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XC7S50-1FTGB196Q XC7S50-1FTGB196Q AMD ds180_7Series_Overview Description: IC FPGA 100 I/O 196CSBGA
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LBGA, CSPBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Active
Total RAM Bits: 2764800
Number of LABs/CLBs: 4075
Supplier Device Package: 196-CSBGA (15x15)
Number of Logic Elements/Cells: 52160
Produkt ist nicht verfügbar
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XCVU31P-1FSVH1924E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 208 I/O 1924FCBGA
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 208
Total RAM Bits: 24746394
Number of LABs/CLBs: 54960
Supplier Device Package: 1924-FCBGA (45x45)
Number of Logic Elements/Cells: 961800
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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XC7S25-1FTGB196Q XC7S25-1FTGB196Q AMD ds180_7Series_Overview Description: IC FPGA 100 I/O 196CSBGA
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Active
Total RAM Bits: 1658880
Number of LABs/CLBs: 1825
Supplier Device Package: 196-CSBGA (15x15)
Number of Logic Elements/Cells: 23360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LBGA, CSPBGA
Packaging: Tray
Produkt ist nicht verfügbar
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A-U50DD-P00G-ES3-G A-U50DD-P00G-ES3-G AMD oL1ODQjXHi5LZ_4pOY9k0A Description: BOARD DCAB ALVEO U50 NET PASSIVE
LUTs: 872k
Cooling Type: Heat Sink
Bandwidth: 201GB/s
Operating Temperature: 0°C ~ 50°C
Interface: PCI Express
Memory Size: 8GB
Power (Watts): 75W
Packaging: Box
Produkt ist nicht verfügbar
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XC95288XV-7FG256C XC95288XV-7FG256C AMD LuSrx_iH3TbPJYzmW5yYRw Description: IC CPLD 288MC 7.5NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.37V ~ 2.62V
Number of I/O: 192
DigiKey Programmable: Not Verified
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EK-U1-VCU129-G EK-U1-VCU129-G AMD ug1318-vcu129-eval-bd.pdf Description: KIT DEV VCU129 VIRTEX US+ 56G
Packaging: Box
For Use With/Related Products: XCVU29P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCVU29P
Platform: Virtex UltraScale+ FPGA VCU129
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XC2C64A-7PCG44I XC2C64A-7PCG44I AMD ds311.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC2C64A-7PC44C XC2C64A-7PC44C AMD ds311.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XV-5CS144C XC95144XV-5CS144C AMD XILIS01084-1.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 5NS, 144-CELL PBGA144
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
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XC95144XV-7CS144C XC95144XV-7CS144C AMD XILIS01084-1.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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XC2C64A-7PCG44C XC2C64A-7PCG44C AMD ds311.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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EK-U1-ZCU216-ES1-G EK-U1-ZCU216-ES1-G AMD 8YUx5iwNdanfFYyfRSKDHg Description: ZYNQ US+ RFSOC ZCU216 ES1 EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU49DR
Platform: Zynq UltraScale+ RFSoC ZCU216 ES1
Produkt ist nicht verfügbar
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XCVU35P-1FSVH2892E XCVU35P-1FSVH2892E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU35P-2FSVH2892E XCVU35P-2FSVH2892E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
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XCVU35P-L2FSVH2892E XCVU35P-L2FSVH2892E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
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XCVU35P-3FSVH2892E XCVU35P-3FSVH2892E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU47P-2FSVH2892E XCVU47P-2FSVH2892E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
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XCVU47P-L2FSVH2892E XCVU47P-L2FSVH2892E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
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XCVU47P-3FSVH2892E XCVU47P-3FSVH2892E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LMS-EMBD-SDSOC AMD Description: TRAINING CREDIT SDSOC DEV METHOD
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
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XCZU4EG-L1SFVC784I XCZU4EG-L1SFVC784I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-L1FBVB900I XCZU4EG-L1FBVB900I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
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XCZU6EG-L1FFVC900I XCZU6EG-L1FFVC900I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU6EG-L1FFVB1156I XCZU6EG-L1FFVB1156I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EG-L1FFVC1156I XCZU7EG-L1FFVC1156I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU11EG-L1FFVC1156I XCZU11EG-L1FFVC1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU15EG-L1FFVB1156I XCZU15EG-L1FFVB1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
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XCZU19EG-L1FFVB1517I XCZU19EG-L1FFVB1517I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU19EG-L1FFVC1760I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCVU160-2FLGB2104E AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
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XCVU160-2FLGB2104I AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU3P-1SFVB784E XCKU3P-1SFVB784E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 304 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU3P-1FFVA676E XCKU3P-1FFVA676E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
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XCKU3P-1SFVB784I XCKU3P-1SFVB784I AMD ds922-kintex-ultrascale-plus Description: IC FPGA 256 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
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XCKU3P-1FFVD900I XCKU3P-1FFVD900I AMD ds922-kintex-ultrascale-plus Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU3P-2SFVB784E XCKU3P-2SFVB784E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 304 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-2FFVA676E XCKU3P-2FFVA676E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-2FFVD900E XCKU3P-2FFVD900E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-2SFVB784I XCKU3P-2SFVB784I AMD ds922-kintex-ultrascale-plus Description: IC FPGA 304 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-2FFVA676I XCKU3P-2FFVA676I AMD ds922-kintex-ultrascale-plus Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-2FFVD900I XCKU3P-2FFVD900I AMD ds922-kintex-ultrascale-plus Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-2FFVB676I XCKU3P-2FFVB676I AMD ds922-kintex-ultrascale-plus Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XC3164A-09TQ144C XC3164A-09TQ144C AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 224 CLBS, 3500 GATES
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 4500
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.25V ~ 5.25V
Number of Logic Elements/Cells: 224
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 224
Total RAM Bits: 46064
Part Status: Active
Number of I/O: 120
DigiKey Programmable: Not Verified
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XC6SLX100-2FGG484C XC6SLX100-2FGG484C AMD ds162 Description: IC FPGA 326 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 101261
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 7911
Total RAM Bits: 4939776
Part Status: Active
Number of I/O: 326
DigiKey Programmable: Not Verified
auf Bestellung 118 Stücke:
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1+414.27 EUR
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EF-SDACCEL-FL AMD Description: SW SDACCEL OPENCL DEV ENVIRONMEN
Media Delivery Type: Electronically Delivered
License - User Details: Floating Node
Applications: Programming
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
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EFR-DI-3RD-PARTY-LIC AMD Description: IP R 3RD PARTY PROVIDER LIC GEN
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Media Delivery Type: Electronically Delivered
License Length: 1 Year Renewal
Type: License
Produkt ist nicht verfügbar
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XC2S15-5CS144I AMD ds001 Description: IC FPGA 86 I/O 144CSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 15000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 432
Supplier Device Package: 144-LCSBGA (12x12)
Number of LABs/CLBs: 96
Total RAM Bits: 16384
Number of I/O: 86
DigiKey Programmable: Not Verified
auf Bestellung 1896 Stücke:
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69+8.4 EUR
Mindestbestellmenge: 69 Stücke
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XC9572XL-7PC44I XC9572XL-7PC44I AMD ds054.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 7.5NS, 72-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCS20XL-4CS144C AMD ds060 Description: IC FPGA 113 I/O 144CSBGA
Number of I/O: 113
Part Status: Obsolete
Total RAM Bits: 12800
Number of LABs/CLBs: 400
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Cells: 950
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 20000
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
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29+18.78 EUR
Mindestbestellmenge: 29 Stücke
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XCR3032XL-10VQ44Q0789 XCR3032XL-10VQ44Q0789 AMD ds012.pdf?t.download=true&u=ovmfp3 Description: EE PLD, 10NS, CMOS
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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XCR3032XL-10VQ44Q XCR3032XL-10VQ44Q AMD ds012.pdf?t.download=true&u=ovmfp3 Description: EE PLD, 10NS, CMOS, PQFP44
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EK-U1-ZCU102-G-ED EK-U1-ZCU102-G-ED AMD ug1182-zcu102-eval-bd.pdf Description: KIT EVAL ZYNQUS+ MPSOC ZCU102 ED
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU9EG
Platform: Zynq UltraScale+ MPSoC ZCU102 Encryption Disabled
Part Status: Active
Produkt ist nicht verfügbar
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EK-U1-ZCU102-G-J EK-U1-ZCU102-G-J AMD ug1182-zcu102-eval-bd.pdf Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Utilized IC / Part: XCZU9EG
Platform: Zynq UltraScale+ MPSoC ZCU102 Japan
Part Status: Active
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1+6395.04 EUR
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EF-DI-25GBASE-KR-RLL AMD Description: LICENSE LTD REDISTRIBUTION 25GBA
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Redistribution Limited
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
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EF-DI-25GEMAC-RLL AMD Description: LICENSE LTD REDISTRIBUTION 25GEM
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Redistribution Limited
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
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EFR-DI-25GBASE-KR-RLL AMD 10g_25g-HighSpeedEthernet_Jun6_2018.pdf Description: LICENSE LTD REDISTRIBUTION 25GBA
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Redistribution Limited
License Length: 1 Year Renewal
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
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EFR-DI-25GEMAC-RLL AMD 10g_25g-HighSpeedEthernet_Jun6_2018.pdf Description: LICENSE LTD REDISTRIBUTION 25GEM
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Redistribution Limited
License Length: 1 Year Renewal
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
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XCV400-4BG560I AMD Virtex_2.5_V.pdf Description: IC FPGA 404 I/O 560MBGA
Packaging: Bulk
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 404
DigiKey Programmable: Not Verified
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1+1075.62 EUR
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XC4036XLA-09BG432C XC4036XLA-09BG432C AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 1296 CLBS, 22000 GATES
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 22000
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 1296
DigiKey Programmable: Not Verified
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2+327.61 EUR
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XC4052XLA-08BG432C XC4052XLA-08BG432C AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 352
DigiKey Programmable: Not Verified
auf Bestellung 38 Stücke:
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1+702.72 EUR
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XC7S50-1FTGB196Q ds180_7Series_Overview
XC7S50-1FTGB196Q
Hersteller: AMD
Description: IC FPGA 100 I/O 196CSBGA
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LBGA, CSPBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Active
Total RAM Bits: 2764800
Number of LABs/CLBs: 4075
Supplier Device Package: 196-CSBGA (15x15)
Number of Logic Elements/Cells: 52160
Produkt ist nicht verfügbar
Mindestbestellmenge: 5 Stücke
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XCVU31P-1FSVH1924E GnuVZDIoTcrlIuu8Aok5XQ
Hersteller: AMD
Description: IC FPGA 208 I/O 1924FCBGA
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 208
Total RAM Bits: 24746394
Number of LABs/CLBs: 54960
Supplier Device Package: 1924-FCBGA (45x45)
Number of Logic Elements/Cells: 961800
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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XC7S25-1FTGB196Q ds180_7Series_Overview
XC7S25-1FTGB196Q
Hersteller: AMD
Description: IC FPGA 100 I/O 196CSBGA
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Active
Total RAM Bits: 1658880
Number of LABs/CLBs: 1825
Supplier Device Package: 196-CSBGA (15x15)
Number of Logic Elements/Cells: 23360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LBGA, CSPBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 8 Stücke
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A-U50DD-P00G-ES3-G oL1ODQjXHi5LZ_4pOY9k0A
A-U50DD-P00G-ES3-G
Hersteller: AMD
Description: BOARD DCAB ALVEO U50 NET PASSIVE
LUTs: 872k
Cooling Type: Heat Sink
Bandwidth: 201GB/s
Operating Temperature: 0°C ~ 50°C
Interface: PCI Express
Memory Size: 8GB
Power (Watts): 75W
Packaging: Box
Produkt ist nicht verfügbar
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XC95288XV-7FG256C LuSrx_iH3TbPJYzmW5yYRw
XC95288XV-7FG256C
Hersteller: AMD
Description: IC CPLD 288MC 7.5NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.37V ~ 2.62V
Number of I/O: 192
DigiKey Programmable: Not Verified
auf Bestellung 615 Stücke:
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AnzahlPrivatkunde
31+17.81 EUR
Mindestbestellmenge: 31 Stücke
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EK-U1-VCU129-G ug1318-vcu129-eval-bd.pdf
EK-U1-VCU129-G
Hersteller: AMD
Description: KIT DEV VCU129 VIRTEX US+ 56G
Packaging: Box
For Use With/Related Products: XCVU29P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCVU29P
Platform: Virtex UltraScale+ FPGA VCU129
auf Bestellung 2 Stücke:
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AnzahlPrivatkunde
1+42548.82 EUR
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XC2C64A-7PCG44I ds311.pdf?t.download=true&u=ovmfp3
XC2C64A-7PCG44I
Hersteller: AMD
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC2C64A-7PC44C ds311.pdf?t.download=true&u=ovmfp3
XC2C64A-7PC44C
Hersteller: AMD
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XV-5CS144C XILIS01084-1.pdf?t.download=true&u=ovmfp3
XC95144XV-5CS144C
Hersteller: AMD
Description: FLASH PLD, 5NS, 144-CELL PBGA144
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 1093 Stücke:
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AnzahlPrivatkunde
18+29.51 EUR
Mindestbestellmenge: 18 Stücke
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XC95144XV-7CS144C XILIS01084-1.pdf?t.download=true&u=ovmfp3
XC95144XV-7CS144C
Hersteller: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1459 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
27+19.96 EUR
Mindestbestellmenge: 27 Stücke
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XC2C64A-7PCG44C ds311.pdf?t.download=true&u=ovmfp3
XC2C64A-7PCG44C
Hersteller: AMD
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EK-U1-ZCU216-ES1-G 8YUx5iwNdanfFYyfRSKDHg
EK-U1-ZCU216-ES1-G
Hersteller: AMD
Description: ZYNQ US+ RFSOC ZCU216 ES1 EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU49DR
Platform: Zynq UltraScale+ RFSoC ZCU216 ES1
Produkt ist nicht verfügbar
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XCVU35P-1FSVH2892E GnuVZDIoTcrlIuu8Aok5XQ
XCVU35P-1FSVH2892E
Hersteller: AMD
Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU35P-2FSVH2892E GnuVZDIoTcrlIuu8Aok5XQ
XCVU35P-2FSVH2892E
Hersteller: AMD
Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU35P-L2FSVH2892E GnuVZDIoTcrlIuu8Aok5XQ
XCVU35P-L2FSVH2892E
Hersteller: AMD
Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU35P-3FSVH2892E GnuVZDIoTcrlIuu8Aok5XQ
XCVU35P-3FSVH2892E
Hersteller: AMD
Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU47P-2FSVH2892E ds923-virtex-ultrascale-plus
XCVU47P-2FSVH2892E
Hersteller: AMD
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU47P-L2FSVH2892E ds923-virtex-ultrascale-plus
XCVU47P-L2FSVH2892E
Hersteller: AMD
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU47P-3FSVH2892E ds923-virtex-ultrascale-plus
XCVU47P-3FSVH2892E
Hersteller: AMD
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LMS-EMBD-SDSOC
Hersteller: AMD
Description: TRAINING CREDIT SDSOC DEV METHOD
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
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XCZU4EG-L1SFVC784I jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-L1SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-L1FBVB900I jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-L1FBVB900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU6EG-L1FFVC900I jDqbmrrvy_u9hmwDv1iWBQ
XCZU6EG-L1FFVC900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU6EG-L1FFVB1156I jDqbmrrvy_u9hmwDv1iWBQ
XCZU6EG-L1FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EG-L1FFVC1156I jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EG-L1FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU11EG-L1FFVC1156I ds891-zynq-ultrascale-plus-overview
XCZU11EG-L1FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU15EG-L1FFVB1156I ds891-zynq-ultrascale-plus-overview
XCZU15EG-L1FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Produkt ist nicht verfügbar
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XCZU19EG-L1FFVB1517I ds891-zynq-ultrascale-plus-overview
XCZU19EG-L1FFVB1517I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU19EG-L1FFVC1760I ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCVU160-2FLGB2104E O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU160-2FLGB2104I O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU3P-1SFVB784E ds922-kintex-ultrascale-plus
XCKU3P-1SFVB784E
Hersteller: AMD
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU3P-1FFVA676E ds922-kintex-ultrascale-plus
XCKU3P-1FFVA676E
Hersteller: AMD
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-1SFVB784I ds922-kintex-ultrascale-plus
XCKU3P-1SFVB784I
Hersteller: AMD
Description: IC FPGA 256 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-1FFVD900I ds922-kintex-ultrascale-plus
XCKU3P-1FFVD900I
Hersteller: AMD
Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-2SFVB784E ds922-kintex-ultrascale-plus
XCKU3P-2SFVB784E
Hersteller: AMD
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU3P-2FFVA676E ds922-kintex-ultrascale-plus
XCKU3P-2FFVA676E
Hersteller: AMD
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU3P-2FFVD900E ds922-kintex-ultrascale-plus
XCKU3P-2FFVD900E
Hersteller: AMD
Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU3P-2SFVB784I ds922-kintex-ultrascale-plus
XCKU3P-2SFVB784I
Hersteller: AMD
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU3P-2FFVA676I ds922-kintex-ultrascale-plus
XCKU3P-2FFVA676I
Hersteller: AMD
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU3P-2FFVD900I ds922-kintex-ultrascale-plus
XCKU3P-2FFVD900I
Hersteller: AMD
Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU3P-2FFVB676I ds922-kintex-ultrascale-plus
XCKU3P-2FFVB676I
Hersteller: AMD
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XC3164A-09TQ144C 1153000.pdf?t.download=true&u=ovmfp3
XC3164A-09TQ144C
Hersteller: AMD
Description: FPGA, 224 CLBS, 3500 GATES
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 4500
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.25V ~ 5.25V
Number of Logic Elements/Cells: 224
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 224
Total RAM Bits: 46064
Part Status: Active
Number of I/O: 120
DigiKey Programmable: Not Verified
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
11+51.92 EUR
Mindestbestellmenge: 11 Stücke
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XC6SLX100-2FGG484C ds162
XC6SLX100-2FGG484C
Hersteller: AMD
Description: IC FPGA 326 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 101261
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 7911
Total RAM Bits: 4939776
Part Status: Active
Number of I/O: 326
DigiKey Programmable: Not Verified
auf Bestellung 118 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+414.27 EUR
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EF-SDACCEL-FL
Hersteller: AMD
Description: SW SDACCEL OPENCL DEV ENVIRONMEN
Media Delivery Type: Electronically Delivered
License - User Details: Floating Node
Applications: Programming
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
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EFR-DI-3RD-PARTY-LIC
Hersteller: AMD
Description: IP R 3RD PARTY PROVIDER LIC GEN
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Media Delivery Type: Electronically Delivered
License Length: 1 Year Renewal
Type: License
Produkt ist nicht verfügbar
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XC2S15-5CS144I ds001
Hersteller: AMD
Description: IC FPGA 86 I/O 144CSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 15000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 432
Supplier Device Package: 144-LCSBGA (12x12)
Number of LABs/CLBs: 96
Total RAM Bits: 16384
Number of I/O: 86
DigiKey Programmable: Not Verified
auf Bestellung 1896 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
69+8.4 EUR
Mindestbestellmenge: 69 Stücke
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XC9572XL-7PC44I ds054.pdf?t.download=true&u=ovmfp3
XC9572XL-7PC44I
Hersteller: AMD
Description: FLASH PLD, 7.5NS, 72-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCS20XL-4CS144C ds060
Hersteller: AMD
Description: IC FPGA 113 I/O 144CSBGA
Number of I/O: 113
Part Status: Obsolete
Total RAM Bits: 12800
Number of LABs/CLBs: 400
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Cells: 950
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 20000
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 617 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
29+18.78 EUR
Mindestbestellmenge: 29 Stücke
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XCR3032XL-10VQ44Q0789 ds012.pdf?t.download=true&u=ovmfp3
XCR3032XL-10VQ44Q0789
Hersteller: AMD
Description: EE PLD, 10NS, CMOS
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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XCR3032XL-10VQ44Q ds012.pdf?t.download=true&u=ovmfp3
XCR3032XL-10VQ44Q
Hersteller: AMD
Description: EE PLD, 10NS, CMOS, PQFP44
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EK-U1-ZCU102-G-ED ug1182-zcu102-eval-bd.pdf
EK-U1-ZCU102-G-ED
Hersteller: AMD
Description: KIT EVAL ZYNQUS+ MPSOC ZCU102 ED
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU9EG
Platform: Zynq UltraScale+ MPSoC ZCU102 Encryption Disabled
Part Status: Active
Produkt ist nicht verfügbar
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EK-U1-ZCU102-G-J ug1182-zcu102-eval-bd.pdf
EK-U1-ZCU102-G-J
Hersteller: AMD
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Utilized IC / Part: XCZU9EG
Platform: Zynq UltraScale+ MPSoC ZCU102 Japan
Part Status: Active
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Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+6395.04 EUR
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EF-DI-25GBASE-KR-RLL
Hersteller: AMD
Description: LICENSE LTD REDISTRIBUTION 25GBA
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Redistribution Limited
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
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EF-DI-25GEMAC-RLL
Hersteller: AMD
Description: LICENSE LTD REDISTRIBUTION 25GEM
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Redistribution Limited
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
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EFR-DI-25GBASE-KR-RLL 10g_25g-HighSpeedEthernet_Jun6_2018.pdf
Hersteller: AMD
Description: LICENSE LTD REDISTRIBUTION 25GBA
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Redistribution Limited
License Length: 1 Year Renewal
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
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EFR-DI-25GEMAC-RLL 10g_25g-HighSpeedEthernet_Jun6_2018.pdf
Hersteller: AMD
Description: LICENSE LTD REDISTRIBUTION 25GEM
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Redistribution Limited
License Length: 1 Year Renewal
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
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XCV400-4BG560I Virtex_2.5_V.pdf
Hersteller: AMD
Description: IC FPGA 404 I/O 560MBGA
Packaging: Bulk
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 404
DigiKey Programmable: Not Verified
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+1075.62 EUR
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XC4036XLA-09BG432C 4000.pdf?t.download=true&u=ovmfp3
XC4036XLA-09BG432C
Hersteller: AMD
Description: FPGA, 1296 CLBS, 22000 GATES
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 22000
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 1296
DigiKey Programmable: Not Verified
auf Bestellung 16 Stücke:
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AnzahlPrivatkunde
2+327.61 EUR
Mindestbestellmenge: 2 Stücke
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XC4052XLA-08BG432C 4000.pdf?t.download=true&u=ovmfp3
XC4052XLA-08BG432C
Hersteller: AMD
Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 352
DigiKey Programmable: Not Verified
auf Bestellung 38 Stücke:
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AnzahlPrivatkunde
1+702.72 EUR
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