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EK-XRF4-3342-V1-G AMD Introduction Description: XRF4 RF ACCESSORY KIT
Packaging: Bulk
For Use With/Related Products: ZCU208, ZCU670
Accessory Type: Accessory Kit
Produkt ist nicht verfügbar
XC3S250E-4PQG208C XC3S250E-4PQG208C AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
auf Bestellung 324 Stücke:
Lieferzeit 10-14 Tag (e)
1+416.45 EUR
XC3S200-4VQ100I XC3S200-4VQ100I AMD ds099 Description: IC FPGA 63 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
1+79.6 EUR
XCVU160-H1FLGB2104E AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU190-2FLGB2104E AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU190-2FLGB2104I AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU160-3FLGB2104E AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU11P-1FLGB2104I AMD ds923-virtex-ultrascale-plus Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU13P-1FHGB2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU190-3FLGB2104E AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU11P-L2FLGB2104E AMD virtex-ultrascale-plus-product-brief.pdf Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU13P-1FHGB2104I AMD ds923-virtex-ultrascale-plus Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU13P-2FHGB2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU13P-2FHGB2104I AMD ds923-virtex-ultrascale-plus Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU13P-L2FHGB2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 832 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 832
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC7S75-1FGGA676Q XC7S75-1FGGA676Q AMD ds180_7Series_Overview Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 4331520
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XA7S75-2FGGA676I XA7S75-2FGGA676I AMD j6dhSNsTk1SGc2BkX0wKUg Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 3317760
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
XC7S100-L1FGGA676I XC7S100-L1FGGA676I AMD ug475_7Series_Pkg_Pinout Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.92V ~ 0.98V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XA7S100-2FGGA676I XA7S100-2FGGA676I AMD j6dhSNsTk1SGc2BkX0wKUg Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
XA7S100-1FGGA676Q XA7S100-1FGGA676Q AMD j6dhSNsTk1SGc2BkX0wKUg Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
XCKU040-L1FBVA676I XCKU040-L1FBVA676I AMD ds892-kintex-ultrascale-data-sheet Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCKU040-2FBVA676I XCKU040-2FBVA676I AMD tQhK7M1yxXV8VjBH4xf7Vg Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCKU040-3FBVA676E XCKU040-3FBVA676E AMD ds892-kintex-ultrascale-data-sheet Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
DK-U1-KCU1500-A-G DK-U1-KCU1500-A-G AMD DK-U1-KCU1500-A-G_Dev_Kit_Overview.PDF Description: KINTEX ULTRASCALE FPGA KCU1500
Packaging: Box
For Use With/Related Products: XCKU115
Type: FPGA
Contents: Board(s), Cable(s)
Platform: Kintex UltraScale FPGA KCU1500 Acceleration PCIe Card
Produkt ist nicht verfügbar
XCZU4EG-1SFVC784I XCZU4EG-1SFVC784I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-1FBVB900E XCZU4EG-1FBVB900E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-2SFVC784E XCZU4EG-2SFVC784E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-2SFVC784I XCZU4EG-2SFVC784I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-L2SFVC784E XCZU4EG-L2SFVC784E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-1FBVB900I XCZU4EG-1FBVB900I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-2FBVB900E XCZU4EG-2FBVB900E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-3SFVC784E XCZU4EG-3SFVC784E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 600MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-2FBVB900I XCZU4EG-2FBVB900I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-L2FBVB900E XCZU4EG-L2FBVB900E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XC5206-3TQ144C XC5206-3TQ144C AMD 1605200.pdf?t.download=true&u=ovmfp3 Description: FPGA, 196 CLBS, 6000 GATES
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 784
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 196
Number of I/O: 117
DigiKey Programmable: Not Verified
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
5+106.65 EUR
Mindestbestellmenge: 5
XC3S1000-4FGG320I XC3S1000-4FGG320I AMD ds099 Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC7A75T-2FGG484C XC7A75T-2FGG484C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 661 Stücke:
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EK-U1-VCU118-ES1-G EK-U1-VCU118-ES1-G AMD xtp453-vcu118-quickstart.pdf Description: KIT VCU118 VIRTEX ULTRASCALE+ ES
Packaging: Box
For Use With/Related Products: XCVU9P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Virtex UltraScale+ FPGA VCU118 ES1 PCIe Card
Produkt ist nicht verfügbar
XC3S50-4CPG132C XC3S50-4CPG132C AMD ds099 Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
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XC3S50-4CPG132C XC3S50-4CPG132C AMD ds099 Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC3S50-5CPG132C XC3S50-5CPG132C AMD ds099 Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
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XC3S50-5CPG132C XC3S50-5CPG132C AMD ds099 Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC1765ELSO8C XC1765ELSO8C AMD ds027 Description: IC PROM SER C-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-SOIC
DigiKey Programmable: Not Verified
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XC1765ELVOG8C XC1765ELVOG8C AMD ds027 Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC1765ELSOG8C XC1765ELSOG8C AMD ds027 Description: IC PROM SERIAL 65K 8-SOIC
Packaging: Tray
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-SOIC
DigiKey Programmable: Not Verified
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XC1765ELVO8C XC1765ELVO8C AMD ds027 Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
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XC1765EVO8I XC1765EVO8I AMD ds027 Description: IC PROM SER I-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
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XC1765ELVO8I XC1765ELVO8I AMD ds027 Description: IC PROM SER I-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
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XCZU6EG-1FFVC900E XCZU6EG-1FFVC900E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-1FFVB1156E XCZU6EG-1FFVB1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-1FFVC900I XCZU6EG-1FFVC900I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-2FFVC900E XCZU6EG-2FFVC900E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-1FFVB1156I XCZU6EG-1FFVB1156I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-2FFVB1156E XCZU6EG-2FFVB1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-2FFVC900I XCZU6EG-2FFVC900I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-2FFVB1156I XCZU6EG-2FFVB1156I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XC3S1600E-4FGG320I XC3S1600E-4FGG320I AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 250 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1600000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 33192
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 3688
Total RAM Bits: 663552
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 3 Stücke:
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1+414.09 EUR
A-MA35D-P16G-PQ-G A-MA35D-P16G-PQ-G AMD Description: DCAB ALVEO MA35 MEDIA HHHL AIC
Power (Watts): 40W
Packaging: Bulk
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 55°C
Cooling Type: Heat Sink
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
1+3078.2 EUR
A-U250-P64G-SPQG-016 AMD alveo-product-brief.pdf Description: A-U250-P64G-SPQG-016
Power (Watts): 215W
Packaging: Bulk
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Heat Sink
LUTs: 1728k
Produkt ist nicht verfügbar
A-U280-P32G-PQG-905 AMD alveo-u280-product-brief.pdf Description: A-U280-P32G-PQG-905
Power (Watts): 215W
Packaging: Bulk
Memory Size: 32GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
Produkt ist nicht verfügbar
EK-XRF4-3342-V1-G Introduction
Hersteller: AMD
Description: XRF4 RF ACCESSORY KIT
Packaging: Bulk
For Use With/Related Products: ZCU208, ZCU670
Accessory Type: Accessory Kit
Produkt ist nicht verfügbar
XC3S250E-4PQG208C 2Q1ujx53XGev4neIVdL3hw
XC3S250E-4PQG208C
Hersteller: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
auf Bestellung 324 Stücke:
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Anzahl Preis ohne MwSt
1+416.45 EUR
XC3S200-4VQ100I ds099
XC3S200-4VQ100I
Hersteller: AMD
Description: IC FPGA 63 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 90 Stücke:
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Anzahl Preis ohne MwSt
1+79.6 EUR
XCVU160-H1FLGB2104E O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU190-2FLGB2104E O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU190-2FLGB2104I O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU160-3FLGB2104E O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU11P-1FLGB2104I ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU13P-1FHGB2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU190-3FLGB2104E O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU11P-L2FLGB2104E virtex-ultrascale-plus-product-brief.pdf
Hersteller: AMD
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU13P-1FHGB2104I ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU13P-2FHGB2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU13P-2FHGB2104I ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCVU13P-L2FHGB2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 832 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 832
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC7S75-1FGGA676Q ds180_7Series_Overview
XC7S75-1FGGA676Q
Hersteller: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 4331520
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XA7S75-2FGGA676I j6dhSNsTk1SGc2BkX0wKUg
XA7S75-2FGGA676I
Hersteller: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 3317760
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
XC7S100-L1FGGA676I ug475_7Series_Pkg_Pinout
XC7S100-L1FGGA676I
Hersteller: AMD
Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.92V ~ 0.98V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XA7S100-2FGGA676I j6dhSNsTk1SGc2BkX0wKUg
XA7S100-2FGGA676I
Hersteller: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
XA7S100-1FGGA676Q j6dhSNsTk1SGc2BkX0wKUg
XA7S100-1FGGA676Q
Hersteller: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
XCKU040-L1FBVA676I ds892-kintex-ultrascale-data-sheet
XCKU040-L1FBVA676I
Hersteller: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCKU040-2FBVA676I tQhK7M1yxXV8VjBH4xf7Vg
XCKU040-2FBVA676I
Hersteller: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCKU040-3FBVA676E ds892-kintex-ultrascale-data-sheet
XCKU040-3FBVA676E
Hersteller: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
DK-U1-KCU1500-A-G DK-U1-KCU1500-A-G_Dev_Kit_Overview.PDF
DK-U1-KCU1500-A-G
Hersteller: AMD
Description: KINTEX ULTRASCALE FPGA KCU1500
Packaging: Box
For Use With/Related Products: XCKU115
Type: FPGA
Contents: Board(s), Cable(s)
Platform: Kintex UltraScale FPGA KCU1500 Acceleration PCIe Card
Produkt ist nicht verfügbar
XCZU4EG-1SFVC784I jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-1SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-1FBVB900E jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-1FBVB900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-2SFVC784E jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-2SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-2SFVC784I jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-2SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-L2SFVC784E jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-L2SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-1FBVB900I jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-1FBVB900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-2FBVB900E jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-2FBVB900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-3SFVC784E jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-3SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 600MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-2FBVB900I jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-2FBVB900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU4EG-L2FBVB900E jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-L2FBVB900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XC5206-3TQ144C 1605200.pdf?t.download=true&u=ovmfp3
XC5206-3TQ144C
Hersteller: AMD
Description: FPGA, 196 CLBS, 6000 GATES
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 784
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 196
Number of I/O: 117
DigiKey Programmable: Not Verified
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+106.65 EUR
Mindestbestellmenge: 5
XC3S1000-4FGG320I ds099
XC3S1000-4FGG320I
Hersteller: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC7A75T-2FGG484C ds181_Artix_7_Data_Sheet
XC7A75T-2FGG484C
Hersteller: AMD
Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 661 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+261.92 EUR
EK-U1-VCU118-ES1-G xtp453-vcu118-quickstart.pdf
EK-U1-VCU118-ES1-G
Hersteller: AMD
Description: KIT VCU118 VIRTEX ULTRASCALE+ ES
Packaging: Box
For Use With/Related Products: XCVU9P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Virtex UltraScale+ FPGA VCU118 ES1 PCIe Card
Produkt ist nicht verfügbar
XC3S50-4CPG132C ds099
XC3S50-4CPG132C
Hersteller: AMD
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 1090 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
27+18.58 EUR
Mindestbestellmenge: 27
XC3S50-4CPG132C ds099
XC3S50-4CPG132C
Hersteller: AMD
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC3S50-5CPG132C ds099
XC3S50-5CPG132C
Hersteller: AMD
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 365 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
23+21.37 EUR
Mindestbestellmenge: 23
XC3S50-5CPG132C ds099
XC3S50-5CPG132C
Hersteller: AMD
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC1765ELSO8C ds027
XC1765ELSO8C
Hersteller: AMD
Description: IC PROM SER C-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-SOIC
DigiKey Programmable: Not Verified
auf Bestellung 6995 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
51+9.59 EUR
Mindestbestellmenge: 51
XC1765ELVOG8C ds027
XC1765ELVOG8C
Hersteller: AMD
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC1765ELSOG8C ds027
XC1765ELSOG8C
Hersteller: AMD
Description: IC PROM SERIAL 65K 8-SOIC
Packaging: Tray
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-SOIC
DigiKey Programmable: Not Verified
auf Bestellung 6510 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
51+9.59 EUR
Mindestbestellmenge: 51
XC1765ELVO8C ds027
XC1765ELVO8C
Hersteller: AMD
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
auf Bestellung 4806 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
51+9.72 EUR
Mindestbestellmenge: 51
XC1765EVO8I ds027
XC1765EVO8I
Hersteller: AMD
Description: IC PROM SER I-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
auf Bestellung 3661 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
49+9.98 EUR
Mindestbestellmenge: 49
XC1765ELVO8I ds027
XC1765ELVO8I
Hersteller: AMD
Description: IC PROM SER I-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
auf Bestellung 4820 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
44+11.26 EUR
Mindestbestellmenge: 44
XCZU6EG-1FFVC900E jDqbmrrvy_u9hmwDv1iWBQ
XCZU6EG-1FFVC900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-1FFVB1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU6EG-1FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-1FFVC900I jDqbmrrvy_u9hmwDv1iWBQ
XCZU6EG-1FFVC900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-2FFVC900E jDqbmrrvy_u9hmwDv1iWBQ
XCZU6EG-2FFVC900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-1FFVB1156I jDqbmrrvy_u9hmwDv1iWBQ
XCZU6EG-1FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-2FFVB1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU6EG-2FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-2FFVC900I jDqbmrrvy_u9hmwDv1iWBQ
XCZU6EG-2FFVC900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XCZU6EG-2FFVB1156I jDqbmrrvy_u9hmwDv1iWBQ
XCZU6EG-2FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
XC3S1600E-4FGG320I 2Q1ujx53XGev4neIVdL3hw
XC3S1600E-4FGG320I
Hersteller: AMD
Description: IC FPGA 250 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1600000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 33192
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 3688
Total RAM Bits: 663552
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+414.09 EUR
A-MA35D-P16G-PQ-G
A-MA35D-P16G-PQ-G
Hersteller: AMD
Description: DCAB ALVEO MA35 MEDIA HHHL AIC
Power (Watts): 40W
Packaging: Bulk
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 55°C
Cooling Type: Heat Sink
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+3078.2 EUR
A-U250-P64G-SPQG-016 alveo-product-brief.pdf
Hersteller: AMD
Description: A-U250-P64G-SPQG-016
Power (Watts): 215W
Packaging: Bulk
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Heat Sink
LUTs: 1728k
Produkt ist nicht verfügbar
A-U280-P32G-PQG-905 alveo-u280-product-brief.pdf
Hersteller: AMD
Description: A-U280-P32G-PQG-905
Power (Watts): 215W
Packaging: Bulk
Memory Size: 32GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
Produkt ist nicht verfügbar
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