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EFR-DI-AES-IP-WW AMD Introduction Description: LOGICORE, ADVANCED ENCRYPTION ST
Packaging: Bulk
Produkt ist nicht verfügbar
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EFR-DI-ERNIC-WW AMD Description: DEV RNIC SITE LICENSE RENEWAL WW
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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XC18V01PC20C0100 XC18V01PC20C0100 AMD XC18V00_Series_v6,_10-5-15.pdf Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC18V01PCG20C0100 XC18V01PCG20C0100 AMD XC18V00_Series_v6,_10-5-15.pdf Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC18V01SO20C0100 XC18V01SO20C0100 AMD XC18V00_Series_v6,_10-5-15.pdf Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-SOIC
DigiKey Programmable: Not Verified
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XC18V01VQG44C0100 XC18V01VQG44C0100 AMD XC18V00_Series_v6,_10-5-15.pdf Description: XC18V01VQG44C0100
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7A35T-1FGG484C XC7A35T-1FGG484C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
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EFR-DI-FLASH-LDPC-SITE AMD Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Xilinx
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EFR-DI-FLASH-LDPC-WW AMD Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Xilinx
Produkt ist nicht verfügbar
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EF-DI-FLASH-LDPC-SITE AMD kluQRHH2MabKs5cfFYUQmg Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Xilinx
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EF-DI-FLASH-LDPC-WW AMD kluQRHH2MabKs5cfFYUQmg Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Xilinx
Produkt ist nicht verfügbar
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XCVP1402-1LSEVSVA3340 AMD ds950-versal-overview Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
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XCVP1402-1LSIVSVA3340 AMD ds950-versal-overview Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
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XCVP1402-2LSEVSVA3340 AMD ds950-versal-overview Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
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XCVP1402-2LLEVSVA3340 AMD ds950-versal-overview Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
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XCVP1402-1LLIVSVA3340 AMD ds950-versal-overview Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
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XCVU57P-1FSVK2892E XCVU57P-1FSVK2892E AMD ds923-virtex-ultrascale-plus Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
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XCVU57P-2FSVK2892E XCVU57P-2FSVK2892E AMD ds923-virtex-ultrascale-plus Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
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XCVU57P-L2FSVK2892E XCVU57P-L2FSVK2892E AMD ds923-virtex-ultrascale-plus Description: IC FPGA VIRTEX-UP LP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
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XCVU57P-3FSVK2892E XCVU57P-3FSVK2892E AMD ds923-virtex-ultrascale-plus Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
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XAZU1EG-1SFVA625Q XAZU1EG-1SFVA625Q AMD ds894-zynq-ultrascale-plus-overview Description: IC ZUP MPSOC A53 FPGA Q 625BGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MPU, FPGA
auf Bestellung 5 Stücke:
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XC7A15T-1CSG324I XC7A15T-1CSG324I AMD ds180_7Series_Overview Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
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XC7A15T-3CSG324E XC7A15T-3CSG324E AMD ds180_7Series_Overview Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
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DS-XPA-500K AMD Description: XILINX PRODUCTIVITY ADVANTAGE 1
Packaging: Bulk
Type: Design Software
Applications: Programming
Produkt ist nicht verfügbar
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EK-XRF4-3342-V1-G AMD Introduction Description: XRF4 RF ACCESSORY KIT
Packaging: Bulk
For Use With/Related Products: ZCU208, ZCU670
Accessory Type: Accessory Kit
Utilized IC / Part: ZCU208, ZCU670
Produkt ist nicht verfügbar
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XC3S250E-4PQG208C XC3S250E-4PQG208C AMD ds312 Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
auf Bestellung 311 Stücke:
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XC3S200-4VQ100I XC3S200-4VQ100I AMD ds099 Description: IC FPGA 63 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 63
DigiKey Programmable: Not Verified
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XCVU160-H1FLGB2104E AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU190-2FLGB2104E AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
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XCVU190-2FLGB2104I AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU160-3FLGB2104E AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU11P-1FLGB2104I AMD ds923-virtex-ultrascale-plus Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU13P-1FHGB2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU190-3FLGB2104E AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU11P-L2FLGB2104E AMD virtex-ultrascale-plus-product-brief.pdf Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU13P-1FHGB2104I AMD ds923-virtex-ultrascale-plus Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU13P-2FHGB2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU13P-2FHGB2104I AMD ds923-virtex-ultrascale-plus Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU13P-L2FHGB2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 832 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 832
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7S75-1FGGA676Q XC7S75-1FGGA676Q AMD ds180_7Series_Overview Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 4331520
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XA7S75-2FGGA676I XA7S75-2FGGA676I AMD j6dhSNsTk1SGc2BkX0wKUg Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 3317760
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XC7S100-L1FGGA676I XC7S100-L1FGGA676I AMD Spartan-7-FPGAs-Data-Sheet-DC-and-AC-Switching-Characteristics Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.92V ~ 0.98V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XA7S100-2FGGA676I XA7S100-2FGGA676I AMD j6dhSNsTk1SGc2BkX0wKUg Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XA7S100-1FGGA676Q XA7S100-1FGGA676Q AMD j6dhSNsTk1SGc2BkX0wKUg Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XCKU040-L1FBVA676I XCKU040-L1FBVA676I AMD ds892-kintex-ultrascale-data-sheet Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU040-2FBVA676I XCKU040-2FBVA676I AMD ds892-kintex-ultrascale-data-sheet Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU040-3FBVA676E XCKU040-3FBVA676E AMD ds892-kintex-ultrascale-data-sheet Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DK-U1-KCU1500-A-G DK-U1-KCU1500-A-G AMD DK-U1-KCU1500-A-G_Dev_Kit_Overview.PDF Description: KINTEX ULTRASCALE FPGA KCU1500
Packaging: Box
For Use With/Related Products: XCKU115
Type: FPGA
Contents: Board(s), Cable(s)
Platform: Kintex UltraScale FPGA KCU1500 Acceleration PCIe Card
Utilized IC / Part: XCKU115
Produkt ist nicht verfügbar
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XCZU4EG-1SFVC784I XCZU4EG-1SFVC784I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-1FBVB900E XCZU4EG-1FBVB900E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-2SFVC784E XCZU4EG-2SFVC784E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-2SFVC784I XCZU4EG-2SFVC784I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-L2SFVC784E XCZU4EG-L2SFVC784E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-1FBVB900I XCZU4EG-1FBVB900I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-2FBVB900E XCZU4EG-2FBVB900E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-3SFVC784E XCZU4EG-3SFVC784E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 600MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-2FBVB900I XCZU4EG-2FBVB900I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-L2FBVB900E XCZU4EG-L2FBVB900E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XC5206-3TQ144C XC5206-3TQ144C AMD 1605200.pdf?t.download=true&u=ovmfp3 Description: FPGA, 196 CLBS, 6000 GATES
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 784
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 196
Number of I/O: 117
DigiKey Programmable: Not Verified
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5+106.65 EUR
Mindestbestellmenge: 5
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XC3S1000-4FGG320I XC3S1000-4FGG320I AMD ds099 Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EFR-DI-AES-IP-WW Introduction
Hersteller: AMD
Description: LOGICORE, ADVANCED ENCRYPTION ST
Packaging: Bulk
Produkt ist nicht verfügbar
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EFR-DI-ERNIC-WW
Hersteller: AMD
Description: DEV RNIC SITE LICENSE RENEWAL WW
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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XC18V01PC20C0100 XC18V00_Series_v6,_10-5-15.pdf
XC18V01PC20C0100
Hersteller: AMD
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC18V01PCG20C0100 XC18V00_Series_v6,_10-5-15.pdf
XC18V01PCG20C0100
Hersteller: AMD
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC18V01SO20C0100 XC18V00_Series_v6,_10-5-15.pdf
XC18V01SO20C0100
Hersteller: AMD
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-SOIC
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC18V01VQG44C0100 XC18V00_Series_v6,_10-5-15.pdf
XC18V01VQG44C0100
Hersteller: AMD
Description: XC18V01VQG44C0100
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7A35T-1FGG484C ds181_Artix_7_Data_Sheet
XC7A35T-1FGG484C
Hersteller: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 88 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+111.48 EUR
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EFR-DI-FLASH-LDPC-SITE
Hersteller: AMD
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Xilinx
Produkt ist nicht verfügbar
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EFR-DI-FLASH-LDPC-WW
Hersteller: AMD
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Xilinx
Produkt ist nicht verfügbar
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EF-DI-FLASH-LDPC-SITE kluQRHH2MabKs5cfFYUQmg
Hersteller: AMD
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Xilinx
Produkt ist nicht verfügbar
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EF-DI-FLASH-LDPC-WW kluQRHH2MabKs5cfFYUQmg
Hersteller: AMD
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Xilinx
Produkt ist nicht verfügbar
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XCVP1402-1LSEVSVA3340 ds950-versal-overview
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVP1402-1LSIVSVA3340 ds950-versal-overview
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVP1402-2LSEVSVA3340 ds950-versal-overview
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVP1402-2LLEVSVA3340 ds950-versal-overview
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVP1402-1LLIVSVA3340 ds950-versal-overview
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVU57P-1FSVK2892E ds923-virtex-ultrascale-plus
XCVU57P-1FSVK2892E
Hersteller: AMD
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU57P-2FSVK2892E ds923-virtex-ultrascale-plus
XCVU57P-2FSVK2892E
Hersteller: AMD
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU57P-L2FSVK2892E ds923-virtex-ultrascale-plus
XCVU57P-L2FSVK2892E
Hersteller: AMD
Description: IC FPGA VIRTEX-UP LP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU57P-3FSVK2892E ds923-virtex-ultrascale-plus
XCVU57P-3FSVK2892E
Hersteller: AMD
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XAZU1EG-1SFVA625Q ds894-zynq-ultrascale-plus-overview
XAZU1EG-1SFVA625Q
Hersteller: AMD
Description: IC ZUP MPSOC A53 FPGA Q 625BGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MPU, FPGA
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1117.05 EUR
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XC7A15T-1CSG324I ds180_7Series_Overview
XC7A15T-1CSG324I
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
auf Bestellung 329 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+80.48 EUR
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XC7A15T-3CSG324E ds180_7Series_Overview
XC7A15T-3CSG324E
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DS-XPA-500K
Hersteller: AMD
Description: XILINX PRODUCTIVITY ADVANTAGE 1
Packaging: Bulk
Type: Design Software
Applications: Programming
Produkt ist nicht verfügbar
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EK-XRF4-3342-V1-G Introduction
Hersteller: AMD
Description: XRF4 RF ACCESSORY KIT
Packaging: Bulk
For Use With/Related Products: ZCU208, ZCU670
Accessory Type: Accessory Kit
Utilized IC / Part: ZCU208, ZCU670
Produkt ist nicht verfügbar
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XC3S250E-4PQG208C ds312
XC3S250E-4PQG208C
Hersteller: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
auf Bestellung 311 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+396.53 EUR
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XC3S200-4VQ100I ds099
XC3S200-4VQ100I
Hersteller: AMD
Description: IC FPGA 63 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+79.60 EUR
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XCVU160-H1FLGB2104E O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU190-2FLGB2104E O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU190-2FLGB2104I O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU160-3FLGB2104E O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU11P-1FLGB2104I ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU13P-1FHGB2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU190-3FLGB2104E O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU11P-L2FLGB2104E virtex-ultrascale-plus-product-brief.pdf
Hersteller: AMD
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU13P-1FHGB2104I ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU13P-2FHGB2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU13P-2FHGB2104I ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU13P-L2FHGB2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 832 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 832
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7S75-1FGGA676Q ds180_7Series_Overview
XC7S75-1FGGA676Q
Hersteller: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 4331520
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XA7S75-2FGGA676I j6dhSNsTk1SGc2BkX0wKUg
XA7S75-2FGGA676I
Hersteller: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 3317760
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XC7S100-L1FGGA676I Spartan-7-FPGAs-Data-Sheet-DC-and-AC-Switching-Characteristics
XC7S100-L1FGGA676I
Hersteller: AMD
Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.92V ~ 0.98V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XA7S100-2FGGA676I j6dhSNsTk1SGc2BkX0wKUg
XA7S100-2FGGA676I
Hersteller: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XA7S100-1FGGA676Q j6dhSNsTk1SGc2BkX0wKUg
XA7S100-1FGGA676Q
Hersteller: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XCKU040-L1FBVA676I ds892-kintex-ultrascale-data-sheet
XCKU040-L1FBVA676I
Hersteller: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU040-2FBVA676I ds892-kintex-ultrascale-data-sheet
XCKU040-2FBVA676I
Hersteller: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU040-3FBVA676E ds892-kintex-ultrascale-data-sheet
XCKU040-3FBVA676E
Hersteller: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DK-U1-KCU1500-A-G DK-U1-KCU1500-A-G_Dev_Kit_Overview.PDF
DK-U1-KCU1500-A-G
Hersteller: AMD
Description: KINTEX ULTRASCALE FPGA KCU1500
Packaging: Box
For Use With/Related Products: XCKU115
Type: FPGA
Contents: Board(s), Cable(s)
Platform: Kintex UltraScale FPGA KCU1500 Acceleration PCIe Card
Utilized IC / Part: XCKU115
Produkt ist nicht verfügbar
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XCZU4EG-1SFVC784I jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-1SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-1FBVB900E jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-1FBVB900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-2SFVC784E jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-2SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-2SFVC784I jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-2SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-L2SFVC784E jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-L2SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-1FBVB900I jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-1FBVB900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-2FBVB900E jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-2FBVB900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-3SFVC784E jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-3SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 600MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-2FBVB900I jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-2FBVB900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-L2FBVB900E jDqbmrrvy_u9hmwDv1iWBQ
XCZU4EG-L2FBVB900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XC5206-3TQ144C 1605200.pdf?t.download=true&u=ovmfp3
XC5206-3TQ144C
Hersteller: AMD
Description: FPGA, 196 CLBS, 6000 GATES
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 784
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 196
Number of I/O: 117
DigiKey Programmable: Not Verified
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+106.65 EUR
Mindestbestellmenge: 5
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XC3S1000-4FGG320I ds099
XC3S1000-4FGG320I
Hersteller: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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