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XC4025E-3HQ240I XC4025E-3HQ240I AMD XILIS01062-1.pdf?t.download=true&u=5oefqw Description: FIELD PROGRAMMABLE GATE ARRAY, 1
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 25000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 193
DigiKey Programmable: Not Verified
auf Bestellung 132 Stücke:
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2+366.16 EUR
Mindestbestellmenge: 2
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XC4004A-6TQ144I XC4004A-6TQ144I AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 144 CLBS, 3200 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 85 Stücke:
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8+63.51 EUR
Mindestbestellmenge: 8
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XC4028XL-2HQ208C XC4028XL-2HQ208C AMD 4000.pdf Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 23 Stücke:
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5+114.11 EUR
Mindestbestellmenge: 5
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XC4028XL-3BG352C AMD 4000.pdf Description: IC FPGA 256 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
2+373.17 EUR
Mindestbestellmenge: 2
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XC4062XL-3BG432C AMD 4000.pdf Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVM1502-1MSEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-1LSEVFVC1760 XCVM1502-1LSEVFVC1760 AMD versal-ai-core-product-selection-guide Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-1MSIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2MSEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1802-1MSEVFVC1760 XCVM1802-1MSEVFVC1760 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-1MLIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-1LSIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2LSEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2MLEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1802-1LSEVFVC1760 XCVM1802-1LSEVFVC1760 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2MSIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1802-2MSEVFVC1760 XCVM1802-2MSEVFVC1760 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1802-1MSIVFVC1760 XCVM1802-1MSIVFVC1760 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-1LLIVFVC1760 XCVM1502-1LLIVFVC1760 AMD versal-ai-core-product-selection-guide Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2LLEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2MLIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2HSIVFVC1760 AMD Description: XCVM1502-2HSIVFVC1760
Packaging: Bulk
Package / Case: 1760-BFBGA, FCBGA
Speed: 800MHz, 1.65GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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EK-U1-VCU108-G-J EK-U1-VCU108-G-J AMD xtp400-vcu108-quickstart.pdf Description: KIT EVAL VIRTEX FPGA VCU108 JP
Packaging: Box
For Use With/Related Products: XCVU095
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Virtex UltraScale FPGA VCU108 Japan PCIe Card
Produkt ist nicht verfügbar
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XCAU20P-1FFVB676E XCAU20P-1FFVB676E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU20P-1SFVB784E XCAU20P-1SFVB784E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU25P-1FFVB676E XCAU25P-1FFVB676E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU25P-1SFVB784E XCAU25P-1SFVB784E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU20P-1SFVB784I XCAU20P-1SFVB784I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU20P-2FFVB676E XCAU20P-2FFVB676E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU20P-L1FFVB676I XCAU20P-L1FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU20P-L1SFVB784I XCAU20P-L1SFVB784I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU20P-2SFVB784E XCAU20P-2SFVB784E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU25P-1SFVB784I XCAU25P-1SFVB784I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU25P-L1FFVB676I XCAU25P-L1FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU25P-2FFVB676E XCAU25P-2FFVB676E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-L1SFVB784I XCAU25P-L1SFVB784I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-2SFVB784E XCAU25P-2SFVB784E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-2FFVB676I XCAU25P-2FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC6SLX150-2FG484I XC6SLX150-2FG484I AMD ds162 Description: IC FPGA 338 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 147443
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 11519
Total RAM Bits: 4939776
Number of I/O: 338
DigiKey Programmable: Not Verified
auf Bestellung 120 Stücke:
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1+731.81 EUR
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XCKU040-2FFVA1156I XCKU040-2FFVA1156I AMD ds922-kintex-ultrascale-plus Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 520
DigiKey Programmable: Not Verified
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
1+5537.35 EUR
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XCZU6CG-1FFVB1156E XCZU6CG-1FFVB1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9CG-1FFVB1156E XCZU9CG-1FFVB1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU6CG-1FFVB1156I XCZU6CG-1FFVB1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9EG-1FFVB1156E XCZU9EG-1FFVB1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU6CG-2FFVB1156E XCZU6CG-2FFVB1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU6CG-L1FFVB1156I XCZU6CG-L1FFVB1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9CG-1FFVB1156I XCZU9CG-1FFVB1156I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1302-2MSENSVF1369 XCVM1302-2MSENSVF1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCZU6CG-2FFVB1156I XCZU6CG-2FFVB1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9EG-1FFVB1156I XCZU9EG-1FFVB1156I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9CG-L1FFVB1156I XCZU9CG-L1FFVB1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9CG-2FFVB1156E XCZU9CG-2FFVB1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3130-4PC84C XC3130-4PC84C AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-PLCC (29.31x29.31)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
auf Bestellung 376 Stücke:
Lieferzeit 10-14 Tag (e)
36+13.90 EUR
Mindestbestellmenge: 36
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XC3130-PC44CPH XC3130-PC44CPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 792 Stücke:
Lieferzeit 10-14 Tag (e)
45+11.39 EUR
Mindestbestellmenge: 45
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XC3130-PC68CPH XC3130-PC68CPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 2897 Stücke:
Lieferzeit 10-14 Tag (e)
43+11.47 EUR
Mindestbestellmenge: 43
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XC3130-PQ100IPH XC3130-PQ100IPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 100
Supplier Device Package: 100-PQFP (20x14)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 80
DigiKey Programmable: Not Verified
auf Bestellung 141 Stücke:
Lieferzeit 10-14 Tag (e)
34+14.61 EUR
Mindestbestellmenge: 34
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XC3130-PC84CPH XC3130-PC84CPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-PLCC (29.31x29.31)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
auf Bestellung 426 Stücke:
Lieferzeit 10-14 Tag (e)
17+29.57 EUR
Mindestbestellmenge: 17
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XC3164-PP132CPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3164 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 132-BPGA
Mounting Type: Through Hole
Number of Gates: 4500
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.25V ~ 5.25V
Number of Logic Elements/Cells: 224
Supplier Device Package: 132-PGA (37.08x37.08)
Number of LABs/CLBs: 224
Total RAM Bits: 46064
Number of I/O: 110
DigiKey Programmable: Not Verified
auf Bestellung 362 Stücke:
Lieferzeit 10-14 Tag (e)
10+53.63 EUR
Mindestbestellmenge: 10
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XC3164-PG132CPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3164 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 132-BCPGA
Mounting Type: Through Hole
Number of Gates: 4500
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.25V ~ 5.25V
Number of Logic Elements/Cells: 224
Supplier Device Package: 132-CPGA (37.08x37.08)
Number of LABs/CLBs: 224
Total RAM Bits: 46064
Number of I/O: 110
DigiKey Programmable: Not Verified
auf Bestellung 302 Stücke:
Lieferzeit 10-14 Tag (e)
10+53.63 EUR
Mindestbestellmenge: 10
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XC3195-PG175CPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3195 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 144
DigiKey Programmable: Not Verified
auf Bestellung 473 Stücke:
Lieferzeit 10-14 Tag (e)
9+58.77 EUR
Mindestbestellmenge: 9
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XC4025E-3HQ240I XILIS01062-1.pdf?t.download=true&u=5oefqw
XC4025E-3HQ240I
Hersteller: AMD
Description: FIELD PROGRAMMABLE GATE ARRAY, 1
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 25000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 193
DigiKey Programmable: Not Verified
auf Bestellung 132 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+366.16 EUR
Mindestbestellmenge: 2
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XC4004A-6TQ144I 4000.pdf?t.download=true&u=ovmfp3
XC4004A-6TQ144I
Hersteller: AMD
Description: FPGA, 144 CLBS, 3200 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 85 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+63.51 EUR
Mindestbestellmenge: 8
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XC4028XL-2HQ208C 4000.pdf
XC4028XL-2HQ208C
Hersteller: AMD
Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+114.11 EUR
Mindestbestellmenge: 5
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XC4028XL-3BG352C 4000.pdf
Hersteller: AMD
Description: IC FPGA 256 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
auf Bestellung 9 Stücke:
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Anzahl Preis
2+373.17 EUR
Mindestbestellmenge: 2
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XC4062XL-3BG432C 4000.pdf
Hersteller: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1MSEVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1LSEVFVC1760 versal-ai-core-product-selection-guide
XCVM1502-1LSEVFVC1760
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1MSIVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MSEVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1802-1MSEVFVC1760 ds950-versal-overview
XCVM1802-1MSEVFVC1760
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1MLIVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1LSIVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2LSEVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MLEVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1802-1LSEVFVC1760 ds950-versal-overview
XCVM1802-1LSEVFVC1760
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MSIVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1802-2MSEVFVC1760 ds950-versal-overview
XCVM1802-2MSEVFVC1760
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1802-1MSIVFVC1760 ds950-versal-overview
XCVM1802-1MSIVFVC1760
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1LLIVFVC1760 versal-ai-core-product-selection-guide
XCVM1502-1LLIVFVC1760
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2LLEVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MLIVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2HSIVFVC1760
Hersteller: AMD
Description: XCVM1502-2HSIVFVC1760
Packaging: Bulk
Package / Case: 1760-BFBGA, FCBGA
Speed: 800MHz, 1.65GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-VCU108-G-J xtp400-vcu108-quickstart.pdf
EK-U1-VCU108-G-J
Hersteller: AMD
Description: KIT EVAL VIRTEX FPGA VCU108 JP
Packaging: Box
For Use With/Related Products: XCVU095
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Virtex UltraScale FPGA VCU108 Japan PCIe Card
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-1FFVB676E ds890-ultrascale-overview
XCAU20P-1FFVB676E
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-1SFVB784E ds890-ultrascale-overview
XCAU20P-1SFVB784E
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-1FFVB676E ds890-ultrascale-overview
XCAU25P-1FFVB676E
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-1SFVB784E ds890-ultrascale-overview
XCAU25P-1SFVB784E
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-1SFVB784I ds890-ultrascale-overview
XCAU20P-1SFVB784I
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-2FFVB676E ds890-ultrascale-overview
XCAU20P-2FFVB676E
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-L1FFVB676I ds890-ultrascale-overview
XCAU20P-L1FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-L1SFVB784I ds890-ultrascale-overview
XCAU20P-L1SFVB784I
Hersteller: AMD
Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-2SFVB784E ds890-ultrascale-overview
XCAU20P-2SFVB784E
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-1SFVB784I ds890-ultrascale-overview
XCAU25P-1SFVB784I
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-L1FFVB676I ds890-ultrascale-overview
XCAU25P-L1FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-2FFVB676E ds890-ultrascale-overview
XCAU25P-2FFVB676E
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-L1SFVB784I ds890-ultrascale-overview
XCAU25P-L1SFVB784I
Hersteller: AMD
Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-2SFVB784E ds890-ultrascale-overview
XCAU25P-2SFVB784E
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-2FFVB676I ds890-ultrascale-overview
XCAU25P-2FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC6SLX150-2FG484I ds162
XC6SLX150-2FG484I
Hersteller: AMD
Description: IC FPGA 338 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 147443
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 11519
Total RAM Bits: 4939776
Number of I/O: 338
DigiKey Programmable: Not Verified
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+731.81 EUR
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XCKU040-2FFVA1156I ds922-kintex-ultrascale-plus
XCKU040-2FFVA1156I
Hersteller: AMD
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 520
DigiKey Programmable: Not Verified
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+5537.35 EUR
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XCZU6CG-1FFVB1156E ds891-zynq-ultrascale-plus-overview
XCZU6CG-1FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9CG-1FFVB1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU9CG-1FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU6CG-1FFVB1156I ds891-zynq-ultrascale-plus-overview
XCZU6CG-1FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9EG-1FFVB1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU9EG-1FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU6CG-2FFVB1156E ds891-zynq-ultrascale-plus-overview
XCZU6CG-2FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU6CG-L1FFVB1156I ds891-zynq-ultrascale-plus-overview
XCZU6CG-L1FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9CG-1FFVB1156I jDqbmrrvy_u9hmwDv1iWBQ
XCZU9CG-1FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1302-2MSENSVF1369 ds950-versal-overview
XCVM1302-2MSENSVF1369
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU6CG-2FFVB1156I ds891-zynq-ultrascale-plus-overview
XCZU6CG-2FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9EG-1FFVB1156I jDqbmrrvy_u9hmwDv1iWBQ
XCZU9EG-1FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9CG-L1FFVB1156I ds891-zynq-ultrascale-plus-overview
XCZU9CG-L1FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9CG-2FFVB1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU9CG-2FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3130-4PC84C 1153000.pdf?t.download=true&u=ovmfp3
XC3130-4PC84C
Hersteller: AMD
Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-PLCC (29.31x29.31)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
auf Bestellung 376 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
36+13.90 EUR
Mindestbestellmenge: 36
Im Einkaufswagen  Stück im Wert von  UAH
XC3130-PC44CPH 1153000.pdf?t.download=true&u=ovmfp3
XC3130-PC44CPH
Hersteller: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 792 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
45+11.39 EUR
Mindestbestellmenge: 45
Im Einkaufswagen  Stück im Wert von  UAH
XC3130-PC68CPH 1153000.pdf?t.download=true&u=ovmfp3
XC3130-PC68CPH
Hersteller: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 2897 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
43+11.47 EUR
Mindestbestellmenge: 43
Im Einkaufswagen  Stück im Wert von  UAH
XC3130-PQ100IPH 1153000.pdf?t.download=true&u=ovmfp3
XC3130-PQ100IPH
Hersteller: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 100
Supplier Device Package: 100-PQFP (20x14)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 80
DigiKey Programmable: Not Verified
auf Bestellung 141 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
34+14.61 EUR
Mindestbestellmenge: 34
Im Einkaufswagen  Stück im Wert von  UAH
XC3130-PC84CPH 1153000.pdf?t.download=true&u=ovmfp3
XC3130-PC84CPH
Hersteller: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-PLCC (29.31x29.31)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
auf Bestellung 426 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
17+29.57 EUR
Mindestbestellmenge: 17
Im Einkaufswagen  Stück im Wert von  UAH
XC3164-PP132CPH 1153000.pdf?t.download=true&u=ovmfp3
Hersteller: AMD
Description: XC3164 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 132-BPGA
Mounting Type: Through Hole
Number of Gates: 4500
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.25V ~ 5.25V
Number of Logic Elements/Cells: 224
Supplier Device Package: 132-PGA (37.08x37.08)
Number of LABs/CLBs: 224
Total RAM Bits: 46064
Number of I/O: 110
DigiKey Programmable: Not Verified
auf Bestellung 362 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+53.63 EUR
Mindestbestellmenge: 10
Im Einkaufswagen  Stück im Wert von  UAH
XC3164-PG132CPH 1153000.pdf?t.download=true&u=ovmfp3
Hersteller: AMD
Description: XC3164 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 132-BCPGA
Mounting Type: Through Hole
Number of Gates: 4500
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.25V ~ 5.25V
Number of Logic Elements/Cells: 224
Supplier Device Package: 132-CPGA (37.08x37.08)
Number of LABs/CLBs: 224
Total RAM Bits: 46064
Number of I/O: 110
DigiKey Programmable: Not Verified
auf Bestellung 302 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+53.63 EUR
Mindestbestellmenge: 10
Im Einkaufswagen  Stück im Wert von  UAH
XC3195-PG175CPH 1153000.pdf?t.download=true&u=ovmfp3
Hersteller: AMD
Description: XC3195 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 144
DigiKey Programmable: Not Verified
auf Bestellung 473 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+58.77 EUR
Mindestbestellmenge: 9
Im Einkaufswagen  Stück im Wert von  UAH
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