Produkte > AMD > Alle Produkte des Herstellers AMD (14398) > Seite 53 nach 240

Wählen Sie Seite:   [  << Vorherige Seite ]  1 24 48 49 50 51 52 53 54 55 56 57 58 72 96 120 144 168 192 216 240  [ Nächste Seite >> ]
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
XCVM1502-1MSINFVB1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1LSINFVB1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1MLINFVB1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MLENFVB1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2LSENFVB1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MSINFVB1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1LLINFVB1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2LLENFVB1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MLINFVB1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC7A15T-3CPG236E XC7A15T-3CPG236E AMD ds180_7Series_Overview Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-VMK180-G-J AMD xilinx-vmk180-product-brief.pdf Description: EVAL VMK180 VERSAL PRIME NO PWR
Packaging: Box
For Use With/Related Products: XCVM1802
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Versal Prime Adaptive SoC VMK180 Japan PCIe Card
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-VMK180-G-ED-J EK-VMK180-G-ED-J AMD xilinx-vmk180-product-brief.pdf Description: EVAL VMK180 VERSAL PRIME NO PWR
Packaging: Box
For Use With/Related Products: XCVM1802
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Versal Prime Adaptive SoC VMK180 Encryption Disabled Japan PCIe Card
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-4VQG100I XC3S100E-4VQG100I AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-5VQG100C XC3S100E-5VQG100C AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-4CPG132C XC3S100E-4CPG132C AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 83 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-4CPG132I XC3S100E-4CPG132I AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 83 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-5TQG144C XC3S100E-5TQG144C AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-4VQ100I XC3S100E-4VQ100I AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-4TQ144C AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-4TQ144I XC3S100E-4TQ144I AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-5TQ144C AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 108 I/O 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-1FSVE1156E XCZU42DR-1FSVE1156E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-1FSVE1156I XCZU42DR-1FSVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-1FFVE1156I XCZU42DR-1FFVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-L1FSVE1156I XCZU42DR-L1FSVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-2FSVE1156E XCZU42DR-2FSVE1156E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-L1FFVE1156I XCZU42DR-L1FFVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU55DR-1FSVE1156I XCZU55DR-1FSVE1156I AMD XCN20014 Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU55DR-1FFVE1156I XCZU55DR-1FFVE1156I AMD XCN20014 Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-1FSVE1156E XCZU47DR-1FSVE1156E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-1FSVE1156E XCZU43DR-1FSVE1156E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-1FFVE1156E XCZU43DR-1FFVE1156E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-1FFVE1156E XCZU47DR-1FFVE1156E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU57DR-1FFVE1156I XCZU57DR-1FFVE1156I AMD XCN20014 Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU57DR-1FSVE1156I XCZU57DR-1FSVE1156I AMD XCN20014 Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-2FFVE1156I XCZU42DR-2FFVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-2FSVE1156I XCZU42DR-2FSVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU55DR-L1FSVE1156I XCZU55DR-L1FSVE1156I AMD XCN20014 Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU55DR-L1FFVE1156I XCZU55DR-L1FFVE1156I AMD XCN20014 Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-1FSVG1517E XCZU43DR-1FSVG1517E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-1FFVG1517E XCZU43DR-1FFVG1517E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-1FFVG1517E XCZU47DR-1FFVG1517E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-1FSVG1517E XCZU47DR-1FSVG1517E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU57DR-L1FFVE1156I XCZU57DR-L1FFVE1156I AMD XCN20014 Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU57DR-L1FSVE1156I XCZU57DR-L1FSVE1156I AMD XCN20014 Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-1FSVE1156I XCZU47DR-1FSVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-1FFVE1156I XCZU47DR-1FFVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-1FSVE1156I XCZU43DR-1FSVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU55DR-2FSVE1156I XCZU55DR-2FSVE1156I AMD XCN20014 Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU55DR-2FFVE1156I XCZU55DR-2FFVE1156I AMD XCN20014 Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU48DR-1FFVE1156E XCZU48DR-1FFVE1156E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU48DR-1FSVE1156E XCZU48DR-1FSVE1156E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU57DR-2FFVE1156I XCZU57DR-2FFVE1156I AMD XCN20014 Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU57DR-2FSVE1156I XCZU57DR-2FSVE1156I AMD XCN20014 Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU46DR-1FSVH1760E XCZU46DR-1FSVH1760E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-2FFVE1156E XCZU43DR-2FFVE1156E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-2FFVE1156E XCZU47DR-2FFVE1156E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU10P-2FFVB676I XCAU10P-2FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 228
DigiKey Programmable: Not Verified
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+357.02 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7A35T-1CSG324I XC7A35T-1CSG324I AMD ds180_7Series_Overview Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 210
DigiKey Programmable: Not Verified
auf Bestellung 628 Stücke:
Lieferzeit 10-14 Tag (e)
1+103.98 EUR
Im Einkaufswagen  Stück im Wert von  UAH
A-U45N-P08G-PQ-G A-U45N-P08G-PQ-G AMD 2100167-product-brief-alveo-u45n.pdf Description: BOARD DCAB SERVER/NET U45N ALVEO
Power (Watts): 75W
Packaging: Box
Memory Size: 4GB
Interface: PCI Express
Operating Temperature: 30°C
Bandwidth: 200GB/s
Cooling Type: Heat Sink
LUTs: 1030k
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
1+4570.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1MSINFVB1369 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1LSINFVB1369 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1MLINFVB1369 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MLENFVB1369 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2LSENFVB1369 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MSINFVB1369 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1LLINFVB1369 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2LLENFVB1369 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MLINFVB1369 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC7A15T-3CPG236E ds180_7Series_Overview
XC7A15T-3CPG236E
Hersteller: AMD
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-VMK180-G-J xilinx-vmk180-product-brief.pdf
Hersteller: AMD
Description: EVAL VMK180 VERSAL PRIME NO PWR
Packaging: Box
For Use With/Related Products: XCVM1802
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Versal Prime Adaptive SoC VMK180 Japan PCIe Card
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-VMK180-G-ED-J xilinx-vmk180-product-brief.pdf
EK-VMK180-G-ED-J
Hersteller: AMD
Description: EVAL VMK180 VERSAL PRIME NO PWR
Packaging: Box
For Use With/Related Products: XCVM1802
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Versal Prime Adaptive SoC VMK180 Encryption Disabled Japan PCIe Card
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-4VQG100I 2Q1ujx53XGev4neIVdL3hw
XC3S100E-4VQG100I
Hersteller: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-5VQG100C 2Q1ujx53XGev4neIVdL3hw
XC3S100E-5VQG100C
Hersteller: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-4CPG132C 2Q1ujx53XGev4neIVdL3hw
XC3S100E-4CPG132C
Hersteller: AMD
Description: IC FPGA 83 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-4CPG132I 2Q1ujx53XGev4neIVdL3hw
XC3S100E-4CPG132I
Hersteller: AMD
Description: IC FPGA 83 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-5TQG144C 2Q1ujx53XGev4neIVdL3hw
XC3S100E-5TQG144C
Hersteller: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-4VQ100I 2Q1ujx53XGev4neIVdL3hw
XC3S100E-4VQ100I
Hersteller: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-4TQ144C 2Q1ujx53XGev4neIVdL3hw
Hersteller: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-4TQ144I 2Q1ujx53XGev4neIVdL3hw
XC3S100E-4TQ144I
Hersteller: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S100E-5TQ144C 2Q1ujx53XGev4neIVdL3hw
Hersteller: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-1FSVE1156E ds889-zynq-usp-rfsoc-overview
XCZU42DR-1FSVE1156E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-1FSVE1156I ds889-zynq-usp-rfsoc-overview
XCZU42DR-1FSVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-1FFVE1156I ds889-zynq-usp-rfsoc-overview
XCZU42DR-1FFVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-L1FSVE1156I ds889-zynq-usp-rfsoc-overview
XCZU42DR-L1FSVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-2FSVE1156E ds889-zynq-usp-rfsoc-overview
XCZU42DR-2FSVE1156E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-L1FFVE1156I ds889-zynq-usp-rfsoc-overview
XCZU42DR-L1FFVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU55DR-1FSVE1156I XCN20014
XCZU55DR-1FSVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU55DR-1FFVE1156I XCN20014
XCZU55DR-1FFVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-1FSVE1156E ds889-zynq-usp-rfsoc-overview
XCZU47DR-1FSVE1156E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-1FSVE1156E ds889-zynq-usp-rfsoc-overview
XCZU43DR-1FSVE1156E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-1FFVE1156E ds889-zynq-usp-rfsoc-overview
XCZU43DR-1FFVE1156E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-1FFVE1156E ds889-zynq-usp-rfsoc-overview
XCZU47DR-1FFVE1156E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU57DR-1FFVE1156I XCN20014
XCZU57DR-1FFVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU57DR-1FSVE1156I XCN20014
XCZU57DR-1FSVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-2FFVE1156I ds889-zynq-usp-rfsoc-overview
XCZU42DR-2FFVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU42DR-2FSVE1156I ds889-zynq-usp-rfsoc-overview
XCZU42DR-2FSVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU55DR-L1FSVE1156I XCN20014
XCZU55DR-L1FSVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU55DR-L1FFVE1156I XCN20014
XCZU55DR-L1FFVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-1FSVG1517E ds889-zynq-usp-rfsoc-overview
XCZU43DR-1FSVG1517E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-1FFVG1517E ds889-zynq-usp-rfsoc-overview
XCZU43DR-1FFVG1517E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-1FFVG1517E ds889-zynq-usp-rfsoc-overview
XCZU47DR-1FFVG1517E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-1FSVG1517E ds889-zynq-usp-rfsoc-overview
XCZU47DR-1FSVG1517E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU57DR-L1FFVE1156I XCN20014
XCZU57DR-L1FFVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU57DR-L1FSVE1156I XCN20014
XCZU57DR-L1FSVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-1FSVE1156I ds889-zynq-usp-rfsoc-overview
XCZU47DR-1FSVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-1FFVE1156I ds889-zynq-usp-rfsoc-overview
XCZU47DR-1FFVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-1FSVE1156I ds889-zynq-usp-rfsoc-overview
XCZU43DR-1FSVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU55DR-2FSVE1156I XCN20014
XCZU55DR-2FSVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU55DR-2FFVE1156I XCN20014
XCZU55DR-2FFVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU48DR-1FFVE1156E ds889-zynq-usp-rfsoc-overview
XCZU48DR-1FFVE1156E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU48DR-1FSVE1156E ds889-zynq-usp-rfsoc-overview
XCZU48DR-1FSVE1156E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU57DR-2FFVE1156I XCN20014
XCZU57DR-2FFVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU57DR-2FSVE1156I XCN20014
XCZU57DR-2FSVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU46DR-1FSVH1760E ds889-zynq-usp-rfsoc-overview
XCZU46DR-1FSVH1760E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-2FFVE1156E ds889-zynq-usp-rfsoc-overview
XCZU43DR-2FFVE1156E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-2FFVE1156E ds889-zynq-usp-rfsoc-overview
XCZU47DR-2FFVE1156E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU10P-2FFVB676I ds890-ultrascale-overview
XCAU10P-2FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 228
DigiKey Programmable: Not Verified
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+357.02 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7A35T-1CSG324I ds180_7Series_Overview
XC7A35T-1CSG324I
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 210
DigiKey Programmable: Not Verified
auf Bestellung 628 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+103.98 EUR
Im Einkaufswagen  Stück im Wert von  UAH
A-U45N-P08G-PQ-G 2100167-product-brief-alveo-u45n.pdf
A-U45N-P08G-PQ-G
Hersteller: AMD
Description: BOARD DCAB SERVER/NET U45N ALVEO
Power (Watts): 75W
Packaging: Box
Memory Size: 4GB
Interface: PCI Express
Operating Temperature: 30°C
Bandwidth: 200GB/s
Cooling Type: Heat Sink
LUTs: 1030k
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+4570.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
Wählen Sie Seite:   [  << Vorherige Seite ]  1 24 48 49 50 51 52 53 54 55 56 57 58 72 96 120 144 168 192 216 240  [ Nächste Seite >> ]