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XCV400-5HQ240I AMD Virtex_2.5_V.pdf Description: IC FPGA 166 I/O 240QFP
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
auf Bestellung 6 Stücke:
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1+942.81 EUR
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XCR3256XL-12FT256C XCR3256XL-12FT256C AMD ds013 Description: IC CPLD 256MC 10.8NS 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-12TQ144I XCR3256XL-12TQ144I AMD ds013 Description: IC CPLD 256MC 10.8NS 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-12PQ208I XCR3256XL-12PQ208I AMD ds013 Description: IC CPLD 256MC 10.8NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-10TQ144C XCR3256XL-10TQ144C AMD ds013 Description: IC CPLD 256MC 9.1NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-10PQ208C XCR3256XL-10PQ208C AMD ds013 Description: IC CPLD 256MC 9.1NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-12FT256I XCR3256XL-12FT256I AMD ds013 Description: IC CPLD 256MC 10.8NS 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-10PQ208I XCR3256XL-10PQ208I AMD ds013 Description: IC CPLD 256MC 9.1NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-10CS280I AMD ds013 Description: IC CPLD 256MC 9.1NS 280CSBGA
Packaging: Bulk
Package / Case: 280-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 280-CSBGA (16x16)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-7FT256C XCR3256XL-7FT256C AMD ds013 Description: IC CPLD 256MC 7NS 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EK-U1-ZCU208-G AMD ug1410-zcu208-eval-bd.pdf Description: ZYNQ US+ RFSOC ZCU208 EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU208
Part Status: Obsolete
Produkt ist nicht verfügbar
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EK-U1-ZCU208-V1-G EK-U1-ZCU208-V1-G AMD xilinx-zcu208-product-brief.pdf Description: ZYNQ US+ RFSOC ZCU208 V1 EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU208 V1
Part Status: Active
Utilized IC / Part: XCZU48DR
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EK-U1-ZCU208-V1-G-J AMD xilinx-zcu208-product-brief.pdf Description: ZYNQ US+ RFSOC ZCU208 V1 J EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU208 V1 Japan
Utilized IC / Part: XCZU48DR
Produkt ist nicht verfügbar
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XC3195-5PC84C0090 AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
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XCZU7CG-1FFVC1156I XCZU7CG-1FFVC1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7CG-1FFVC1156E XCZU7CG-1FFVC1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7CG-1FFVF1517I XCZU7CG-1FFVF1517I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7CG-L1FFVC1156I XCZU7CG-L1FFVC1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7CG-2FFVC1156E XCZU7CG-2FFVC1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7CG-2FFVC1156I XCZU7CG-2FFVC1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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HW-SMARTLYNQ-PLUS-G HW-SMARTLYNQ-PLUS-G AMD xilinx-smartlyqn-module-product-brief.pdf Description: SMARTLYNQ+ VERSAL DATA CABLE
Packaging: Box
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FPGA
auf Bestellung 22 Stücke:
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1+7768.39 EUR
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XCVU33P-1FSVH2104E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 208 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Number of I/O: 208
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU33P-2FSVH2104E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 208 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Number of I/O: 208
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU35P-1FSVH2104E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU33P-L2FSVH2104E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 208 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Number of I/O: 208
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU33P-3FSVH2104E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 208 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Number of I/O: 208
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU45P-1FSVH2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU35P-2FSVH2104E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU35P-L2FSVH2104E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU45P-2FSVH2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU35P-3FSVH2104E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU45P-L2FSVH2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU45P-3FSVH2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4062XL-3HQ240C0624 XC4062XL-3HQ240C0624 AMD XILIS01358-1.pdf?t.download=true&u=5oefqw Description: FPGA, 2304 CLBS, 40000 GATES
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Part Status: Active
Number of I/O: 193
DigiKey Programmable: Not Verified
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
2+300.84 EUR
Mindestbestellmenge: 2
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XC4062XL-3BG432C AMD 4000.pdf Description: IC FPGA 352 I/O 432MBGA
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
2+379.83 EUR
Mindestbestellmenge: 2
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XC4052XLA-09HQ208C XC4052XLA-09HQ208C AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 160
DigiKey Programmable: Not Verified
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XC5210-5PQG208C XC5210-5PQG208C AMD 1605200.pdf?t.download=true&u=ovmfp3 Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1296
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Number of I/O: 164
DigiKey Programmable: Not Verified
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EF-VIVADO-ENTER-NL AMD Description: VIVADO ENTERPRISE NODE-LOCKED
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: Integrated Software Environment (ISE)
Applications: Programming
Operating System: Linux, Windows
Edition: Enterprise
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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XC1765ELPC20C XC1765ELPC20C AMD ds027 Description: IC PROM SER C-TEMP 3.3V 20-PLCC
Packaging: Tube
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
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51+9.68 EUR
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XC1765ELVOG8C XC1765ELVOG8C AMD ds027 Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
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XC95144XV-5TQG100C AMD XILIS01084-1.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XV-7CSG144C XC95144XV-7CSG144C AMD XILIS01084-1.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 978 Stücke:
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31+16.34 EUR
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XC95144XV-7TQ144I XC95144XV-7TQ144I AMD XILIS01084-1.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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XC95144XV-5TQ100C XC95144XV-5TQ100C AMD XILIS01084-1.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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24+21.52 EUR
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XC95288XV-6PQ208C XC95288XV-6PQ208C AMD ds050.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 6NS, 288-CELL PQFP208
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 392 Stücke:
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XC4028XL-3HQ208I XC4028XL-3HQ208I AMD 4000.pdf Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 123 Stücke:
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5+109.32 EUR
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XCZU7EG-1FFVC1156E XCZU7EG-1FFVC1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EV-1FFVC1156E XCZU7EV-1FFVC1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EG-1FFVC1156I XCZU7EG-1FFVC1156I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EV-1FFVC1156I XCZU7EV-1FFVC1156I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU11EG-1FFVC1156E XCZU11EG-1FFVC1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EG-2FFVC1156E XCZU7EG-2FFVC1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EV-2FFVC1156E XCZU7EV-2FFVC1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EV-L1FFVC1156I XCZU7EV-L1FFVC1156I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EG-2FFVC1156I XCZU7EG-2FFVC1156I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU11EG-1FFVC1156I XCZU11EG-1FFVC1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU11EG-2FFVC1156E XCZU11EG-2FFVC1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EG-3FFVC1156E XCZU7EG-3FFVC1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU11EG-2FFVC1156I XCZU11EG-2FFVC1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU11EG-L2FFVC1156E XCZU11EG-L2FFVC1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCV400-5HQ240I Virtex_2.5_V.pdf
Hersteller: AMD
Description: IC FPGA 166 I/O 240QFP
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
auf Bestellung 6 Stücke:
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Anzahl Preis
1+942.81 EUR
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XCR3256XL-12FT256C ds013
XCR3256XL-12FT256C
Hersteller: AMD
Description: IC CPLD 256MC 10.8NS 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-12TQ144I ds013
XCR3256XL-12TQ144I
Hersteller: AMD
Description: IC CPLD 256MC 10.8NS 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-12PQ208I ds013
XCR3256XL-12PQ208I
Hersteller: AMD
Description: IC CPLD 256MC 10.8NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-10TQ144C ds013
XCR3256XL-10TQ144C
Hersteller: AMD
Description: IC CPLD 256MC 9.1NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-10PQ208C ds013
XCR3256XL-10PQ208C
Hersteller: AMD
Description: IC CPLD 256MC 9.1NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-12FT256I ds013
XCR3256XL-12FT256I
Hersteller: AMD
Description: IC CPLD 256MC 10.8NS 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCR3256XL-10PQ208I ds013
XCR3256XL-10PQ208I
Hersteller: AMD
Description: IC CPLD 256MC 9.1NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCR3256XL-10CS280I ds013
Hersteller: AMD
Description: IC CPLD 256MC 9.1NS 280CSBGA
Packaging: Bulk
Package / Case: 280-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 280-CSBGA (16x16)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCR3256XL-7FT256C ds013
XCR3256XL-7FT256C
Hersteller: AMD
Description: IC CPLD 256MC 7NS 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-ZCU208-G ug1410-zcu208-eval-bd.pdf
Hersteller: AMD
Description: ZYNQ US+ RFSOC ZCU208 EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU208
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-ZCU208-V1-G xilinx-zcu208-product-brief.pdf
EK-U1-ZCU208-V1-G
Hersteller: AMD
Description: ZYNQ US+ RFSOC ZCU208 V1 EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU208 V1
Part Status: Active
Utilized IC / Part: XCZU48DR
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+28666.42 EUR
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EK-U1-ZCU208-V1-G-J xilinx-zcu208-product-brief.pdf
Hersteller: AMD
Description: ZYNQ US+ RFSOC ZCU208 V1 J EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU208 V1 Japan
Utilized IC / Part: XCZU48DR
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3195-5PC84C0090 1153000.pdf?t.download=true&u=ovmfp3
Hersteller: AMD
Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+50.34 EUR
Mindestbestellmenge: 10
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7CG-1FFVC1156I ds891-zynq-ultrascale-plus-overview
XCZU7CG-1FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7CG-1FFVC1156E ds891-zynq-ultrascale-plus-overview
XCZU7CG-1FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7CG-1FFVF1517I ds891-zynq-ultrascale-plus-overview
XCZU7CG-1FFVF1517I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7CG-L1FFVC1156I ds891-zynq-ultrascale-plus-overview
XCZU7CG-L1FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7CG-2FFVC1156E ds891-zynq-ultrascale-plus-overview
XCZU7CG-2FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7CG-2FFVC1156I ds891-zynq-ultrascale-plus-overview
XCZU7CG-2FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
HW-SMARTLYNQ-PLUS-G xilinx-smartlyqn-module-product-brief.pdf
HW-SMARTLYNQ-PLUS-G
Hersteller: AMD
Description: SMARTLYNQ+ VERSAL DATA CABLE
Packaging: Box
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FPGA
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+7768.39 EUR
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XCVU33P-1FSVH2104E GnuVZDIoTcrlIuu8Aok5XQ
Hersteller: AMD
Description: IC FPGA 208 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Number of I/O: 208
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU33P-2FSVH2104E GnuVZDIoTcrlIuu8Aok5XQ
Hersteller: AMD
Description: IC FPGA 208 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Number of I/O: 208
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU35P-1FSVH2104E GnuVZDIoTcrlIuu8Aok5XQ
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU33P-L2FSVH2104E GnuVZDIoTcrlIuu8Aok5XQ
Hersteller: AMD
Description: IC FPGA 208 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Number of I/O: 208
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU33P-3FSVH2104E GnuVZDIoTcrlIuu8Aok5XQ
Hersteller: AMD
Description: IC FPGA 208 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Number of I/O: 208
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU45P-1FSVH2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU35P-2FSVH2104E GnuVZDIoTcrlIuu8Aok5XQ
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU35P-L2FSVH2104E GnuVZDIoTcrlIuu8Aok5XQ
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU45P-2FSVH2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU35P-3FSVH2104E GnuVZDIoTcrlIuu8Aok5XQ
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU45P-L2FSVH2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU45P-3FSVH2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC4062XL-3HQ240C0624 XILIS01358-1.pdf?t.download=true&u=5oefqw
XC4062XL-3HQ240C0624
Hersteller: AMD
Description: FPGA, 2304 CLBS, 40000 GATES
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Part Status: Active
Number of I/O: 193
DigiKey Programmable: Not Verified
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+300.84 EUR
Mindestbestellmenge: 2
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XC4062XL-3BG432C 4000.pdf
Hersteller: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+379.83 EUR
Mindestbestellmenge: 2
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XC4052XLA-09HQ208C 4000.pdf?t.download=true&u=ovmfp3
XC4052XLA-09HQ208C
Hersteller: AMD
Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 1189 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+367.08 EUR
Mindestbestellmenge: 2
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XC5210-5PQG208C 1605200.pdf?t.download=true&u=ovmfp3
XC5210-5PQG208C
Hersteller: AMD
Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1296
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Number of I/O: 164
DigiKey Programmable: Not Verified
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+135.80 EUR
Mindestbestellmenge: 4
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EF-VIVADO-ENTER-NL
Hersteller: AMD
Description: VIVADO ENTERPRISE NODE-LOCKED
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: Integrated Software Environment (ISE)
Applications: Programming
Operating System: Linux, Windows
Edition: Enterprise
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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XC1765ELPC20C ds027
XC1765ELPC20C
Hersteller: AMD
Description: IC PROM SER C-TEMP 3.3V 20-PLCC
Packaging: Tube
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
auf Bestellung 4238 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
51+9.68 EUR
Mindestbestellmenge: 51
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XC1765ELVOG8C ds027
XC1765ELVOG8C
Hersteller: AMD
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
auf Bestellung 6809 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
51+9.59 EUR
Mindestbestellmenge: 51
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XC95144XV-5TQG100C XILIS01084-1.pdf?t.download=true&u=ovmfp3
Hersteller: AMD
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC95144XV-7CSG144C XILIS01084-1.pdf?t.download=true&u=ovmfp3
XC95144XV-7CSG144C
Hersteller: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 978 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
31+16.34 EUR
Mindestbestellmenge: 31
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XC95144XV-7TQ144I XILIS01084-1.pdf?t.download=true&u=ovmfp3
XC95144XV-7TQ144I
Hersteller: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
28+18.63 EUR
Mindestbestellmenge: 28
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XC95144XV-5TQ100C XILIS01084-1.pdf?t.download=true&u=ovmfp3
XC95144XV-5TQ100C
Hersteller: AMD
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1364 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
24+21.52 EUR
Mindestbestellmenge: 24
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XC95288XV-6PQ208C ds050.pdf?t.download=true&u=ovmfp3
XC95288XV-6PQ208C
Hersteller: AMD
Description: FLASH PLD, 6NS, 288-CELL PQFP208
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 392 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+49.45 EUR
Mindestbestellmenge: 11
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XC4028XL-3HQ208I 4000.pdf
XC4028XL-3HQ208I
Hersteller: AMD
Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 123 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+109.32 EUR
Mindestbestellmenge: 5
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XCZU7EG-1FFVC1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EG-1FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EV-1FFVC1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EV-1FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EG-1FFVC1156I jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EG-1FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7EV-1FFVC1156I jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EV-1FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU11EG-1FFVC1156E ds891-zynq-ultrascale-plus-overview
XCZU11EG-1FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EG-2FFVC1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EG-2FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7EV-2FFVC1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EV-2FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7EV-L1FFVC1156I jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EV-L1FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7EG-2FFVC1156I jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EG-2FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU11EG-1FFVC1156I ds891-zynq-ultrascale-plus-overview
XCZU11EG-1FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU11EG-2FFVC1156E ds891-zynq-ultrascale-plus-overview
XCZU11EG-2FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7EG-3FFVC1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EG-3FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU11EG-2FFVC1156I ds891-zynq-ultrascale-plus-overview
XCZU11EG-2FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU11EG-L2FFVC1156E ds891-zynq-ultrascale-plus-overview
XCZU11EG-L2FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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