Produkte > ADVANCED THERMAL SOLUTIONS INC. > Alle Produkte des Herstellers ADVANCED THERMAL SOLUTIONS INC. (110395) > Seite 1833 nach 1840
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ATS-02H-197-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X10MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 10.90°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-10B-85-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 35X35X10MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 23.98°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-04G-48-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 25X25X35MM L-TAB T766Packaging: Tray Material: Aluminum Length: 0.984" (25.00mm) Shape: Square, Fins Type: Top Mount Width: 0.984" (25.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 7.51°C/W @ 100 LFM Fin Height: 1.378" (35.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-12D-153-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X10MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 11.95°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-10B-84-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X35MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 100 LFM Fin Height: 1.378" (35.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-14C-180-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 35X35X35MM R-TAB T766Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 1.378" (35.00mm) Thermal Resistance @ Forced Air Flow: 3.32°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.378" (35.00mm) Type: Top Mount Shape: Square, Fins Length: 1.378" (35.00mm) |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-10E-126-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 54X54X15MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.590" (15.00mm) Thermal Resistance @ Forced Air Flow: 5.47°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.126" (54.00mm) Type: Top Mount Shape: Square, Fins Length: 2.126" (54.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-06A-68-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X15MM L-TAB T766Material Finish: Blue Anodized Fin Height: 0.590" (15.00mm) Thermal Resistance @ Forced Air Flow: 15.31°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.772" (45.00mm) Type: Top Mount Shape: Square, Fins Length: 1.772" (45.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-16E-17-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 54X54X12.7MM XCUT T766Packaging: Tray Material: Aluminum Length: 2.126" (54.00mm) Shape: Square, Fins Type: Top Mount Width: 2.126" (54.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 15.44°C/W @ 100 LFM Fin Height: 0.500" (12.70mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-03H-160-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X15MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 6.67°C/W @ 100 LFM Fin Height: 0.590" (15.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-06A-94-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X25MM R-TAB T766Thermal Resistance @ Forced Air Flow: 9.39°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.575" (40.00mm) Type: Top Mount Shape: Square, Fins Length: 1.575" (40.00mm) Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 0.984" (25.00mm) |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
| ATS-CP-1008-DIY | Advanced Thermal Solutions Inc. |
Description: COLDPLATE 0.010C/W@1GPMProduct Type: Passive, Cold Plate Dimensions - Overall: 8.66" L x 2.76" W x 0.98" H (220.0mm x 70.0mm x 25.0mm) Packaging: Box |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 10 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
|
ATS-09D-45-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 25X25X20MM L-TAB T766Material Finish: Blue Anodized Fin Height: 0.790" (20.00mm) Thermal Resistance @ Forced Air Flow: 15.02°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 0.984" (25.00mm) Type: Top Mount Shape: Square, Fins Length: 0.984" (25.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-12D-187-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X10MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 10.70°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
|
ATS-12D-189-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X20MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 4.74°C/W @ 100 LFM Fin Height: 0.790" (20.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-01G-53-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X30MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 8.57°C/W @ 100 LFM Fin Height: 1.181" (30.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-11E-47-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 25X25X30MM L-TAB T766Material Finish: Blue Anodized Fin Height: 1.181" (30.00mm) Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 0.984" (25.00mm) Type: Top Mount Shape: Square, Fins Length: 0.984" (25.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-08G-144-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X25MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 5.52°C/W @ 100 LFM Fin Height: 0.984" (25.00mm) Material Finish: Blue Anodized |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 25 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
|
ATS-TEC20-13-052 | Advanced Thermal Solutions Inc. |
Description: TEC Module 20x20x3.8mmFeatures: Lead Wires Packaging: Box Size / Dimension: Square - 20.00mm L x 20.00mm W Operating Temperature: 80°C Height: 3.80mm Delta Tmax @ Th: 67°C @ 27°C Qmax @ Th: 13.2W @ 27°C Current - Max: 6 A Voltage - Max: 3.8 V Resistance: 480 mOhms Number of Stages: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
|
ATS-TEC20-84-054 | Advanced Thermal Solutions Inc. |
Description: TEC Module 20x20x4.2mmFeatures: Lead Wires Packaging: Box Size / Dimension: Square - 20.00mm L x 20.00mm W Operating Temperature: 80°C Height: 4.20mm Delta Tmax @ Th: 67°C @ 27°C Qmax @ Th: 8.6W @ 27°C Current - Max: 3.9 A Voltage - Max: 3.8 V Resistance: 750 mOhms Number of Stages: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
|
ATS-TEC23-10-040 | Advanced Thermal Solutions Inc. |
Description: TEC Module 23x23x5.3mmFeatures: Lead Wires Packaging: Box Size / Dimension: Square - 23.00mm L x 23.00mm W Operating Temperature: 80°C Height: 5.30mm Delta Tmax @ Th: 66°C @ 27°C Qmax @ Th: 10.9W @ 27°C Current - Max: 9 A Voltage - Max: 2 V Resistance: 180 MOhms Number of Stages: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
|
ATS-TEC25-51-062 | Advanced Thermal Solutions Inc. |
Description: TEC Module 25x25x3.1mmFeatures: Lead Wires Packaging: Box Size / Dimension: Square - 25.00mm L x 25.00mm W Type: TEC (Thermoelectric Cooler) Operating Temperature: 80°C Height: 3.10mm Delta Tmax @ Th: 67°C @ 27°C Qmax @ Th: 52.4W @ 27°C Current - Max: 15 A Voltage - Max: 5.9 V Resistance: 300 mOhms Number of Stages: 1 |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-TEC20-16-044 | Advanced Thermal Solutions Inc. |
Description: TEC Module 20x20x3.8mmFeatures: Lead Wires Packaging: Box Size / Dimension: Square - 20.00mm L x 20.00mm W Operating Temperature: 80°C Height: 3.80mm Delta Tmax @ Th: 66°C @ 27°C Qmax @ Th: 14.5W @ 27°C Current - Max: 14 A Voltage - Max: 2 V Resistance: 120 mOhms Number of Stages: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
|
ATS-TEC25-39-061 | Advanced Thermal Solutions Inc. |
Description: TEC Module 25x25x3.6mmFeatures: Lead Wires Packaging: Box Size / Dimension: Square - 25.00mm L x 25.00mm W Operating Temperature: 80°C Height: 3.60mm Delta Tmax @ Th: 67°C @ 27°C Qmax @ Th: 39.7W @ 27°C Current - Max: 18 A Voltage - Max: 3.8 V Resistance: 160 mOhms Number of Stages: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
|
ATS-TEC20-24-046 | Advanced Thermal Solutions Inc. |
Description: TEC Module 20x20x3.4mmFeatures: Lead Wires Packaging: Box Size / Dimension: Square - 20.00mm L x 20.00mm W Operating Temperature: 80°C Height: 3.40mm Delta Tmax @ Th: 66°C @ 27°C Qmax @ Th: 24.2W @ 27°C Current - Max: 20 A Voltage - Max: 2 V Resistance: 80 mOhms Number of Stages: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
|
ATS-TEC23-35-047 | Advanced Thermal Solutions Inc. |
Description: TEC Module 23x23x4.4mmFeatures: Lead Wires Packaging: Box Size / Dimension: Square - 23.00mm L x 23.00mm W Type: TEC (Thermoelectric Cooler) Operating Temperature: 80°C Height: 4.40mm Delta Tmax @ Th: 66°C @ 27°C Qmax @ Th: 36.3W @ 27°C Current - Max: 30 A Voltage - Max: 2 V Resistance: 50 mOhms Number of Stages: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
|
ATS-17E-200-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 50X50X10MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Forced Air Flow: 9.78°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.969" (50.00mm) Type: Top Mount Shape: Square, Fins Length: 1.969" (50.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-02H-200-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 50X50X10MM XCUT T766Width: 1.969" (50.00mm) Type: Top Mount Shape: Square, Fins Length: 1.969" (50.00mm) Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Forced Air Flow: 9.78°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-02H-201-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 50X50X12MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.472" (12.00mm) Thermal Resistance @ Forced Air Flow: 8.17°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.969" (50.00mm) Type: Top Mount Shape: Square, Fins Length: 1.969" (50.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-02H-204-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 54X54X12MM XCUT T766Length: 2.126" (54.00mm) Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 0.472" (12.00mm) Thermal Resistance @ Forced Air Flow: 7.43°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.126" (54.00mm) Type: Top Mount Shape: Square, Fins |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-02H-208-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 70X70X6MM XCUT T766Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 0.236" (6.00mm) Thermal Resistance @ Forced Air Flow: 10.50°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.756" (70.00mm) Type: Top Mount Shape: Square, Fins Length: 2.756" (70.00mm) |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-02G-196-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X6MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 18.11°C/W @ 100 LFM Fin Height: 0.236" (6.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
|
ATS-20H-27-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 70X70X12.7MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.500" (12.70mm) Thermal Resistance @ Forced Air Flow: 12.24°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.756" (70.00mm) Type: Top Mount Shape: Square, Fins Length: 2.756" (70.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-196-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X6MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.236" (6.00mm) Thermal Resistance @ Forced Air Flow: 18.11°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.772" (45.00mm) Type: Top Mount Shape: Square, Fins Length: 1.772" (45.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-51-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X20MM L-TAB T766Material Finish: Blue Anodized Fin Height: 0.790" (20.00mm) Thermal Resistance @ Forced Air Flow: 14.03°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.181" (30.00mm) Type: Top Mount Shape: Square, Fins Length: 1.181" (30.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-198-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X12MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.472" (12.00mm) Thermal Resistance @ Forced Air Flow: 9.06°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.772" (45.00mm) Type: Top Mount Shape: Square, Fins Length: 1.772" (45.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-170-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X15MM R-TAB T766Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 0.590" (15.00mm) Thermal Resistance @ Forced Air Flow: 10.07°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.181" (30.00mm) Type: Top Mount Shape: Square, Fins Length: 1.181" (30.00mm) |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-52-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X25MM L-TAB T766Material Finish: Blue Anodized Fin Height: 0.984" (25.00mm) Thermal Resistance @ Forced Air Flow: 10.79°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.181" (30.00mm) Type: Top Mount Shape: Square, Fins Length: 1.181" (30.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-55-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 35X35X10MM L-TAB T766Material Finish: Blue Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Forced Air Flow: 23.98°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.378" (35.00mm) Type: Top Mount Shape: Square, Fins Length: 1.378" (35.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-171-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X20MM R-TAB T766Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.181" (30.00mm) Type: Top Mount Shape: Square, Fins Length: 1.181" (30.00mm) Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 0.790" (20.00mm) Thermal Resistance @ Forced Air Flow: 7.33°C/W @ 100 LFM Attachment Method: Push Pin |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-199-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 50X50X6MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.236" (6.00mm) Thermal Resistance @ Forced Air Flow: 15.83°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.969" (50.00mm) Type: Top Mount Shape: Square, Fins Length: 1.969" (50.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-77-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 25X25X30MM R-TAB T766Material Finish: Blue Anodized Fin Height: 1.181" (30.00mm) Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 0.984" (25.00mm) Type: Top Mount Shape: Square, Fins Length: 0.984" (25.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-56-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 35X35X15MM L-TAB T766Material Finish: Blue Anodized Fin Height: 0.590" (15.00mm) Thermal Resistance @ Forced Air Flow: 17.72°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.378" (35.00mm) Type: Top Mount Shape: Square, Fins Length: 1.378" (35.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-78-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 25X25X35MM R-TAB T766Material Finish: Blue Anodized Fin Height: 1.378" (35.00mm) Thermal Resistance @ Forced Air Flow: 7.71°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 0.984" (25.00mm) Type: Top Mount Shape: Square, Fins Length: 0.984" (25.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-173-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X30MM R-TAB T766Material Finish: Blue Anodized Fin Height: 1.181" (30.00mm) Thermal Resistance @ Forced Air Flow: 4.72°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.181" (30.00mm) Type: Top Mount Shape: Square, Fins Length: 1.181" (30.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-176-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 35X35X15MM R-TAB T766Material Finish: Blue Anodized Fin Height: 0.590" (15.00mm) Thermal Resistance @ Forced Air Flow: 8.59°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.378" (35.00mm) Type: Top Mount Shape: Square, Fins Length: 1.378" (35.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-57-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 35X35X20MM L-TAB T766Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 0.790" (20.00mm) Thermal Resistance @ Forced Air Flow: 13.16°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.378" (35.00mm) Type: Top Mount Shape: Square, Fins Length: 1.378" (35.00mm) |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-01D-88-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 35X35X25MM R-TAB T766Material Finish: Blue Anodized Fin Height: 0.984" (25.00mm) Thermal Resistance @ Forced Air Flow: 10.11°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.378" (35.00mm) Type: Top Mount Shape: Square, Fins Length: 1.378" (35.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-20H-62-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X15MM L-TAB T766Material Finish: Blue Anodized Fin Height: 0.590" (15.00mm) Thermal Resistance @ Forced Air Flow: 16.48°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.575" (40.00mm) Type: Top Mount Shape: Square, Fins Length: 1.575" (40.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-17C-204-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 54X54X12MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.472" (12.00mm) Thermal Resistance @ Forced Air Flow: 7.43°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.126" (54.00mm) Type: Top Mount Shape: Square, Fins Length: 2.126" (54.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
|
ATS-18G-189-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X20MM R-TAB T766Packaging: Tray Material: Aluminum Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Material Finish: Blue Anodized Fin Height: 0.790" (20.00mm) Width: 1.772" (45.00mm) Type: Top Mount Thermal Resistance @ Forced Air Flow: 4.74°C/W @ 100 LFM Shape: Square, Fins Length: 1.772" (45.00mm) |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
|
ATS-21C-42-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 57.9X60.96X22.86MM T766Material Finish: Blue Anodized Fin Height: 0.900" (22.86mm) Thermal Resistance @ Forced Air Flow: 7.31°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.400" (60.96mm) Type: Top Mount Shape: Rectangular, Fins Length: 2.280" (57.90mm) Material: Aluminum Packaging: Bulk |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-21C-26-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 70X70X10MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Forced Air Flow: 14.20°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.756" (70.00mm) Type: Top Mount Shape: Square, Fins Length: 2.756" (70.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
|
ATS-21C-28-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 70X70X15MM XCUT T766Shape: Square, Fins Length: 2.756" (70.00mm) Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 0.590" (15.00mm) Thermal Resistance @ Forced Air Flow: 10.58°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.756" (70.00mm) Type: Top Mount |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-21C-138-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 25X25X15MM L-TAB T766Material Finish: Blue Anodized Fin Height: 0.590" (15.00mm) Thermal Resistance @ Forced Air Flow: 12.18°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 0.984" (25.00mm) Type: Top Mount Shape: Square, Fins Length: 0.984" (25.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-21C-139-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 25X25X20MM L-TAB T766Material Finish: Blue Anodized Fin Height: 0.790" (20.00mm) Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 0.984" (25.00mm) Type: Top Mount Shape: Square, Fins Length: 0.984" (25.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-21C-194-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X10MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Forced Air Flow: 13.07°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.575" (40.00mm) Type: Top Mount Shape: Square, Fins Length: 1.575" (40.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-21C-76-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 25X25X25MM R-TAB T766Shape: Square, Fins Length: 0.984" (25.00mm) Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 0.984" (25.00mm) Thermal Resistance @ Forced Air Flow: 11.57°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 0.984" (25.00mm) Type: Top Mount |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-21C-117-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X10MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Forced Air Flow: 10.48°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.772" (45.00mm) Type: Top Mount Shape: Square, Fins Length: 1.772" (45.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||
|
ATS-21C-142-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X15MM L-TAB T766Material Finish: Blue Anodized Fin Height: 0.590" (15.00mm) Thermal Resistance @ Forced Air Flow: 10.07°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.181" (30.00mm) Type: Top Mount Shape: Square, Fins Length: 1.181" (30.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ATS-02H-197-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X10MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.90°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X10MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.90°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.58 EUR |
| 10+ | 9.38 EUR |
| 25+ | 8.92 EUR |
| ATS-10B-85-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 23.98°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 35X35X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 23.98°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.95 EUR |
| 10+ | 9.69 EUR |
| 25+ | 9.22 EUR |
| ATS-04G-48-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 25X25X35MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.51°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 25X25X35MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.51°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.38 EUR |
| 10+ | 10.07 EUR |
| 25+ | 9.59 EUR |
| ATS-12D-153-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X10MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 11.95°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X10MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 11.95°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.85 EUR |
| 10+ | 10.51 EUR |
| 25+ | 10.01 EUR |
| ATS-10B-84-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.23 EUR |
| 10+ | 10.82 EUR |
| 25+ | 10.31 EUR |
| ATS-14C-180-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X35MM R-TAB T766
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 1.378" (35.00mm)
Thermal Resistance @ Forced Air Flow: 3.32°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.378" (35.00mm)
Description: HEATSINK 35X35X35MM R-TAB T766
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 1.378" (35.00mm)
Thermal Resistance @ Forced Air Flow: 3.32°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.378" (35.00mm)
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.57 EUR |
| 10+ | 11.13 EUR |
| 25+ | 10.6 EUR |
| ATS-10E-126-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 54X54X15MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 5.47°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.126" (54.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.126" (54.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 54X54X15MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 5.47°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.126" (54.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.126" (54.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.57 EUR |
| 10+ | 11.13 EUR |
| 25+ | 10.6 EUR |
| ATS-06A-68-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X15MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 15.31°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.772" (45.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.772" (45.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 45X45X15MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 15.31°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.772" (45.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.772" (45.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.86 EUR |
| 10+ | 11.38 EUR |
| 25+ | 10.84 EUR |
| ATS-16E-17-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 54X54X12.7MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.126" (54.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.126" (54.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 15.44°C/W @ 100 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Blue Anodized
Description: HEATSINK 54X54X12.7MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.126" (54.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 2.126" (54.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 15.44°C/W @ 100 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.01 EUR |
| 10+ | 11.51 EUR |
| 25+ | 10.96 EUR |
| ATS-03H-160-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X15MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.67°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X15MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.67°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.14 EUR |
| 10+ | 11.63 EUR |
| 25+ | 11.08 EUR |
| ATS-06A-94-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X25MM R-TAB T766
Thermal Resistance @ Forced Air Flow: 9.39°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.575" (40.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.575" (40.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.984" (25.00mm)
Description: HEATSINK 40X40X25MM R-TAB T766
Thermal Resistance @ Forced Air Flow: 9.39°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.575" (40.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.575" (40.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.984" (25.00mm)
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.01 EUR |
| 10+ | 11.51 EUR |
| 25+ | 10.96 EUR |
| ATS-CP-1008-DIY |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: COLDPLATE 0.010C/W@1GPM
Product Type: Passive, Cold Plate
Dimensions - Overall: 8.66" L x 2.76" W x 0.98" H (220.0mm x 70.0mm x 25.0mm)
Packaging: Box
Description: COLDPLATE 0.010C/W@1GPM
Product Type: Passive, Cold Plate
Dimensions - Overall: 8.66" L x 2.76" W x 0.98" H (220.0mm x 70.0mm x 25.0mm)
Packaging: Box
Produkt ist nicht verfügbar
Mindestbestellmenge: 10 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| ATS-09D-45-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 25X25X20MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 15.02°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 25X25X20MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 15.02°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.08 EUR |
| 10+ | 8.92 EUR |
| 25+ | 8.51 EUR |
| ATS-12D-187-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.70°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.70°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.86 EUR |
| 10+ | 11.38 EUR |
| 25+ | 10.84 EUR |
| ATS-12D-189-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X20MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 4.74°C/W @ 100 LFM
Fin Height: 0.790" (20.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X20MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 4.74°C/W @ 100 LFM
Fin Height: 0.790" (20.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.34 EUR |
| 10+ | 11.82 EUR |
| 25+ | 11.26 EUR |
| ATS-01G-53-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 8.57°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 8.57°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.02 EUR |
| 10+ | 10.63 EUR |
| 25+ | 10.13 EUR |
| ATS-11E-47-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 25X25X30MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 1.181" (30.00mm)
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 25X25X30MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 1.181" (30.00mm)
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.22 EUR |
| 10+ | 9.94 EUR |
| 25+ | 9.47 EUR |
| ATS-08G-144-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X25MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.52°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X25MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.52°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
Produkt ist nicht verfügbar
Mindestbestellmenge: 25 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| ATS-TEC20-13-052 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 20x20x3.8mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 20.00mm L x 20.00mm W
Operating Temperature: 80°C
Height: 3.80mm
Delta Tmax @ Th: 67°C @ 27°C
Qmax @ Th: 13.2W @ 27°C
Current - Max: 6 A
Voltage - Max: 3.8 V
Resistance: 480 mOhms
Number of Stages: 1
Description: TEC Module 20x20x3.8mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 20.00mm L x 20.00mm W
Operating Temperature: 80°C
Height: 3.80mm
Delta Tmax @ Th: 67°C @ 27°C
Qmax @ Th: 13.2W @ 27°C
Current - Max: 6 A
Voltage - Max: 3.8 V
Resistance: 480 mOhms
Number of Stages: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-TEC20-84-054 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 20x20x4.2mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 20.00mm L x 20.00mm W
Operating Temperature: 80°C
Height: 4.20mm
Delta Tmax @ Th: 67°C @ 27°C
Qmax @ Th: 8.6W @ 27°C
Current - Max: 3.9 A
Voltage - Max: 3.8 V
Resistance: 750 mOhms
Number of Stages: 1
Description: TEC Module 20x20x4.2mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 20.00mm L x 20.00mm W
Operating Temperature: 80°C
Height: 4.20mm
Delta Tmax @ Th: 67°C @ 27°C
Qmax @ Th: 8.6W @ 27°C
Current - Max: 3.9 A
Voltage - Max: 3.8 V
Resistance: 750 mOhms
Number of Stages: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-TEC23-10-040 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 23x23x5.3mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 23.00mm L x 23.00mm W
Operating Temperature: 80°C
Height: 5.30mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 10.9W @ 27°C
Current - Max: 9 A
Voltage - Max: 2 V
Resistance: 180 MOhms
Number of Stages: 1
Description: TEC Module 23x23x5.3mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 23.00mm L x 23.00mm W
Operating Temperature: 80°C
Height: 5.30mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 10.9W @ 27°C
Current - Max: 9 A
Voltage - Max: 2 V
Resistance: 180 MOhms
Number of Stages: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-TEC25-51-062 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 25x25x3.1mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 25.00mm L x 25.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.10mm
Delta Tmax @ Th: 67°C @ 27°C
Qmax @ Th: 52.4W @ 27°C
Current - Max: 15 A
Voltage - Max: 5.9 V
Resistance: 300 mOhms
Number of Stages: 1
Description: TEC Module 25x25x3.1mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 25.00mm L x 25.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.10mm
Delta Tmax @ Th: 67°C @ 27°C
Qmax @ Th: 52.4W @ 27°C
Current - Max: 15 A
Voltage - Max: 5.9 V
Resistance: 300 mOhms
Number of Stages: 1
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 32.61 EUR |
| 5+ | 30.64 EUR |
| 10+ | 29.83 EUR |
| 25+ | 28.79 EUR |
| ATS-TEC20-16-044 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 20x20x3.8mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 20.00mm L x 20.00mm W
Operating Temperature: 80°C
Height: 3.80mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 14.5W @ 27°C
Current - Max: 14 A
Voltage - Max: 2 V
Resistance: 120 mOhms
Number of Stages: 1
Description: TEC Module 20x20x3.8mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 20.00mm L x 20.00mm W
Operating Temperature: 80°C
Height: 3.80mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 14.5W @ 27°C
Current - Max: 14 A
Voltage - Max: 2 V
Resistance: 120 mOhms
Number of Stages: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-TEC25-39-061 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 25x25x3.6mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 25.00mm L x 25.00mm W
Operating Temperature: 80°C
Height: 3.60mm
Delta Tmax @ Th: 67°C @ 27°C
Qmax @ Th: 39.7W @ 27°C
Current - Max: 18 A
Voltage - Max: 3.8 V
Resistance: 160 mOhms
Number of Stages: 1
Description: TEC Module 25x25x3.6mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 25.00mm L x 25.00mm W
Operating Temperature: 80°C
Height: 3.60mm
Delta Tmax @ Th: 67°C @ 27°C
Qmax @ Th: 39.7W @ 27°C
Current - Max: 18 A
Voltage - Max: 3.8 V
Resistance: 160 mOhms
Number of Stages: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-TEC20-24-046 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 20x20x3.4mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 20.00mm L x 20.00mm W
Operating Temperature: 80°C
Height: 3.40mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 24.2W @ 27°C
Current - Max: 20 A
Voltage - Max: 2 V
Resistance: 80 mOhms
Number of Stages: 1
Description: TEC Module 20x20x3.4mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 20.00mm L x 20.00mm W
Operating Temperature: 80°C
Height: 3.40mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 24.2W @ 27°C
Current - Max: 20 A
Voltage - Max: 2 V
Resistance: 80 mOhms
Number of Stages: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-TEC23-35-047 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 23x23x4.4mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 23.00mm L x 23.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 4.40mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 36.3W @ 27°C
Current - Max: 30 A
Voltage - Max: 2 V
Resistance: 50 mOhms
Number of Stages: 1
Description: TEC Module 23x23x4.4mm
Features: Lead Wires
Packaging: Box
Size / Dimension: Square - 23.00mm L x 23.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 4.40mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 36.3W @ 27°C
Current - Max: 30 A
Voltage - Max: 2 V
Resistance: 50 mOhms
Number of Stages: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-17E-200-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 50X50X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 9.78°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 50X50X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 9.78°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.3 EUR |
| 10+ | 10 EUR |
| 25+ | 9.53 EUR |
| ATS-02H-200-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 50X50X10MM XCUT T766
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 9.78°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Description: HEATSINK 50X50X10MM XCUT T766
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 9.78°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.3 EUR |
| 10+ | 10 EUR |
| 25+ | 9.53 EUR |
| ATS-02H-201-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 50X50X12MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.472" (12.00mm)
Thermal Resistance @ Forced Air Flow: 8.17°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 50X50X12MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.472" (12.00mm)
Thermal Resistance @ Forced Air Flow: 8.17°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.52 EUR |
| 10+ | 10.19 EUR |
| 25+ | 9.71 EUR |
| ATS-02H-204-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 54X54X12MM XCUT T766
Length: 2.126" (54.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.472" (12.00mm)
Thermal Resistance @ Forced Air Flow: 7.43°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.126" (54.00mm)
Type: Top Mount
Shape: Square, Fins
Description: HEATSINK 54X54X12MM XCUT T766
Length: 2.126" (54.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.472" (12.00mm)
Thermal Resistance @ Forced Air Flow: 7.43°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.126" (54.00mm)
Type: Top Mount
Shape: Square, Fins
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.29 EUR |
| 10+ | 10.88 EUR |
| 25+ | 10.36 EUR |
| ATS-02H-208-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 70X70X6MM XCUT T766
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.236" (6.00mm)
Thermal Resistance @ Forced Air Flow: 10.50°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.756" (70.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.756" (70.00mm)
Description: HEATSINK 70X70X6MM XCUT T766
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.236" (6.00mm)
Thermal Resistance @ Forced Air Flow: 10.50°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.756" (70.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.756" (70.00mm)
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.52 EUR |
| 10+ | 16.37 EUR |
| 25+ | 15.6 EUR |
| ATS-02G-196-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X6MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 18.11°C/W @ 100 LFM
Fin Height: 0.236" (6.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X6MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 18.11°C/W @ 100 LFM
Fin Height: 0.236" (6.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.45 EUR |
| 10+ | 9.25 EUR |
| 25+ | 8.81 EUR |
| ATS-20H-27-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 70X70X12.7MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Forced Air Flow: 12.24°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.756" (70.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.756" (70.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 70X70X12.7MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Forced Air Flow: 12.24°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.756" (70.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.756" (70.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.19 EUR |
| 10+ | 17.87 EUR |
| 25+ | 17.03 EUR |
| ATS-20H-196-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X6MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.236" (6.00mm)
Thermal Resistance @ Forced Air Flow: 18.11°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.772" (45.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.772" (45.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 45X45X6MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.236" (6.00mm)
Thermal Resistance @ Forced Air Flow: 18.11°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.772" (45.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.772" (45.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.97 EUR |
| 10+ | 8.82 EUR |
| 25+ | 8.39 EUR |
| ATS-20H-51-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X20MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 14.03°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 30X30X20MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 14.03°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.26 EUR |
| 10+ | 9.08 EUR |
| 25+ | 8.65 EUR |
| ATS-20H-198-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X12MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.472" (12.00mm)
Thermal Resistance @ Forced Air Flow: 9.06°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.772" (45.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.772" (45.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 45X45X12MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.472" (12.00mm)
Thermal Resistance @ Forced Air Flow: 9.06°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.772" (45.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.772" (45.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.26 EUR |
| 10+ | 9.08 EUR |
| 25+ | 8.65 EUR |
| ATS-20H-170-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X15MM R-TAB T766
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 10.07°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
Description: HEATSINK 30X30X15MM R-TAB T766
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 10.07°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.28 EUR |
| 10+ | 9.12 EUR |
| 25+ | 8.68 EUR |
| ATS-20H-52-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X25MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.984" (25.00mm)
Thermal Resistance @ Forced Air Flow: 10.79°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 30X30X25MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.984" (25.00mm)
Thermal Resistance @ Forced Air Flow: 10.79°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.45 EUR |
| 10+ | 9.23 EUR |
| 25+ | 8.79 EUR |
| ATS-20H-55-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X10MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 23.98°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.378" (35.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 35X35X10MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 23.98°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.378" (35.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.45 EUR |
| 10+ | 9.23 EUR |
| 25+ | 8.79 EUR |
| ATS-20H-171-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X20MM R-TAB T766
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 7.33°C/W @ 100 LFM
Attachment Method: Push Pin
Description: HEATSINK 30X30X20MM R-TAB T766
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 7.33°C/W @ 100 LFM
Attachment Method: Push Pin
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.45 EUR |
| 10+ | 9.26 EUR |
| 25+ | 8.83 EUR |
| ATS-20H-199-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 50X50X6MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.236" (6.00mm)
Thermal Resistance @ Forced Air Flow: 15.83°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 50X50X6MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.236" (6.00mm)
Thermal Resistance @ Forced Air Flow: 15.83°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.64 EUR |
| 10+ | 9.41 EUR |
| 25+ | 8.96 EUR |
| ATS-20H-77-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 25X25X30MM R-TAB T766
Material Finish: Blue Anodized
Fin Height: 1.181" (30.00mm)
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 25X25X30MM R-TAB T766
Material Finish: Blue Anodized
Fin Height: 1.181" (30.00mm)
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.7 EUR |
| 10+ | 9.47 EUR |
| 25+ | 9.02 EUR |
| ATS-20H-56-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X15MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 17.72°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.378" (35.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 35X35X15MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 17.72°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.378" (35.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.77 EUR |
| 10+ | 9.53 EUR |
| 25+ | 9.08 EUR |
| ATS-20H-78-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 25X25X35MM R-TAB T766
Material Finish: Blue Anodized
Fin Height: 1.378" (35.00mm)
Thermal Resistance @ Forced Air Flow: 7.71°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 25X25X35MM R-TAB T766
Material Finish: Blue Anodized
Fin Height: 1.378" (35.00mm)
Thermal Resistance @ Forced Air Flow: 7.71°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.85 EUR |
| 10+ | 9.59 EUR |
| 25+ | 9.14 EUR |
| ATS-20H-173-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X30MM R-TAB T766
Material Finish: Blue Anodized
Fin Height: 1.181" (30.00mm)
Thermal Resistance @ Forced Air Flow: 4.72°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 30X30X30MM R-TAB T766
Material Finish: Blue Anodized
Fin Height: 1.181" (30.00mm)
Thermal Resistance @ Forced Air Flow: 4.72°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.94 EUR |
| 10+ | 9.69 EUR |
| 25+ | 9.22 EUR |
| ATS-20H-176-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X15MM R-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 8.59°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.378" (35.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 35X35X15MM R-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 8.59°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.378" (35.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.06 EUR |
| 10+ | 9.77 EUR |
| 25+ | 9.31 EUR |
| ATS-20H-57-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X20MM L-TAB T766
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 13.16°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.378" (35.00mm)
Description: HEATSINK 35X35X20MM L-TAB T766
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 13.16°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.378" (35.00mm)
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.08 EUR |
| 10+ | 9.81 EUR |
| 25+ | 9.34 EUR |
| ATS-01D-88-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X25MM R-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.984" (25.00mm)
Thermal Resistance @ Forced Air Flow: 10.11°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.378" (35.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 35X35X25MM R-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.984" (25.00mm)
Thermal Resistance @ Forced Air Flow: 10.11°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.378" (35.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.3 EUR |
| 10+ | 10.01 EUR |
| 25+ | 9.54 EUR |
| ATS-20H-62-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X15MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 16.48°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.575" (40.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.575" (40.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 40X40X15MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 16.48°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.575" (40.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.575" (40.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.38 EUR |
| 10+ | 10.07 EUR |
| 25+ | 9.59 EUR |
| ATS-17C-204-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 54X54X12MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.472" (12.00mm)
Thermal Resistance @ Forced Air Flow: 7.43°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.126" (54.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.126" (54.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 54X54X12MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.472" (12.00mm)
Thermal Resistance @ Forced Air Flow: 7.43°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.126" (54.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.126" (54.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.71 EUR |
| 10+ | 10.38 EUR |
| 25+ | 9.88 EUR |
| ATS-18G-189-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X20MM R-TAB T766
Packaging: Tray
Material: Aluminum
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Width: 1.772" (45.00mm)
Type: Top Mount
Thermal Resistance @ Forced Air Flow: 4.74°C/W @ 100 LFM
Shape: Square, Fins
Length: 1.772" (45.00mm)
Description: HEATSINK 45X45X20MM R-TAB T766
Packaging: Tray
Material: Aluminum
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Width: 1.772" (45.00mm)
Type: Top Mount
Thermal Resistance @ Forced Air Flow: 4.74°C/W @ 100 LFM
Shape: Square, Fins
Length: 1.772" (45.00mm)
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.73 EUR |
| 10+ | 11.27 EUR |
| 25+ | 10.73 EUR |
| ATS-21C-42-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 57.9X60.96X22.86MM T766
Material Finish: Blue Anodized
Fin Height: 0.900" (22.86mm)
Thermal Resistance @ Forced Air Flow: 7.31°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.400" (60.96mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Material: Aluminum
Packaging: Bulk
Description: HEATSINK 57.9X60.96X22.86MM T766
Material Finish: Blue Anodized
Fin Height: 0.900" (22.86mm)
Thermal Resistance @ Forced Air Flow: 7.31°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.400" (60.96mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.29 EUR |
| 10+ | 17.06 EUR |
| 25+ | 16.26 EUR |
| ATS-21C-26-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 70X70X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 14.20°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.756" (70.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.756" (70.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 70X70X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 14.20°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.756" (70.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.756" (70.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.35 EUR |
| 10+ | 17.12 EUR |
| 25+ | 16.31 EUR |
| ATS-21C-28-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 70X70X15MM XCUT T766
Shape: Square, Fins
Length: 2.756" (70.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 10.58°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.756" (70.00mm)
Type: Top Mount
Description: HEATSINK 70X70X15MM XCUT T766
Shape: Square, Fins
Length: 2.756" (70.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 10.58°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.756" (70.00mm)
Type: Top Mount
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.8 EUR |
| 10+ | 18.4 EUR |
| 25+ | 17.52 EUR |
| ATS-21C-138-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 25X25X15MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 12.18°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 25X25X15MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 12.18°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.17 EUR |
| 10+ | 8.12 EUR |
| 25+ | 7.74 EUR |
| ATS-21C-139-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 25X25X20MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 25X25X20MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.32 EUR |
| 10+ | 8.23 EUR |
| 25+ | 7.85 EUR |
| ATS-21C-194-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 13.07°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.575" (40.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.575" (40.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 40X40X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 13.07°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.575" (40.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.575" (40.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.48 EUR |
| 10+ | 8.39 EUR |
| 25+ | 8 EUR |
| ATS-21C-76-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 25X25X25MM R-TAB T766
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.984" (25.00mm)
Thermal Resistance @ Forced Air Flow: 11.57°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Description: HEATSINK 25X25X25MM R-TAB T766
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.984" (25.00mm)
Thermal Resistance @ Forced Air Flow: 11.57°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.78 EUR |
| 10+ | 8.66 EUR |
| 25+ | 8.25 EUR |
| ATS-21C-117-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 10.48°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.772" (45.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.772" (45.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 45X45X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 10.48°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.772" (45.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.772" (45.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.06 EUR |
| 10+ | 8.9 EUR |
| 25+ | 8.48 EUR |
| ATS-21C-142-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X15MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 10.07°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 30X30X15MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 10.07°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.28 EUR |
| 10+ | 9.12 EUR |














