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XCKU19P-L2FFVJ1760E XCKU19P-L2FFVJ1760E AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP LP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-1FFVJ1760E XCKU19P-1FFVJ1760E AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-1FFVB2104I XCKU19P-1FFVB2104I AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-1FFVB2104E XCKU19P-1FFVB2104E AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-L2FFVB2104E XCKU19P-L2FFVB2104E AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP LP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-2FFVB2104E XCKU19P-2FFVB2104E AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-2FFVB2104I XCKU19P-2FFVB2104I AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-L1FFVJ1760I XCKU19P-L1FFVJ1760I AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP LP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-L1FFVB2104I XCKU19P-L1FFVB2104I AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP LP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC5210-5BG225CO373 XC5210-5BG225CO373 AMD 1605200.pdf?t.download=true&u=ovmfp3 Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Package / Case: 225-BEBGA
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1296
Supplier Device Package: 225-PBGA (27x27)
Number of LABs/CLBs: 324
Part Status: Active
Number of I/O: 196
DigiKey Programmable: Not Verified
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XQ18V04VQ44N XQ18V04VQ44N AMD XQ18V04.pdf Description: IC CONFIG PROM 4MBIT 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 4MB
Programmable Type: In System Programmable
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A-U280-A32G-DEV-G AMD Description: BOARD DCAB SERVER U280 ACTIVE
Power (Watts): 225W
Packaging: Box
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Cooling Type: Fan + Heat Sink
Produkt ist nicht verfügbar
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XC4044XLA-09HQ208C XC4044XLA-09HQ208C AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 1600 CLBS, 27000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 27000
Operating Temperature: 0°C ~ 85°C (TJ)
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1600
Part Status: Active
DigiKey Programmable: Not Verified
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3+229.06 EUR
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XCZU1CG-2SFVC784I XCZU1CG-2SFVC784I AMD ds891-zynq-ultrascale-plus-overview Description: IC ZUP MPSOC CG A53 FPGA 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Part Status: Active
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XCZU2EG-2SFVC784I XCZU2EG-2SFVC784I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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XCZU1EG-2SFVC784I XCZU1EG-2SFVC784I AMD ds891-zynq-ultrascale-plus-overview Description: IC ZUP MPSOC EG A53 FPGA 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Part Status: Active
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SM-K26-XCL2GI SM-K26-XCL2GI AMD SM-K26-XCL2GI.pdf Description: SOM ARM A53 ZYNQ MPSOC KRIA K26
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: -40°C ~ 100°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
Produkt ist nicht verfügbar
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XA7A12T-2CPG238I AMD s3NwarfUcQdgTa4CDreCuQ Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
Produkt ist nicht verfügbar
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XC4VFX100-11FF1152C XC4VFX100-11FF1152C AMD ds112 Description: IC FPGA 576 I/O 1152FCBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 94896
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 10544
Total RAM Bits: 6930432
Number of I/O: 576
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4VFX60-12FFG1152C XC4VFX60-12FFG1152C AMD pfAe4jHWJY3n938PD92zlw Description: IC FPGA 576 I/O 1152FCBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 56880
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 6320
Total RAM Bits: 4276224
Number of I/O: 576
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4VFX100-10FF1152C XC4VFX100-10FF1152C AMD ds112 Description: IC FPGA 576 I/O 1152FCBGA
Packaging: Bulk
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 94896
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 10544
Total RAM Bits: 6930432
Number of I/O: 576
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XL-10CS144I AMD ds056 Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XL-7CS144I AMD ds056 Description: IC CPLD 144MC 7.5NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
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XC95144XL-10TQ144C XC95144XL-10TQ144C AMD ds056 Description: IC CPLD 144MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XL-5CS144C AMD ds056 Description: IC CPLD 144MC 5NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XL-10TQ100C XC95144XL-10TQ100C AMD ds056 Description: IC CPLD 144MC 10NS 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
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XC95144XL-10CS144C AMD ds056 Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVC1802-1MSIVIVA1596 XCVC1802-1MSIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-1MSIVIVA1596 XCVC1902-1MSIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1902-2LSEVIVA1596 XCVC1902-2LSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-2MSEVIVA1596 XCVC1802-2MSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1902-2MSEVIVA1596 XCVC1902-2MSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1902-2MLEVIVA1596 XCVC1902-2MLEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-2LSEVIVA1596 XCVC1802-2LSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-1MSEVIVA1596 XCVC1902-1MSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-2MLEVIVA1596 XCVC1802-2MLEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-1LSEVIVA1596 XCVC1802-1LSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-1MLIVIVA1596 XCVC1802-1MLIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-1LSIVIVA1596 XCVC1802-1LSIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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EK-S7-SP701-G-J EK-S7-SP701-G-J AMD Spartan-7-FPGAs-Data-Sheet-DC-and-AC-Switching-Characteristics Description: SPARTAN7 SP701 FPGA KIT NO PS
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Utilized IC / Part: XC7S100
Platform: Spartan-7 FPGA SP701 Japan
Produkt ist nicht verfügbar
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XCZU19EG-L2FFVC1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-2FFVC1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1+18591.8 EUR
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XCZU17EG-2FFVC1760E XCZU17EG-2FFVC1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
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1+14578.12 EUR
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XCZU19EG-3FFVC1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-1FFVC1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU11EG-1FFVC1760E XCZU11EG-1FFVC1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU19EG-1FFVC1760I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU19EG-2FFVC1760I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XC3130-5PC84C XC3130-5PC84C AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 100 CLBS, 2K GATES
auf Bestellung 126 Stücke:
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15+39.96 EUR
Mindestbestellmenge: 15 Stücke
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XC3130-5PC68C XC3130-5PC68C AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
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38+14.65 EUR
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SK-KR260-G-ED SK-KR260-G-ED AMD kria-kr260-a-scalable-robotics-platform-powered-with-ubuntu Description: KRIA KR260 ROBOTIC START KIT ED
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KR260 Robotics Starter Encryption Disabled
Part Status: Active
Produkt ist nicht verfügbar
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XA7A25T-1CSG325Q XA7A25T-1CSG325Q AMD s3NwarfUcQdgTa4CDreCuQ Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5 Stücke
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XC4085XLA-09BGG352C XC4085XLA-09BGG352C AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 3136 CLBS, 55000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 55000
Operating Temperature: 0°C ~ 85°C (TJ)
Number of LABs/CLBs: 3136
DigiKey Programmable: Not Verified
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1+828.53 EUR
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XC4085XLA-09BG352I XC4085XLA-09BG352I AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 3136 CLBS, 55000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 55000
Operating Temperature: -40°C ~ 100°C (TJ)
Number of LABs/CLBs: 3136
DigiKey Programmable: Not Verified
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XC4085XLA-08HQ160I XC4085XLA-08HQ160I AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 3136 CLBS, 55000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 55000
Operating Temperature: -40°C ~ 100°C (TJ)
Number of LABs/CLBs: 3136
DigiKey Programmable: Not Verified
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1+1119.06 EUR
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XC4085XLA-09HQ208C XC4085XLA-09HQ208C AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 3136 CLBS, 55000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 55000
Operating Temperature: 0°C ~ 85°C (TJ)
Number of LABs/CLBs: 3136
DigiKey Programmable: Not Verified
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3+251.65 EUR
Mindestbestellmenge: 3 Stücke
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XC3130-PQ100CPH XC3130-PQ100CPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 100-PQFP (20x14)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 80
DigiKey Programmable: Not Verified
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34+17.39 EUR
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XCS20XL-5VQG100C AMD Description: FPGA, 400 CLBS, 7000 GATES
Packaging: Bulk
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 7000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 950
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 400
Total RAM Bits: 12800
Part Status: Active
Number of I/O: 77
Produkt ist nicht verfügbar
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XCVC1902-1LSEVIVA1596 XCVC1902-1LSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-2MSIVIVA1596 XCVC1802-2MSIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCKU19P-L2FFVJ1760E ds890-ultrascale-overview
XCKU19P-L2FFVJ1760E
Hersteller: AMD
Description: IC FPGA KINTEX UP LP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-1FFVJ1760E ds890-ultrascale-overview
XCKU19P-1FFVJ1760E
Hersteller: AMD
Description: IC FPGA KINTEX UP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-1FFVB2104I ds890-ultrascale-overview
XCKU19P-1FFVB2104I
Hersteller: AMD
Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-1FFVB2104E ds890-ultrascale-overview
XCKU19P-1FFVB2104E
Hersteller: AMD
Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-L2FFVB2104E ds890-ultrascale-overview
XCKU19P-L2FFVB2104E
Hersteller: AMD
Description: IC FPGA KINTEX UP LP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-2FFVB2104E ds890-ultrascale-overview
XCKU19P-2FFVB2104E
Hersteller: AMD
Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-2FFVB2104I ds890-ultrascale-overview
XCKU19P-2FFVB2104I
Hersteller: AMD
Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-L1FFVJ1760I ds890-ultrascale-overview
XCKU19P-L1FFVJ1760I
Hersteller: AMD
Description: IC FPGA KINTEX UP LP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU19P-L1FFVB2104I ds890-ultrascale-overview
XCKU19P-L1FFVB2104I
Hersteller: AMD
Description: IC FPGA KINTEX UP LP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC5210-5BG225CO373 1605200.pdf?t.download=true&u=ovmfp3
XC5210-5BG225CO373
Hersteller: AMD
Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Package / Case: 225-BEBGA
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1296
Supplier Device Package: 225-PBGA (27x27)
Number of LABs/CLBs: 324
Part Status: Active
Number of I/O: 196
DigiKey Programmable: Not Verified
auf Bestellung 248 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
8+67.54 EUR
Mindestbestellmenge: 8 Stücke
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XQ18V04VQ44N XQ18V04.pdf
XQ18V04VQ44N
Hersteller: AMD
Description: IC CONFIG PROM 4MBIT 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 4MB
Programmable Type: In System Programmable
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A-U280-A32G-DEV-G
Hersteller: AMD
Description: BOARD DCAB SERVER U280 ACTIVE
Power (Watts): 225W
Packaging: Box
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Cooling Type: Fan + Heat Sink
Produkt ist nicht verfügbar
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XC4044XLA-09HQ208C 4000.pdf?t.download=true&u=ovmfp3
XC4044XLA-09HQ208C
Hersteller: AMD
Description: FPGA, 1600 CLBS, 27000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 27000
Operating Temperature: 0°C ~ 85°C (TJ)
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1600
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+229.06 EUR
Mindestbestellmenge: 3 Stücke
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XCZU1CG-2SFVC784I ds891-zynq-ultrascale-plus-overview
XCZU1CG-2SFVC784I
Hersteller: AMD
Description: IC ZUP MPSOC CG A53 FPGA 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+750.37 EUR
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XCZU2EG-2SFVC784I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU2EG-2SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+1023.42 EUR
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XCZU1EG-2SFVC784I ds891-zynq-ultrascale-plus-overview
XCZU1EG-2SFVC784I
Hersteller: AMD
Description: IC ZUP MPSOC EG A53 FPGA 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+905.66 EUR
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SM-K26-XCL2GI SM-K26-XCL2GI.pdf
SM-K26-XCL2GI
Hersteller: AMD
Description: SOM ARM A53 ZYNQ MPSOC KRIA K26
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: -40°C ~ 100°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
Produkt ist nicht verfügbar
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XA7A12T-2CPG238I s3NwarfUcQdgTa4CDreCuQ
Hersteller: AMD
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
Produkt ist nicht verfügbar
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XC4VFX100-11FF1152C ds112
XC4VFX100-11FF1152C
Hersteller: AMD
Description: IC FPGA 576 I/O 1152FCBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 94896
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 10544
Total RAM Bits: 6930432
Number of I/O: 576
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4VFX60-12FFG1152C pfAe4jHWJY3n938PD92zlw
XC4VFX60-12FFG1152C
Hersteller: AMD
Description: IC FPGA 576 I/O 1152FCBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 56880
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 6320
Total RAM Bits: 4276224
Number of I/O: 576
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4VFX100-10FF1152C ds112
XC4VFX100-10FF1152C
Hersteller: AMD
Description: IC FPGA 576 I/O 1152FCBGA
Packaging: Bulk
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 94896
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 10544
Total RAM Bits: 6930432
Number of I/O: 576
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XL-10CS144I ds056
Hersteller: AMD
Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 198 Stücke
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XC95144XL-7CS144I ds056
Hersteller: AMD
Description: IC CPLD 144MC 7.5NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XL-10TQ144C ds056
XC95144XL-10TQ144C
Hersteller: AMD
Description: IC CPLD 144MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 120 Stücke
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XC95144XL-5CS144C ds056
Hersteller: AMD
Description: IC CPLD 144MC 5NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 198 Stücke
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XC95144XL-10TQ100C ds056
XC95144XL-10TQ100C
Hersteller: AMD
Description: IC CPLD 144MC 10NS 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XL-10CS144C ds056
Hersteller: AMD
Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 198 Stücke
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XCVC1802-1MSIVIVA1596 ds950-versal-overview
XCVC1802-1MSIVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-1MSIVIVA1596 ds950-versal-overview
XCVC1902-1MSIVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-2LSEVIVA1596 ds950-versal-overview
XCVC1902-2LSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-2MSEVIVA1596 ds950-versal-overview
XCVC1802-2MSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-2MSEVIVA1596 ds950-versal-overview
XCVC1902-2MSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-2MLEVIVA1596 ds950-versal-overview
XCVC1902-2MLEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-2LSEVIVA1596 ds950-versal-overview
XCVC1802-2LSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-1MSEVIVA1596 ds950-versal-overview
XCVC1902-1MSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-2MLEVIVA1596 ds950-versal-overview
XCVC1802-2MLEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-1LSEVIVA1596 ds950-versal-overview
XCVC1802-1LSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-1MLIVIVA1596 ds950-versal-overview
XCVC1802-1MLIVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-1LSIVIVA1596 ds950-versal-overview
XCVC1802-1LSIVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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EK-S7-SP701-G-J Spartan-7-FPGAs-Data-Sheet-DC-and-AC-Switching-Characteristics
EK-S7-SP701-G-J
Hersteller: AMD
Description: SPARTAN7 SP701 FPGA KIT NO PS
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Utilized IC / Part: XC7S100
Platform: Spartan-7 FPGA SP701 Japan
Produkt ist nicht verfügbar
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XCZU19EG-L2FFVC1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-2FFVC1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 1 Stücke:
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AnzahlPrivatkunde
1+18591.8 EUR
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XCZU17EG-2FFVC1760E ds891-zynq-ultrascale-plus-overview
XCZU17EG-2FFVC1760E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
auf Bestellung 4 Stücke:
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AnzahlPrivatkunde
1+14578.12 EUR
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XCZU19EG-3FFVC1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-1FFVC1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU11EG-1FFVC1760E ds891-zynq-ultrascale-plus-overview
XCZU11EG-1FFVC1760E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU19EG-1FFVC1760I ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-2FFVC1760I ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XC3130-5PC84C 1153000.pdf?t.download=true&u=ovmfp3
XC3130-5PC84C
Hersteller: AMD
Description: FPGA, 100 CLBS, 2K GATES
auf Bestellung 126 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
15+39.96 EUR
Mindestbestellmenge: 15 Stücke
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XC3130-5PC68C 1153000.pdf?t.download=true&u=ovmfp3
XC3130-5PC68C
Hersteller: AMD
Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 124 Stücke:
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AnzahlPrivatkunde
38+14.65 EUR
Mindestbestellmenge: 38 Stücke
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SK-KR260-G-ED kria-kr260-a-scalable-robotics-platform-powered-with-ubuntu
SK-KR260-G-ED
Hersteller: AMD
Description: KRIA KR260 ROBOTIC START KIT ED
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KR260 Robotics Starter Encryption Disabled
Part Status: Active
Produkt ist nicht verfügbar
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XA7A25T-1CSG325Q s3NwarfUcQdgTa4CDreCuQ
XA7A25T-1CSG325Q
Hersteller: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 5 Stücke
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XC4085XLA-09BGG352C 4000.pdf?t.download=true&u=ovmfp3
XC4085XLA-09BGG352C
Hersteller: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 55000
Operating Temperature: 0°C ~ 85°C (TJ)
Number of LABs/CLBs: 3136
DigiKey Programmable: Not Verified
auf Bestellung 5 Stücke:
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AnzahlPrivatkunde
1+828.53 EUR
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XC4085XLA-09BG352I 4000.pdf?t.download=true&u=ovmfp3
XC4085XLA-09BG352I
Hersteller: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 55000
Operating Temperature: -40°C ~ 100°C (TJ)
Number of LABs/CLBs: 3136
DigiKey Programmable: Not Verified
auf Bestellung 132 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+1077.79 EUR
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XC4085XLA-08HQ160I 4000.pdf?t.download=true&u=ovmfp3
XC4085XLA-08HQ160I
Hersteller: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 55000
Operating Temperature: -40°C ~ 100°C (TJ)
Number of LABs/CLBs: 3136
DigiKey Programmable: Not Verified
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+1119.06 EUR
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XC4085XLA-09HQ208C 4000.pdf?t.download=true&u=ovmfp3
XC4085XLA-09HQ208C
Hersteller: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 55000
Operating Temperature: 0°C ~ 85°C (TJ)
Number of LABs/CLBs: 3136
DigiKey Programmable: Not Verified
auf Bestellung 139 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+251.65 EUR
Mindestbestellmenge: 3 Stücke
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XC3130-PQ100CPH 1153000.pdf?t.download=true&u=ovmfp3
XC3130-PQ100CPH
Hersteller: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 100-PQFP (20x14)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 80
DigiKey Programmable: Not Verified
auf Bestellung 255 Stücke:
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AnzahlPrivatkunde
34+17.39 EUR
Mindestbestellmenge: 34 Stücke
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XCS20XL-5VQG100C
Hersteller: AMD
Description: FPGA, 400 CLBS, 7000 GATES
Packaging: Bulk
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 7000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 950
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 400
Total RAM Bits: 12800
Part Status: Active
Number of I/O: 77
Produkt ist nicht verfügbar
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XCVC1902-1LSEVIVA1596 ds950-versal-overview
XCVC1902-1LSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-2MSIVIVA1596 ds950-versal-overview
XCVC1802-2MSIVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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