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XQ18V04VQ44N XQ18V04VQ44N AMD XQ18V04.pdf Description: IC CONFIG PROM 4MBIT 44TQFP
Part Status: Obsolete
Supplier Device Package: 44-VQFP (10x10)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -55°C ~ 125°C
Programmable Type: In System Programmable
Memory Size: 4MB
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A-U280-A32G-DEV-G AMD Description: BOARD DCAB SERVER U280 ACTIVE
Cooling Type: Fan + Heat Sink
Operating Temperature: 0°C ~ 45°C
Interface: PCI Express
Memory Size: 16GB
Power (Watts): 225W
Packaging: Box
Produkt ist nicht verfügbar
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XC4044XLA-09HQ208C XC4044XLA-09HQ208C AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 1600 CLBS, 27000 GATES
Part Status: Active
Number of LABs/CLBs: 1600
Supplier Device Package: 208-PQFP (28x28)
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 27000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 57 Stücke:
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3+229.06 EUR
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XCZU1CG-2SFVC784I XCZU1CG-2SFVC784I AMD ds891-zynq-ultrascale-plus-overview Description: IC ZUP MPSOC CG A53 FPGA 784BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
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1+750.37 EUR
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XCZU2EG-2SFVC784I XCZU2EG-2SFVC784I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
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XCZU1EG-2SFVC784I XCZU1EG-2SFVC784I AMD ds891-zynq-ultrascale-plus-overview Description: IC ZUP MPSOC EG A53 FPGA 784BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
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SM-K26-XCL2GI SM-K26-XCL2GI AMD SM-K26-XCL2GI.pdf Description: SOM ARM A53 ZYNQ MPSOC KRIA K26
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: -40°C ~ 100°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
auf Bestellung 1325 Stücke:
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XA7A12T-2CPG238I AMD s3NwarfUcQdgTa4CDreCuQ Description: IC FPGA 112 I/O 238CSBGA
Part Status: Active
Total RAM Bits: 737280
Number of LABs/CLBs: 1000
Supplier Device Package: 238-CSBGA (10x10)
Number of Logic Elements/Cells: 12800
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 238-LFBGA, CSPBGA
Packaging: Tray
Number of I/O: 112
Produkt ist nicht verfügbar
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XC4VFX100-11FF1152C XC4VFX100-11FF1152C AMD ds112 Description: IC FPGA 576 I/O 1152FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 576
Total RAM Bits: 6930432
Number of LABs/CLBs: 10544
Supplier Device Package: 1152-FCBGA (35x35)
Number of Logic Elements/Cells: 94896
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XC4VFX60-12FFG1152C XC4VFX60-12FFG1152C AMD pfAe4jHWJY3n938PD92zlw Description: IC FPGA 576 I/O 1152FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 576
Total RAM Bits: 4276224
Number of LABs/CLBs: 6320
Supplier Device Package: 1152-FCBGA (35x35)
Number of Logic Elements/Cells: 56880
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XC4VFX100-10FF1152C XC4VFX100-10FF1152C AMD ds112 Description: IC FPGA 576 I/O 1152FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 576
Total RAM Bits: 6930432
Number of LABs/CLBs: 10544
Supplier Device Package: 1152-FCBGA (35x35)
Number of Logic Elements/Cells: 94896
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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XC95144XL-10CS144I AMD ds056 Description: IC CPLD 144MC 10NS 144LCSBGA
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-LCSBGA (12x12)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XL-7CS144I AMD ds056 Description: IC CPLD 144MC 7.5NS 144LCSBGA
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-LCSBGA (12x12)
Delay Time tpd(1) Max: 7.5 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XL-10TQ144C XC95144XL-10TQ144C AMD ds056 Description: IC CPLD 144MC 10NS 144TQFP
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-TQFP (20x20)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XL-5CS144C AMD ds056 Description: IC CPLD 144MC 5NS 144LCSBGA
Delay Time tpd(1) Max: 5 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
Supplier Device Package: 144-LCSBGA (12x12)
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
DigiKey Programmable: Not Verified
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XC95144XL-10TQ100C XC95144XL-10TQ100C AMD ds056 Description: IC CPLD 144MC 10NS 100TQFP
Number of I/O: 81
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 100-TQFP (14x14)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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XC95144XL-10CS144C AMD ds056 Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
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XCVC1802-1MSIVIVA1596 XCVC1802-1MSIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-1MSIVIVA1596 XCVC1902-1MSIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-2LSEVIVA1596 XCVC1902-2LSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-2MSEVIVA1596 XCVC1802-2MSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-2MSEVIVA1596 XCVC1902-2MSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-2MLEVIVA1596 XCVC1902-2MLEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-2LSEVIVA1596 XCVC1802-2LSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-1MSEVIVA1596 XCVC1902-1MSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-2MLEVIVA1596 XCVC1802-2MLEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-1LSEVIVA1596 XCVC1802-1LSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-1MLIVIVA1596 XCVC1802-1MLIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-1LSIVIVA1596 XCVC1802-1LSIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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EK-S7-SP701-G-J EK-S7-SP701-G-J AMD Spartan-7-FPGAs-Data-Sheet-DC-and-AC-Switching-Characteristics Description: SPARTAN7 SP701 FPGA KIT NO PS
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Utilized IC / Part: XC7S100
Platform: Spartan-7 FPGA SP701 Japan
Produkt ist nicht verfügbar
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XCZU19EG-L2FFVC1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-2FFVC1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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XCZU17EG-2FFVC1760E XCZU17EG-2FFVC1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
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XCZU19EG-3FFVC1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-1FFVC1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU11EG-1FFVC1760E XCZU11EG-1FFVC1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU19EG-1FFVC1760I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-2FFVC1760I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XC3130-5PC68C XC3130-5PC68C AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
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SK-KR260-G-ED SK-KR260-G-ED AMD kria-kr260-a-scalable-robotics-platform-powered-with-ubuntu Description: KRIA KR260 ROBOTIC START KIT ED
Utilized IC / Part: SM-K26, XCK26
Part Status: Active
Platform: Kria KR260 Robotics Starter Encryption Disabled
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: FPGA + MCU/MPU SoC
For Use With/Related Products: SM-K26, XCK26
Packaging: Box
Produkt ist nicht verfügbar
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XA7A25T-1CSG325Q XA7A25T-1CSG325Q AMD s3NwarfUcQdgTa4CDreCuQ Description: IC FPGA 150 I/O 324CSBGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 150
Grade: Automotive
Total RAM Bits: 1658880
Number of LABs/CLBs: 1825
Supplier Device Package: 324-CSPBGA (15x15)
Number of Logic Elements/Cells: 23360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 324-LFBGA, CSPBGA
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5 Stücke
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XC4085XLA-09BGG352C XC4085XLA-09BGG352C AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
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XC4085XLA-09BG352I XC4085XLA-09BG352I AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
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XC4085XLA-08HQ160I XC4085XLA-08HQ160I AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
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XC4085XLA-09HQ208C XC4085XLA-09HQ208C AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
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3+251.65 EUR
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XC3130-PQ100CPH XC3130-PQ100CPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3130 - XC3000 SERIES FIELD PRO
Number of Logic Elements/Cells: 100
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 2000
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 80
Total RAM Bits: 22176
Number of LABs/CLBs: 100
Supplier Device Package: 100-PQFP (20x14)
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34+17.39 EUR
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XCS20XL-5VQG100C AMD Description: FPGA, 400 CLBS, 7000 GATES
Number of I/O: 77
Part Status: Active
Total RAM Bits: 12800
Number of LABs/CLBs: 400
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 950
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 7000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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XCVC1902-1LSEVIVA1596 XCVC1902-1LSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Architecture: MPU, FPGA
Supplier Device Package: 1596-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 400MHz, 1GHz
Package / Case: 1596-BFBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCVC1802-2MSIVIVA1596 XCVC1802-2MSIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Architecture: MPU, FPGA
Supplier Device Package: 1596-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.4GHz
Package / Case: 1596-BFBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU2CG-2UBVA530E XCZU2CG-2UBVA530E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU2EG-2UBVA530I XCZU2EG-2UBVA530I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
auf Bestellung 7 Stücke:
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1+1029.04 EUR
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XCZU2EG-1UBVA530I XCZU2EG-1UBVA530I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
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1+803.29 EUR
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XCZU2CG-1UBVA530I XCZU2CG-1UBVA530I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
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XCZU2CG-2UBVA530I XCZU2CG-2UBVA530I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
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1+858.41 EUR
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XC4006E-4PQ208C AMD Description: IC FPGA 128 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 608
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 256
Total RAM Bits: 8192
Part Status: Obsolete
Number of I/O: 128
DigiKey Programmable: Not Verified
auf Bestellung 174 Stücke:
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4+136.24 EUR
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XC7Z020-2CLG400E XC7Z020-2CLG400E AMD ds187-XC7Z010-XC7Z020-Data-Sheet Description: IC SOC CORTEX-A9 766MHZ 400BGA
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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SK-KR260-G SK-KR260-G AMD Kria%20KR260%20Robotics%20Starter%20Kit.pdf Description: KRIA KR260 ROBOTIC START KIT
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KR260 Robotics Starter
Part Status: Active
auf Bestellung 450 Stücke:
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1+791.24 EUR
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XCZU1CG-1SBVA484I XCZU1CG-1SBVA484I AMD ds891-zynq-ultrascale-plus-overview Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
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1+622.14 EUR
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XCZU1CG-1SFVA625I XCZU1CG-1SFVA625I AMD ds891-zynq-ultrascale-plus-overview Description: IC ZUP MPSOC CG A53 FPGA 635BGA
Produkt ist nicht verfügbar
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XCZU1CG-2SBVA484I XCZU1CG-2SBVA484I AMD ds891-zynq-ultrascale-plus-overview Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
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1+824.98 EUR
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XQ18V04VQ44N XQ18V04.pdf
XQ18V04VQ44N
Hersteller: AMD
Description: IC CONFIG PROM 4MBIT 44TQFP
Part Status: Obsolete
Supplier Device Package: 44-VQFP (10x10)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -55°C ~ 125°C
Programmable Type: In System Programmable
Memory Size: 4MB
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A-U280-A32G-DEV-G
Hersteller: AMD
Description: BOARD DCAB SERVER U280 ACTIVE
Cooling Type: Fan + Heat Sink
Operating Temperature: 0°C ~ 45°C
Interface: PCI Express
Memory Size: 16GB
Power (Watts): 225W
Packaging: Box
Produkt ist nicht verfügbar
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XC4044XLA-09HQ208C 4000.pdf?t.download=true&u=ovmfp3
XC4044XLA-09HQ208C
Hersteller: AMD
Description: FPGA, 1600 CLBS, 27000 GATES
Part Status: Active
Number of LABs/CLBs: 1600
Supplier Device Package: 208-PQFP (28x28)
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 27000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 57 Stücke:
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AnzahlPrivatkunde
3+229.06 EUR
Mindestbestellmenge: 3 Stücke
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XCZU1CG-2SFVC784I ds891-zynq-ultrascale-plus-overview
XCZU1CG-2SFVC784I
Hersteller: AMD
Description: IC ZUP MPSOC CG A53 FPGA 784BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
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AnzahlPrivatkunde
1+750.37 EUR
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XCZU2EG-2SFVC784I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU2EG-2SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
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1+1023.42 EUR
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XCZU1EG-2SFVC784I ds891-zynq-ultrascale-plus-overview
XCZU1EG-2SFVC784I
Hersteller: AMD
Description: IC ZUP MPSOC EG A53 FPGA 784BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
auf Bestellung 3 Stücke:
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1+904.11 EUR
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SM-K26-XCL2GI SM-K26-XCL2GI.pdf
SM-K26-XCL2GI
Hersteller: AMD
Description: SOM ARM A53 ZYNQ MPSOC KRIA K26
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: -40°C ~ 100°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
auf Bestellung 1325 Stücke:
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1+1065.66 EUR
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XA7A12T-2CPG238I s3NwarfUcQdgTa4CDreCuQ
Hersteller: AMD
Description: IC FPGA 112 I/O 238CSBGA
Part Status: Active
Total RAM Bits: 737280
Number of LABs/CLBs: 1000
Supplier Device Package: 238-CSBGA (10x10)
Number of Logic Elements/Cells: 12800
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 238-LFBGA, CSPBGA
Packaging: Tray
Number of I/O: 112
Produkt ist nicht verfügbar
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XC4VFX100-11FF1152C ds112
XC4VFX100-11FF1152C
Hersteller: AMD
Description: IC FPGA 576 I/O 1152FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 576
Total RAM Bits: 6930432
Number of LABs/CLBs: 10544
Supplier Device Package: 1152-FCBGA (35x35)
Number of Logic Elements/Cells: 94896
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XC4VFX60-12FFG1152C pfAe4jHWJY3n938PD92zlw
XC4VFX60-12FFG1152C
Hersteller: AMD
Description: IC FPGA 576 I/O 1152FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 576
Total RAM Bits: 4276224
Number of LABs/CLBs: 6320
Supplier Device Package: 1152-FCBGA (35x35)
Number of Logic Elements/Cells: 56880
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XC4VFX100-10FF1152C ds112
XC4VFX100-10FF1152C
Hersteller: AMD
Description: IC FPGA 576 I/O 1152FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 576
Total RAM Bits: 6930432
Number of LABs/CLBs: 10544
Supplier Device Package: 1152-FCBGA (35x35)
Number of Logic Elements/Cells: 94896
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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XC95144XL-10CS144I ds056
Hersteller: AMD
Description: IC CPLD 144MC 10NS 144LCSBGA
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-LCSBGA (12x12)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 198 Stücke
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XC95144XL-7CS144I ds056
Hersteller: AMD
Description: IC CPLD 144MC 7.5NS 144LCSBGA
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-LCSBGA (12x12)
Delay Time tpd(1) Max: 7.5 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XL-10TQ144C ds056
XC95144XL-10TQ144C
Hersteller: AMD
Description: IC CPLD 144MC 10NS 144TQFP
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-TQFP (20x20)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 120 Stücke
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XC95144XL-5CS144C ds056
Hersteller: AMD
Description: IC CPLD 144MC 5NS 144LCSBGA
Delay Time tpd(1) Max: 5 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
Supplier Device Package: 144-LCSBGA (12x12)
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XL-10TQ100C ds056
XC95144XL-10TQ100C
Hersteller: AMD
Description: IC CPLD 144MC 10NS 100TQFP
Number of I/O: 81
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 100-TQFP (14x14)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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XC95144XL-10CS144C ds056
Hersteller: AMD
Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 198 Stücke
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XCVC1802-1MSIVIVA1596 ds950-versal-overview
XCVC1802-1MSIVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-1MSIVIVA1596 ds950-versal-overview
XCVC1902-1MSIVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-2LSEVIVA1596 ds950-versal-overview
XCVC1902-2LSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-2MSEVIVA1596 ds950-versal-overview
XCVC1802-2MSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-2MSEVIVA1596 ds950-versal-overview
XCVC1902-2MSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-2MLEVIVA1596 ds950-versal-overview
XCVC1902-2MLEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-2LSEVIVA1596 ds950-versal-overview
XCVC1802-2LSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1902-1MSEVIVA1596 ds950-versal-overview
XCVC1902-1MSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-2MLEVIVA1596 ds950-versal-overview
XCVC1802-2MLEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-1LSEVIVA1596 ds950-versal-overview
XCVC1802-1LSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-1MLIVIVA1596 ds950-versal-overview
XCVC1802-1MLIVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVC1802-1LSIVIVA1596 ds950-versal-overview
XCVC1802-1LSIVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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EK-S7-SP701-G-J Spartan-7-FPGAs-Data-Sheet-DC-and-AC-Switching-Characteristics
EK-S7-SP701-G-J
Hersteller: AMD
Description: SPARTAN7 SP701 FPGA KIT NO PS
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Utilized IC / Part: XC7S100
Platform: Spartan-7 FPGA SP701 Japan
Produkt ist nicht verfügbar
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XCZU19EG-L2FFVC1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-2FFVC1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+18591.8 EUR
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XCZU17EG-2FFVC1760E ds891-zynq-ultrascale-plus-overview
XCZU17EG-2FFVC1760E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+14578.12 EUR
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XCZU19EG-3FFVC1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-1FFVC1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU11EG-1FFVC1760E ds891-zynq-ultrascale-plus-overview
XCZU11EG-1FFVC1760E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU19EG-1FFVC1760I ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-2FFVC1760I ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XC3130-5PC68C 1153000.pdf?t.download=true&u=ovmfp3
XC3130-5PC68C
Hersteller: AMD
Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 124 Stücke:
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38+14.24 EUR
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SK-KR260-G-ED kria-kr260-a-scalable-robotics-platform-powered-with-ubuntu
SK-KR260-G-ED
Hersteller: AMD
Description: KRIA KR260 ROBOTIC START KIT ED
Utilized IC / Part: SM-K26, XCK26
Part Status: Active
Platform: Kria KR260 Robotics Starter Encryption Disabled
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: FPGA + MCU/MPU SoC
For Use With/Related Products: SM-K26, XCK26
Packaging: Box
Produkt ist nicht verfügbar
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XA7A25T-1CSG325Q s3NwarfUcQdgTa4CDreCuQ
XA7A25T-1CSG325Q
Hersteller: AMD
Description: IC FPGA 150 I/O 324CSBGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 150
Grade: Automotive
Total RAM Bits: 1658880
Number of LABs/CLBs: 1825
Supplier Device Package: 324-CSPBGA (15x15)
Number of Logic Elements/Cells: 23360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 324-LFBGA, CSPBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 5 Stücke
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XC4085XLA-09BGG352C 4000.pdf?t.download=true&u=ovmfp3
XC4085XLA-09BGG352C
Hersteller: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
auf Bestellung 5 Stücke:
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1+828.53 EUR
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XC4085XLA-09BG352I 4000.pdf?t.download=true&u=ovmfp3
XC4085XLA-09BG352I
Hersteller: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
auf Bestellung 132 Stücke:
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1+1077.79 EUR
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XC4085XLA-08HQ160I 4000.pdf?t.download=true&u=ovmfp3
XC4085XLA-08HQ160I
Hersteller: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
auf Bestellung 68 Stücke:
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1+1144.26 EUR
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XC4085XLA-09HQ208C 4000.pdf?t.download=true&u=ovmfp3
XC4085XLA-09HQ208C
Hersteller: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
auf Bestellung 139 Stücke:
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3+251.65 EUR
Mindestbestellmenge: 3 Stücke
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XC3130-PQ100CPH 1153000.pdf?t.download=true&u=ovmfp3
XC3130-PQ100CPH
Hersteller: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Number of Logic Elements/Cells: 100
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 2000
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 80
Total RAM Bits: 22176
Number of LABs/CLBs: 100
Supplier Device Package: 100-PQFP (20x14)
auf Bestellung 255 Stücke:
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34+17.39 EUR
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XCS20XL-5VQG100C
Hersteller: AMD
Description: FPGA, 400 CLBS, 7000 GATES
Number of I/O: 77
Part Status: Active
Total RAM Bits: 12800
Number of LABs/CLBs: 400
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 950
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 7000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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XCVC1902-1LSEVIVA1596 ds950-versal-overview
XCVC1902-1LSEVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Architecture: MPU, FPGA
Supplier Device Package: 1596-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 400MHz, 1GHz
Package / Case: 1596-BFBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCVC1802-2MSIVIVA1596 ds950-versal-overview
XCVC1802-2MSIVIVA1596
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Architecture: MPU, FPGA
Supplier Device Package: 1596-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.4GHz
Package / Case: 1596-BFBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU2CG-2UBVA530E ds891-zynq-ultrascale-plus-overview
XCZU2CG-2UBVA530E
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU2EG-2UBVA530I ds891-zynq-ultrascale-plus-overview
XCZU2EG-2UBVA530I
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
auf Bestellung 7 Stücke:
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1+1029.04 EUR
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XCZU2EG-1UBVA530I ds891-zynq-ultrascale-plus-overview
XCZU2EG-1UBVA530I
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
auf Bestellung 5 Stücke:
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1+803.29 EUR
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XCZU2CG-1UBVA530I ds891-zynq-ultrascale-plus-overview
XCZU2CG-1UBVA530I
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
auf Bestellung 105 Stücke:
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1+669.41 EUR
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XCZU2CG-2UBVA530I ds891-zynq-ultrascale-plus-overview
XCZU2CG-2UBVA530I
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
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1+858.41 EUR
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XC4006E-4PQ208C
Hersteller: AMD
Description: IC FPGA 128 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 608
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 256
Total RAM Bits: 8192
Part Status: Obsolete
Number of I/O: 128
DigiKey Programmable: Not Verified
auf Bestellung 174 Stücke:
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4+136.24 EUR
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XC7Z020-2CLG400E ds187-XC7Z010-XC7Z020-Data-Sheet
XC7Z020-2CLG400E
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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SK-KR260-G Kria%20KR260%20Robotics%20Starter%20Kit.pdf
SK-KR260-G
Hersteller: AMD
Description: KRIA KR260 ROBOTIC START KIT
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KR260 Robotics Starter
Part Status: Active
auf Bestellung 450 Stücke:
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1+791.24 EUR
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XCZU1CG-1SBVA484I ds891-zynq-ultrascale-plus-overview
XCZU1CG-1SBVA484I
Hersteller: AMD
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
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1+622.14 EUR
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XCZU1CG-1SFVA625I ds891-zynq-ultrascale-plus-overview
XCZU1CG-1SFVA625I
Hersteller: AMD
Description: IC ZUP MPSOC CG A53 FPGA 635BGA
Produkt ist nicht verfügbar
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XCZU1CG-2SBVA484I ds891-zynq-ultrascale-plus-overview
XCZU1CG-2SBVA484I
Hersteller: AMD
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 24 Stücke:
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1+824.98 EUR
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