: STMicroelectronics
Description: TRIAC SENS GATE 700V 12A TO220
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Hold (Ih) (Max): 30 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 120A, 126A
Voltage - Gate Trigger (Vgt) (Max): 1 V
Supplier Device Package: TO-220
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 700 V
auf Bestellung 973 Stücke:
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7+2.73 EUR
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ACST12-7CT acst12.pdf
ACST12-7CT
Hersteller: STMicroelectronics
Description: TRIAC 700V 12A TO220
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Hold (Ih) (Max): 50 mA
Current - Gate Trigger (Igt) (Max): 35 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 120A, 126A
Voltage - Gate Trigger (Vgt) (Max): 1 V
Supplier Device Package: TO-220
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 700 V
auf Bestellung 859 Stücke:
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7+2.73 EUR
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STP57N65M5 en.DM00049152.pdf
STP57N65M5
Hersteller: STMicroelectronics
Description: MOSFET N-CH 650V 42A TO220
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 63mOhm @ 21A, 10V
Power Dissipation (Max): 250W (Tc)
Vgs(th) (Max) @ Id: 5V @ 250µA
Supplier Device Package: TO-220
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±25V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 98 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4200 pF @ 100 V
auf Bestellung 1092 Stücke:
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Anzahl Preis
2+16.16 EUR
50+8.97 EUR
100+8.28 EUR
500+7.07 EUR
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STH260N6F6-2 en.DM00027880.pdf
STH260N6F6-2
Hersteller: STMicroelectronics
Description: MOSFET N-CH 60V 180A H2PAK-2
Input Capacitance (Ciss) (Max) @ Vds: 11800 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 183 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: H2Pak-2
Vgs(th) (Max) @ Id: 4V @ 250µA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 2.4mOhm @ 60A, 10V
Current - Continuous Drain (Id) @ 25°C: 180A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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STH260N6F6-2 en.DM00027880.pdf
STH260N6F6-2
Hersteller: STMicroelectronics
Description: MOSFET N-CH 60V 180A H2PAK-2
Input Capacitance (Ciss) (Max) @ Vds: 11800 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 183 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: H2Pak-2
Vgs(th) (Max) @ Id: 4V @ 250µA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 2.4mOhm @ 60A, 10V
Current - Continuous Drain (Id) @ 25°C: 180A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Cut Tape (CT)
auf Bestellung 978 Stücke:
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Anzahl Preis
3+7.81 EUR
10+5.19 EUR
100+3.71 EUR
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STW60N65M5 en.CD00291091.pdf
STW60N65M5
Hersteller: STMicroelectronics
Description: MOSFET N-CH 650V 46A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 46A (Tc)
Rds On (Max) @ Id, Vgs: 59mOhm @ 23A, 10V
Power Dissipation (Max): 255W (Tc)
Vgs(th) (Max) @ Id: 5V @ 250µA
Supplier Device Package: TO-247-3
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±25V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 139 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6810 pF @ 100 V
Voltage Coupled to Gate Charge (Qg) (Max) @ Vgs: 10
Voltage Coupled to Input Capacitance (Ciss) (Max) @ Vds: 100
auf Bestellung 566 Stücke:
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Anzahl Preis
1+22.93 EUR
30+14.07 EUR
120+12.13 EUR
510+12 EUR
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TSZ124IPT/TH
Hersteller: STMicroelectronics
Description: TSZ124IPT/TH
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STD2NK90Z-1 en.CD00043981.pdf
STD2NK90Z-1
Hersteller: STMicroelectronics
Description: MOSFET N-CH 900V 2.1A IPAK
Packaging: Tube
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 2.1A (Tc)
Rds On (Max) @ Id, Vgs: 6.5Ohm @ 1.05A, 10V
Power Dissipation (Max): 70W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 50µA
Supplier Device Package: IPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 27 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 485 pF @ 25 V
auf Bestellung 736 Stücke:
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5+4.26 EUR
75+1.97 EUR
150+1.78 EUR
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M24C04-FMH6TG en.DM00071277.pdf
M24C04-FMH6TG
Hersteller: STMicroelectronics
Description: IC EEPROM 4KBIT I2C 5UFDFPN
Packaging: Tape & Reel (TR)
Package / Case: 5-UFDFN
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 5-UFDFPN (1.7x1.4)
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
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5000+0.28 EUR
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M24C04-FMH6TG en.DM00071277.pdf
M24C04-FMH6TG
Hersteller: STMicroelectronics
Description: IC EEPROM 4KBIT I2C 5UFDFPN
Packaging: Cut Tape (CT)
Package / Case: 5-UFDFN
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 5-UFDFPN (1.7x1.4)
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
auf Bestellung 11955 Stücke:
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Anzahl Preis
50+0.35 EUR
53+0.33 EUR
55+0.32 EUR
100+0.31 EUR
500+0.3 EUR
1000+0.29 EUR
Mindestbestellmenge: 50
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SPC58NH92C5RMI0X spc58nh92e7.pdf
SPC58NH92C5RMI0X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 10MB FLASH 386FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 386-FBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 10MB (10M x 8)
RAM Size: 1.0625M x 8
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Data Converters: A/D 100x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: CANbus, eMMC/SD/SDIO, Ethernet, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals: DMA
Supplier Device Package: 386-FPBGA (19x19)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC58NH92C5RMI0X spc58nh92e7.pdf
SPC58NH92C5RMI0X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 10MB FLASH 386FPBGA
Packaging: Cut Tape (CT)
Package / Case: 386-FBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 10MB (10M x 8)
RAM Size: 1.0625M x 8
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Data Converters: A/D 100x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: CANbus, eMMC/SD/SDIO, Ethernet, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals: DMA
Supplier Device Package: 386-FPBGA (19x19)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC58NH92E7RMI0X spc58nh92e7.pdf
SPC58NH92E7RMI0X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 10MB FLASH 176ELQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 10MB (10M x 8)
RAM Size: 1.0625M x 8
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Data Converters: A/D 100x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: CANbus, eMMC/SD/SDIO, Ethernet, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals: DMA
Supplier Device Package: 176-eLQFP (24x24)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC58NH92E7RMI0X spc58nh92e7.pdf
SPC58NH92E7RMI0X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 10MB FLASH 176ELQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 10MB (10M x 8)
RAM Size: 1.0625M x 8
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Data Converters: A/D 100x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: CANbus, eMMC/SD/SDIO, Ethernet, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals: DMA
Supplier Device Package: 176-eLQFP (24x24)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC58NH92C3RMI0X spc58nh92e7.pdf
SPC58NH92C3RMI0X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 10MB FLASH 302FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 302-FBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 10MB (10M x 8)
RAM Size: 1.0625M x 8
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Data Converters: A/D 100x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: CANbus, eMMC/SD/SDIO, Ethernet, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals: DMA
Supplier Device Package: 302-FPBGA (17x17)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC58NH92C3RMI0X spc58nh92e7.pdf
SPC58NH92C3RMI0X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 10MB FLASH 302FPBGA
Packaging: Cut Tape (CT)
Package / Case: 302-FBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 10MB (10M x 8)
RAM Size: 1.0625M x 8
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Data Converters: A/D 100x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: CANbus, eMMC/SD/SDIO, Ethernet, I2C, LINbus, PSI5, SPI, UART/USART
Peripherals: DMA
Supplier Device Package: 302-FPBGA (17x17)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 994 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+56.95 EUR
10+46.35 EUR
25+43.71 EUR
100+40.8 EUR
250+39.42 EUR
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SPC58NH-DISP spc58nh-disp.pdf
SPC58NH-DISP
Hersteller: STMicroelectronics
Description: DISCOVERY KIT FOR SPC58 H LINE
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Board Type: Evaluation Platform
Utilized IC / Part: SPC58NH92C5
Platform: Discovery
Part Status: Active
Produkt ist nicht verfügbar
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VD6283TX-SATEL vd6283tx-satel.pdf
VD6283TX-SATEL
Hersteller: STMicroelectronics
Description: VD6283 BREAKOUT BOARD 6-CHANNEL
Packaging: Bulk
Interface: I2C
Contents: Board(s)
Voltage - Supply: 1.8V ~ 5V
Sensor Type: Light, Ambient
Utilized IC / Part: VD6283
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+29.8 EUR
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STIPN1M50T-H en.DM00264415.pdf
STIPN1M50T-H
Hersteller: STMicroelectronics
Description: MOSFET IPM 500V 1A 26-PWRDIP MOD
Voltage: 500 V
Current: 1 A
Voltage - Isolation: 1000Vrms
Configuration: 3 Phase Inverter
Type: MOSFET
Mounting Type: Through Hole
Package / Case: 26-PowerDIP Module (0.846", 21.48mm)
Packaging: Tube
Produkt ist nicht verfügbar
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STIPN2M50T-H STIPN2M50T-H_Rev6_Feb2020.pdf
STIPN2M50T-H
Hersteller: STMicroelectronics
Description: POWER DRVR MOD 500V 2A 26DIP MOD
Voltage: 500 V
Current: 2 A
Part Status: Active
Voltage - Isolation: 1000Vrms
Configuration: 3 Phase Inverter
Type: MOSFET
Mounting Type: Through Hole
Package / Case: 26-PowerDIP Module (0.846", 21.48mm)
Packaging: Tube
auf Bestellung 2 Stücke:
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Anzahl Preis
2+12.92 EUR
Mindestbestellmenge: 2
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STD2NK100Z/BKN
Hersteller: STMicroelectronics
Description: STD2NK100Z/BKN
auf Bestellung 956 Stücke:
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STO65N60DM6 sto65n60dm6.pdf
STO65N60DM6
Hersteller: STMicroelectronics
Description: N-CHANNEL 600 V, 67 MOHM TYP., 4
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 46A (Tc)
Rds On (Max) @ Id, Vgs: 76mOhm @ 23A, 10V
Power Dissipation (Max): 320W (Tc)
Vgs(th) (Max) @ Id: 4.75V @ 250µA
Supplier Device Package: TOLL (HV)
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±25V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 65.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2500 pF @ 100 V
Produkt ist nicht verfügbar
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STO65N60DM6 sto65n60dm6.pdf
STO65N60DM6
Hersteller: STMicroelectronics
Description: N-CHANNEL 600 V, 67 MOHM TYP., 4
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 46A (Tc)
Rds On (Max) @ Id, Vgs: 76mOhm @ 23A, 10V
Power Dissipation (Max): 320W (Tc)
Vgs(th) (Max) @ Id: 4.75V @ 250µA
Supplier Device Package: TOLL (HV)
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±25V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 65.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2500 pF @ 100 V
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.21 EUR
Mindestbestellmenge: 2
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SPC574S64E3CEFAR spc574s64e3.pdf
SPC574S64E3CEFAR
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 1.5MB FLSH 100ETQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-eTQFP (14x14)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.135V ~ 5.25V
Core Size: 32-Bit Dual-Core
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 140MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC574S64E3CEFAR spc574s64e3.pdf
SPC574S64E3CEFAR
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 1.5MB FLSH 100ETQFP
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-eTQFP (14x14)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.135V ~ 5.25V
Core Size: 32-Bit Dual-Core
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 140MHz
DigiKey Programmable: Not Verified
Mounting Type: Surface Mount
Package / Case: 100-TQFP Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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SPC574S64E3CEFAY spc574s60e3.pdf
SPC574S64E3CEFAY
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 1.5MB FLSH 100ETQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 140MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.135V ~ 5.25V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-eTQFP (14x14)
Grade: Automotive
Number of I/O: 64
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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STU9N60M2 en.DM00080324.pdf
STU9N60M2
Hersteller: STMicroelectronics
Description: MOSFET N-CH 600V 5.5A IPAK
Packaging: Tube
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc)
Rds On (Max) @ Id, Vgs: 780mOhm @ 3A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-251 (IPAK)
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±25V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 320 pF @ 100 V
auf Bestellung 1763 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.76 EUR
75+1.24 EUR
150+1.11 EUR
525+0.93 EUR
1050+0.85 EUR
Mindestbestellmenge: 7
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SPC58EE80E7QMHAY SPC58EEx%2C_SPC58NEx.pdf
SPC58EE80E7QMHAY
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 4MB FLASH 176QFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.2V, 3.3V, 5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA
Supplier Device Package: 176-eLQFP (24x24)
Grade: Automotive
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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AEK-CON-SENSOR1 aek-con-sensor1.pdf
AEK-CON-SENSOR1
Hersteller: STMicroelectronics
Description: CONNECTOR BOARD FOR SPC5 MCU DIS
Packaging: Bulk
Function: Connector Board
Type: Interface
Contents: Board(s)
Utilized IC / Part: SPC58EC80E5
Part Status: Active
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+54.7 EUR
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SPC582B50E1AD00X spc582b60e1.pdf
SPC582B50E1AD00X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 512KB FLASH 64ETQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 64-eTQFP (10x10)
Grade: Automotive
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC582B50E1AD00X spc582b60e1.pdf
SPC582B50E1AD00X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 512KB FLASH 64ETQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 64-eTQFP (10x10)
Grade: Automotive
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC58EE84E7QMSAR spc58ne84c3.pdf
SPC58EE84E7QMSAR
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 6MB FLASH 176QFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 608K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.2V, 3.3V, 5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA
Supplier Device Package: 176-eLQFP (24x24)
Grade: Automotive
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC58EE84E7QMSAR spc58ne84c3.pdf
SPC58EE84E7QMSAR
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 6MB FLASH 176QFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 608K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.2V, 3.3V, 5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA
Supplier Device Package: 176-eLQFP (24x24)
Grade: Automotive
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 488 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+43.68 EUR
10+35.27 EUR
25+33.17 EUR
100+30.86 EUR
250+29.76 EUR
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SPC582B60E1CD00X spc582b60e1.pdf
SPC582B60E1CD00X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 1MB FLASH 64ETQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 64-eTQFP (10x10)
Grade: Automotive
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+7.68 EUR
Mindestbestellmenge: 1000
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SPC582B60E1CD00X spc582b60e1.pdf
SPC582B60E1CD00X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 1MB FLASH 64ETQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 64-eTQFP (10x10)
Grade: Automotive
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 1965 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.87 EUR
10+9.98 EUR
25+9.26 EUR
100+8.47 EUR
250+8.09 EUR
500+7.87 EUR
Mindestbestellmenge: 2
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SPC58EC80E3QMC0Y spc58ec80e3.pdf
SPC58EC80E3QMC0Y
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 4MB FLASH 100QFP
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
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SPC582B50E1CG00X spc582b60e1.pdf
SPC582B50E1CG00X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 512KB FLASH 64ETQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 64-eTQFP (10x10)
Grade: Automotive
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC582B50E1CG00X spc582b60e1.pdf
SPC582B50E1CG00X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 512KB FLASH 64ETQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 64-eTQFP (10x10)
Grade: Automotive
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC582B50E3CD00X spc582b60e1.pdf
SPC582B50E3CD00X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 512KB FLSH 100ETQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 100-eTQFP (14x14)
Grade: Automotive
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC582B50E3CD00X spc582b60e1.pdf
SPC582B50E3CD00X
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 512KB FLSH 100ETQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2
Data Converters: A/D 27x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: CANbus, I2C, LINbus, SPI
Peripherals: DMA, WDT
Supplier Device Package: 100-eTQFP (14x14)
Grade: Automotive
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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STM32L4S9VIT6 en.DM00366449.pdf
STM32L4S9VIT6
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Produkt ist nicht verfügbar
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STM32L4S9ZIJ6TR
STM32L4S9ZIJ6TR
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 2MB FLASH 144UFBGA
Produkt ist nicht verfügbar
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STM32L4S9ZIT6 en.DM00366449.pdf
STM32L4S9ZIT6
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Produkt ist nicht verfügbar
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MD2001FX en.CD00160932.pdf
MD2001FX
Hersteller: STMicroelectronics
Description: TRANS NPN 700V 12A ISOWATT-218FX
Packaging: Tube
Package / Case: ISOWATT218FX
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.8V @ 1.5A, 6A
Current - Collector Cutoff (Max): 200µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 4.5 @ 6A, 5V
Supplier Device Package: ISOWATT-218FX
Part Status: Active
Current - Collector (Ic) (Max): 12 A
Voltage - Collector Emitter Breakdown (Max): 700 V
Power - Max: 58 W
auf Bestellung 4027 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.6 EUR
30+3.04 EUR
120+2.48 EUR
510+2.07 EUR
1020+1.92 EUR
2010+1.79 EUR
Mindestbestellmenge: 4
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STPSC15H12G2Y-TR stpsc15h12g2y-tr.pdf
STPSC15H12G2Y-TR
Hersteller: STMicroelectronics
Description: DIODE SIL CARB 1.2KV 15A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1200pF @ 0V, 1MHz
Current - Average Rectified (Io): 15A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 90 µA @ 1200 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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STPSC15H12G2Y-TR stpsc15h12g2y-tr.pdf
STPSC15H12G2Y-TR
Hersteller: STMicroelectronics
Description: DIODE SIL CARB 1.2KV 15A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1200pF @ 0V, 1MHz
Current - Average Rectified (Io): 15A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 90 µA @ 1200 V
Qualification: AEC-Q101
auf Bestellung 970 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.8 EUR
10+10.96 EUR
100+9.13 EUR
500+8.06 EUR
Mindestbestellmenge: 2
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STPSC15H12G2-TR stpsc15h12g2-tr.pdf
STPSC15H12G2-TR
Hersteller: STMicroelectronics
Description: DIODE SIC 1.2KV 15A D2PAK HV
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1200pF @ 0V, 1MHz
Current - Average Rectified (Io): 15A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 5 A
Current - Reverse Leakage @ Vr: 90 µA @ 1200 V
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+6.06 EUR
Mindestbestellmenge: 1000
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STPSC15H12G2-TR stpsc15h12g2-tr.pdf
STPSC15H12G2-TR
Hersteller: STMicroelectronics
Description: DIODE SIC 1.2KV 15A D2PAK HV
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1200pF @ 0V, 1MHz
Current - Average Rectified (Io): 15A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 5 A
Current - Reverse Leakage @ Vr: 90 µA @ 1200 V
auf Bestellung 1943 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.87 EUR
10+9.24 EUR
100+6.82 EUR
500+6.06 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
STPSC20H12G2Y-TR stpsc20h12-y.pdf
STPSC20H12G2Y-TR
Hersteller: STMicroelectronics
Description: DIODE SIC 1.2KV 20A D2PAK HV
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: Zero Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1650pF @ 0V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 20 A
Current - Reverse Leakage @ Vr: 120 µA @ 1200 V
Qualification: AEC-Q101
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+6.79 EUR
Mindestbestellmenge: 1000
Im Einkaufswagen  Stück im Wert von  UAH
STPSC20H12G2Y-TR stpsc20h12-y.pdf
STPSC20H12G2Y-TR
Hersteller: STMicroelectronics
Description: DIODE SIC 1.2KV 20A D2PAK HV
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: Zero Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1650pF @ 0V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 20 A
Current - Reverse Leakage @ Vr: 120 µA @ 1200 V
Qualification: AEC-Q101
auf Bestellung 1243 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16 EUR
10+10.99 EUR
100+8.31 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
STPSC20H12G2-TR stpsc20h12g2-tr.pdf
STPSC20H12G2-TR
Hersteller: STMicroelectronics
Description: DIODE SIL CARB 1.2KV 20A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1650pF @ 0V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 20 A
Current - Reverse Leakage @ Vr: 120 µA @ 1200 V
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+9.7 EUR
Mindestbestellmenge: 1000
Im Einkaufswagen  Stück im Wert von  UAH
STPSC20H12G2-TR stpsc20h12g2-tr.pdf
STPSC20H12G2-TR
Hersteller: STMicroelectronics
Description: DIODE SIL CARB 1.2KV 20A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1650pF @ 0V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: D2PAK HV
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 20 A
Current - Reverse Leakage @ Vr: 120 µA @ 1200 V
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.09 EUR
10+14.66 EUR
100+12.22 EUR
500+10.78 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
L4931ABD50-TR en.CD00000971.pdf
L4931ABD50-TR
Hersteller: STMicroelectronics
Description: IC REG LINEAR 5V 250MA 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 250mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 1 mA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: 8-SOIC
Voltage - Output (Min/Fixed): 5V
Part Status: Active
PSRR: 70dB ~ 55dB (120Hz ~ 10kHz)
Voltage Dropout (Max): 0.8V @ 250mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 6 mA
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+0.83 EUR
Mindestbestellmenge: 2500
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