| Foto | Bezeichnung | Hersteller | Beschreibung |
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XC4013XL-3PQ208C | AMD |
 Description: IC FPGA 160 I/O 208QFPPackaging: Bulk Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 13000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 1368 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 576 Total RAM Bits: 18432 Part Status: Obsolete Number of I/O: 160 DigiKey Programmable: Not Verified |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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XC95288XV-7PQ208C | AMD |
Description: IC CPLD 288MC 7.5NS 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 6400 Number of Macrocells: 288 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Blocks: 16 Voltage Supply - Internal: 2.37V ~ 2.62V Part Status: Obsolete Number of I/O: 168 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC95288XL-6PQ208C | AMD |
Description: IC CPLD 288MC 6NS 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Programmable Type: In System Programmable (min 10K program/erase cycles) Number of Gates: 6400 Number of Macrocells: 288 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 6 ns Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Blocks: 16 Voltage Supply - Internal: 3V ~ 3.6V Part Status: Obsolete Number of I/O: 168 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCR3512XL-12PQ208C | AMD |
Description: IC CPLD 512MC 10.8NS 208QFP Packaging: Bulk Package / Case: 208-BFQFP Mounting Type: Surface Mount Programmable Type: In System Programmable (min 1K program/erase cycles) Number of Gates: 12000 Number of Macrocells: 512 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 10.8 ns Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Blocks: 32 Voltage Supply - Internal: 3V ~ 3.6V Part Status: Obsolete Number of I/O: 180 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCR3512XL-7PQ208C | AMD |
Description: IC CPLD 512MC 7NSNS 208QFP Packaging: Bulk Package / Case: 208-BFQFP Mounting Type: Surface Mount Programmable Type: In System Programmable (min 1K program/erase cycles) Number of Gates: 12000 Number of Macrocells: 512 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 7 ns Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Blocks: 32 Voltage Supply - Internal: 3V ~ 3.6V Part Status: Obsolete Number of I/O: 180 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCR3512XL-10PQ208I | AMD |
Description: IC CPLD 512MC 9NS 208QFP Packaging: Bulk Package / Case: 208-BFQFP Mounting Type: Surface Mount Programmable Type: In System Programmable (min 1K program/erase cycles) Number of Gates: 12000 Number of Macrocells: 512 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 9 ns Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Blocks: 32 Voltage Supply - Internal: 2.7V ~ 3.6V Part Status: Obsolete Number of I/O: 180 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCR3512XL-10PQ208C | AMD |
Description: IC CPLD 512MC 9NS 208QFP Packaging: Bulk Package / Case: 208-BFQFP Mounting Type: Surface Mount Programmable Type: In System Programmable (min 1K program/erase cycles) Number of Gates: 12000 Number of Macrocells: 512 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 9 ns Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Blocks: 32 Voltage Supply - Internal: 3V ~ 3.6V Part Status: Obsolete Number of I/O: 180 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCR3512XL-12PQ208I | AMD |
Description: IC CPLD 512MC 10.8NS 208QFP Packaging: Bulk Package / Case: 208-BFQFP Mounting Type: Surface Mount Programmable Type: In System Programmable (min 1K program/erase cycles) Number of Gates: 12000 Number of Macrocells: 512 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 10.8 ns Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Blocks: 32 Voltage Supply - Internal: 2.7V ~ 3.6V Part Status: Obsolete Number of I/O: 180 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU3EG-1UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU3EG-1UBVA530E | AMD |
Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU3CG-2UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU3EG-2UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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| XA7K160T-1FFG676Q | AMD |
Description: FPGA KINTEX7 Q100 400 I/O 676BGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 162240 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 12675 Total RAM Bits: 11980800 Part Status: Active Number of I/O: 400 DigiKey Programmable: Not Verified |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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XCAU10P-2SBVB484I | AMD |
Description: IC FPGA ARTIXUP 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 96250 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 5500 Total RAM Bits: 3670016 Part Status: Active Number of I/O: 204 DigiKey Programmable: Not Verified |
auf Bestellung 45 Stücke: Lieferzeit 10-14 Tag (e) |
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XCAU10P-1SBVB484E | AMD |
Description: IC FPGA ARTIXUP 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 96250 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 5500 Total RAM Bits: 3670016 Part Status: Active Number of I/O: 204 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCAU10P-1SBVB484I | AMD |
Description: IC FPGA ARTIXUP 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 96250 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 5500 Total RAM Bits: 3670016 Part Status: Active Number of I/O: 204 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| XCVU11P-2FLGB2104I | AMD |
Description: IC FPGA 572 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2835000 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 162000 Total RAM Bits: 396150400 Part Status: Active Number of I/O: 572 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| XCVU11P-2FLGB2104E | AMD |
Description: IC FPGA 572 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2835000 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 162000 Total RAM Bits: 396150400 Part Status: Active Number of I/O: 572 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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XCKU11P-2FFVD900I | AMD |
Description: IC FPGA 408 I/O 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 653100 Supplier Device Package: 900-FCBGA (31x31) Number of LABs/CLBs: 37320 Total RAM Bits: 53964800 Part Status: Active Number of I/O: 408 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| XCKU11P-2FFVA1156I | AMD |
Description: IC FPGA 464 I/O 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 653100 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 37320 Total RAM Bits: 53964800 Part Status: Active Number of I/O: 464 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| XCVU11P-2FLGF1924I | AMD |
Description: IC FPGA 624 I/O 1924FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2835000 Supplier Device Package: 1924-FCBGA (45x45) Number of LABs/CLBs: 162000 Total RAM Bits: 396150400 Part Status: Active Number of I/O: 624 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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XCKU11P-2FFVD900E | AMD |
Description: IC FPGA 408 I/O 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 653100 Supplier Device Package: 900-FCBGA (31x31) Number of LABs/CLBs: 37320 Total RAM Bits: 53964800 Part Status: Active Number of I/O: 408 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| XCVU11P-2FLGA2577E | AMD |
Description: IC FPGA 448 I/O 2577FCBGA Packaging: Tray Package / Case: 2577-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2835000 Supplier Device Package: 2577-FCBGA (52.5x52.5) Number of LABs/CLBs: 162000 Total RAM Bits: 396150400 Part Status: Active Number of I/O: 448 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| XCKU11P-2FFVA1156E | AMD |
Description: IC FPGA 464 I/O 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 653100 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 37320 Total RAM Bits: 53964800 Part Status: Active Number of I/O: 464 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| XCVU11P-2FLGC2104E | AMD |
Description: IC FPGA 416 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2835000 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 162000 Total RAM Bits: 396150400 Part Status: Active Number of I/O: 416 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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XCAU25P-2SFVB784I | AMD |
Description: IC FPGA ARTIXUP 784FBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 308437 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 17625 Total RAM Bits: 4928307 Part Status: Active Number of I/O: 304 DigiKey Programmable: Not Verified |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCS20XL-4CS144C | AMD |
Description: IC FPGA 113 I/O 144CSBGA Packaging: Tray Package / Case: 144-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 20000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 950 Supplier Device Package: 144-LCSBGA (12x12) Number of LABs/CLBs: 400 Total RAM Bits: 12800 Part Status: Obsolete Number of I/O: 113 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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XCVC1502-1LLIVSVA2197 | AMD |
Description: IC VERSAL AI-CORE FPGA 2197BGA Packaging: Tray Package / Case: 2197-BFBGA, FCBGA Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 80k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 2197-FCBGA (45x45) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVC1702-1LSIVSVA2197 | AMD |
Description: IC VERSAL AI-CORE FPGA 2197BGA Packaging: Tray Package / Case: 2197-BFBGA, FCBGA Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 2197-FCBGA (45x45) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVC1502-2LLEVSVA2197 | AMD |
Description: IC VERSAL AI-CORE FPGA 2197BGA Packaging: Tray Package / Case: 2197-BFBGA, FCBGA Speed: 450MHz, 1.08GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 800k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 2197-FCBGA (45x45) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVC1902-1MSEVSVA2197 | AMD |
Description: IC VERSAL AICORE FPGA 2197BGA Packaging: Tray Package / Case: 2197-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 2197-FCBGA (45x45) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVC1902-2MLIVSVA2197 | AMD |
Description: IC VERSAL AICORE FPGA 2197BGA Packaging: Tray Package / Case: 2197-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 2197-FCBGA (45x45) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-1MSENSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-2LLEVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 450MHz, 1.08GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1402-2LLEVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 450MHz, 1.08GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-1MLIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-1LLIVFVC1596 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-BGA (37.5x37.5) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-1MLIVFVC1596 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-BGA (37.5x37.5) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1402-2MLINSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.4GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-2LSENBVB1024 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1024BGA Packaging: Tray Package / Case: 1024-BFBGA Speed: 450MHz, 1.08GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1024-BGA (31x31) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1402-1MLIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-1MLINSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-1MSEVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-1MLINBVB1024 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1024BGA Packaging: Tray Package / Case: 1024-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1024-BGA (31x31) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-1MSEVFVC1596 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-BGA (37.5x37.5) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-1MSIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-1MSINSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-1MSINBVB1024 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1024BGA Packaging: Tray Package / Case: 1024-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1024-BGA (31x31) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-1MSENBVB1024 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1024BGA Packaging: Tray Package / Case: 1024-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1024-BGA (31x31) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1302-1MSIVFVC1596 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-BGA (37.5x37.5) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| EK-U1-VCU118-G-J | AMD |
Description: KIT VCU118 VIRTEX ULTRASCALE Packaging: Bulk For Use With/Related Products: XCVU9P Type: FPGA Contents: Board(s), Cable(s) - Power Supply Not Included - Platform: Virtex UltraScale+ FPGA VCU118 Japan PCIe Card Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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XC5202-5PC84C | AMD |
Description: FPGA, 64 CLBS, 2000 GATES Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC5202-5VQ100C | AMD |
Description: FPGA, 64 CLBS, 2000 GATES Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| XC7Z010-3CLG225E4334 | AMD |
Description: XC7Z010-3CLG225E4334 Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| XC7Z010-3CLG400E4893 | AMD |
Description: XC7Z010-3CLG400E4893 Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| XCVP1802-1MSELSVC4072 | AMD |
Description: IC VERSAL AI-CORE FPGA 4072BGA Packaging: Tray Package / Case: 4072-BBGA, FCBGA RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 4072-FCBGA (65x65) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| XCVP1802-2MLELSVC4072 | AMD |
Description: IC VERSAL AI-CORE FPGA 4072BGA Packaging: Tray Package / Case: 4072-BBGA, FCBGA RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 4072-FCBGA (65x65) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| XCVP1802-2MSELSVC4072 | AMD |
Description: IC VERSAL AI-CORE FPGA 4072BGA Packaging: Tray Package / Case: 4072-BBGA, FCBGA RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 4072-FCBGA (65x65) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| 835-1015-059 | AMD |
Description: 835-1015-059 Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| XC2C256-7CP132I0100 | AMD |
Description: XC2C256-7CP132I UPDATING MOQ/FOI Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| XC4013XL-3PQ208C |
|
Hersteller: AMD
Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 13000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1368
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 576
Total RAM Bits: 18432
Part Status: Obsolete
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 13000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1368
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 576
Total RAM Bits: 18432
Part Status: Obsolete
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 124.01 EUR |
| XC95288XV-7PQ208C |
|
Hersteller: AMD
Description: IC CPLD 288MC 7.5NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.37V ~ 2.62V
Part Status: Obsolete
Number of I/O: 168
Description: IC CPLD 288MC 7.5NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.37V ~ 2.62V
Part Status: Obsolete
Number of I/O: 168
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC95288XL-6PQ208C |
|
Hersteller: AMD
Description: IC CPLD 288MC 6NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 6 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 168
DigiKey Programmable: Not Verified
Description: IC CPLD 288MC 6NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 6 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 168
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCR3512XL-12PQ208C |
|
Hersteller: AMD
Description: IC CPLD 512MC 10.8NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
Description: IC CPLD 512MC 10.8NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCR3512XL-7PQ208C |
|
Hersteller: AMD
Description: IC CPLD 512MC 7NSNS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
Description: IC CPLD 512MC 7NSNS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCR3512XL-10PQ208I |
|
Hersteller: AMD
Description: IC CPLD 512MC 9NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
Description: IC CPLD 512MC 9NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCR3512XL-10PQ208C |
|
Hersteller: AMD
Description: IC CPLD 512MC 9NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
Description: IC CPLD 512MC 9NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCR3512XL-12PQ208I |
|
Hersteller: AMD
Description: IC CPLD 512MC 10.8NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
Description: IC CPLD 512MC 10.8NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU3EG-1UBVA530I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 982.33 EUR |
| XCZU3EG-1UBVA530E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 787.09 EUR |
| XCZU3CG-2UBVA530I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 1072.76 EUR |
| XCZU3EG-2UBVA530I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 1209.33 EUR |
| XA7K160T-1FFG676Q |
|
Hersteller: AMD
Description: FPGA KINTEX7 Q100 400 I/O 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 162240
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 12675
Total RAM Bits: 11980800
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
Description: FPGA KINTEX7 Q100 400 I/O 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 162240
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 12675
Total RAM Bits: 11980800
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 1205.78 EUR |
| XCAU10P-2SBVB484I |
|
Hersteller: AMD
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 350.45 EUR |
| XCAU10P-1SBVB484E |
|
Hersteller: AMD
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCAU10P-1SBVB484I |
|
Hersteller: AMD
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVU11P-2FLGB2104I |
|
Hersteller: AMD
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 572
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 572
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVU11P-2FLGB2104E |
|
Hersteller: AMD
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 572
DigiKey Programmable: Not Verified
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 572
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCKU11P-2FFVD900I |
|
Hersteller: AMD
Description: IC FPGA 408 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 408
Description: IC FPGA 408 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 408
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCKU11P-2FFVA1156I |
|
Hersteller: AMD
Description: IC FPGA 464 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 464
Description: IC FPGA 464 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 464
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVU11P-2FLGF1924I |
|
Hersteller: AMD
Description: IC FPGA 624 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 624
Description: IC FPGA 624 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 624
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCKU11P-2FFVD900E |
|
Hersteller: AMD
Description: IC FPGA 408 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 408
Description: IC FPGA 408 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 408
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVU11P-2FLGA2577E |
|
Hersteller: AMD
Description: IC FPGA 448 I/O 2577FCBGA
Packaging: Tray
Package / Case: 2577-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2577-FCBGA (52.5x52.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 448
Description: IC FPGA 448 I/O 2577FCBGA
Packaging: Tray
Package / Case: 2577-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2577-FCBGA (52.5x52.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 448
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCKU11P-2FFVA1156E |
|
Hersteller: AMD
Description: IC FPGA 464 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 464
Description: IC FPGA 464 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 464
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVU11P-2FLGC2104E |
|
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 416
Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 416
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCAU25P-2SFVB784I |
|
Hersteller: AMD
Description: IC FPGA ARTIXUP 784FBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 4928307
Part Status: Active
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 784FBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 4928307
Part Status: Active
Number of I/O: 304
DigiKey Programmable: Not Verified
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 1051.35 EUR |
| XCS20XL-4CS144C |
|
Hersteller: AMD
Description: IC FPGA 113 I/O 144CSBGA
Packaging: Tray
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 20000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 950
Supplier Device Package: 144-LCSBGA (12x12)
Number of LABs/CLBs: 400
Total RAM Bits: 12800
Part Status: Obsolete
Number of I/O: 113
DigiKey Programmable: Not Verified
Description: IC FPGA 113 I/O 144CSBGA
Packaging: Tray
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 20000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 950
Supplier Device Package: 144-LCSBGA (12x12)
Number of LABs/CLBs: 400
Total RAM Bits: 12800
Part Status: Obsolete
Number of I/O: 113
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVC1502-1LLIVSVA2197 |
|
Hersteller: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 80k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 80k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVC1702-1LSIVSVA2197 |
|
Hersteller: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVC1502-2LLEVSVA2197 |
|
Hersteller: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 800k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 800k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVC1902-1MSEVSVA2197 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVC1902-2MLIVSVA2197 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1302-1MSENSVF1369 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1302-2LLEVSVD1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1402-2LLEVSVD1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1302-1MLIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1302-1LLIVFVC1596 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1302-1MLIVFVC1596 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1402-2MLINSVF1369 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1302-2LSENBVB1024 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1402-1MLIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1302-1MLINSVF1369 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1302-1MSEVSVD1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1302-1MLINBVB1024 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1302-1MSEVFVC1596 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1302-1MSIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1302-1MSINSVF1369 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1302-1MSINBVB1024 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
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| XCVM1302-1MSENBVB1024 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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| XCVM1302-1MSIVFVC1596 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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| EK-U1-VCU118-G-J |
|
Hersteller: AMD
Description: KIT VCU118 VIRTEX ULTRASCALE
Packaging: Bulk
For Use With/Related Products: XCVU9P
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Virtex UltraScale+ FPGA VCU118 Japan PCIe Card
Part Status: Active
Description: KIT VCU118 VIRTEX ULTRASCALE
Packaging: Bulk
For Use With/Related Products: XCVU9P
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Virtex UltraScale+ FPGA VCU118 Japan PCIe Card
Part Status: Active
Produkt ist nicht verfügbar
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| XC5202-5PC84C |
|
Hersteller: AMD
Description: FPGA, 64 CLBS, 2000 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FPGA, 64 CLBS, 2000 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| XC5202-5VQ100C |
|
Hersteller: AMD
Description: FPGA, 64 CLBS, 2000 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FPGA, 64 CLBS, 2000 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| XCVP1802-1MSELSVC4072 |
Hersteller: AMD
Description: IC VERSAL AI-CORE FPGA 4072BGA
Packaging: Tray
Package / Case: 4072-BBGA, FCBGA
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 4072-FCBGA (65x65)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AI-CORE FPGA 4072BGA
Packaging: Tray
Package / Case: 4072-BBGA, FCBGA
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 4072-FCBGA (65x65)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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| XCVP1802-2MLELSVC4072 |
Hersteller: AMD
Description: IC VERSAL AI-CORE FPGA 4072BGA
Packaging: Tray
Package / Case: 4072-BBGA, FCBGA
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 4072-FCBGA (65x65)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AI-CORE FPGA 4072BGA
Packaging: Tray
Package / Case: 4072-BBGA, FCBGA
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 4072-FCBGA (65x65)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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| XCVP1802-2MSELSVC4072 |
Hersteller: AMD
Description: IC VERSAL AI-CORE FPGA 4072BGA
Packaging: Tray
Package / Case: 4072-BBGA, FCBGA
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 4072-FCBGA (65x65)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AI-CORE FPGA 4072BGA
Packaging: Tray
Package / Case: 4072-BBGA, FCBGA
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 4072-FCBGA (65x65)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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| XC2C256-7CP132I0100 |
Hersteller: AMD
Description: XC2C256-7CP132I UPDATING MOQ/FOI
Packaging: Tape & Reel (TR)
Part Status: Active
Description: XC2C256-7CP132I UPDATING MOQ/FOI
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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