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XA7S25-2CSGA225I XA7S25-2CSGA225I AMD j6dhSNsTk1SGc2BkX0wKUg Description: IC FPGA 150 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 225-CSPBGA (13x13)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XA7S25-1CSGA225Q XA7S25-1CSGA225Q AMD j6dhSNsTk1SGc2BkX0wKUg Description: IC FPGA 150 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 225-CSPBGA (13x13)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XA7A12T-1CSG325Q AMD s3NwarfUcQdgTa4CDreCuQ Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Number of I/O: 150
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XA7A25T-1CSG325I XA7A25T-1CSG325I AMD s3NwarfUcQdgTa4CDreCuQ Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XA7A25T-2CSG325I XA7A25T-2CSG325I AMD s3NwarfUcQdgTa4CDreCuQ Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XA3S1500-4FGG676I XA3S1500-4FGG676I AMD 3AZXjBRmzTgewD3IuB~V~g Description: IC FPGA 487 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 3328
Total RAM Bits: 589824
Grade: Automotive
Number of I/O: 487
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XCVU13P-L2FIGD2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 676 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 676
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU13P-2FHGA2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 832 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 832
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4028XLA-09BGG352C XC4028XLA-09BGG352C AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
auf Bestellung 302 Stücke:
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3+207.47 EUR
Mindestbestellmenge: 3
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XC4028XL-3HQ208I XC4028XL-3HQ208I AMD 4000.pdf Description: IC FPGA 160 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4008E-3PQ208C XC4008E-3PQ208C AMD Description: IC FPGA 144 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
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2+256.1 EUR
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XC4008E-3PQ208C XC4008E-3PQ208C AMD Description: IC FPGA 144 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4044XL-1BG352C AMD 4000.pdf Description: IC FPGA 289 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 44000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3800
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1600
Total RAM Bits: 51200
Number of I/O: 289
DigiKey Programmable: Not Verified
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2+300.84 EUR
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XC4062XL-1BG432C AMD 4000.pdf Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4062XL-1BG560C AMD 4000.pdf Description: IC FPGA 384 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4062XL-1BG432I AMD 4000.pdf Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4062XL-09BG432C AMD ~eXJ78~X0b0haIBXA~GNOw Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4025E-3HQ240I XC4025E-3HQ240I AMD XILIS01062-1.pdf?t.download=true&u=5oefqw Description: FIELD PROGRAMMABLE GATE ARRAY, 1
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 25000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 193
DigiKey Programmable: Not Verified
auf Bestellung 132 Stücke:
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2+366.16 EUR
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XC4004A-6TQ144I XC4004A-6TQ144I AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 144 CLBS, 3200 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
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8+63.51 EUR
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XC4028XL-2HQ208C XC4028XL-2HQ208C AMD 4000.pdf Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
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5+114.11 EUR
Mindestbestellmenge: 5
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XC4028XL-3BG352C AMD 4000.pdf Description: IC FPGA 256 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
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2+373.17 EUR
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XC4062XL-3BG432C AMD 4000.pdf Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVM1502-1MSEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-1LSEVFVC1760 XCVM1502-1LSEVFVC1760 AMD versal-ai-core-product-selection-guide Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-1MSIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2MSEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1802-1MSEVFVC1760 XCVM1802-1MSEVFVC1760 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-1MLIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-1LSIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2LSEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2MLEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1802-1LSEVFVC1760 XCVM1802-1LSEVFVC1760 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2MSIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1802-2MSEVFVC1760 XCVM1802-2MSEVFVC1760 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1802-1MSIVFVC1760 XCVM1802-1MSIVFVC1760 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-1LLIVFVC1760 XCVM1502-1LLIVFVC1760 AMD versal-ai-core-product-selection-guide Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2LLEVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2MLIVFVC1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2HSIVFVC1760 AMD Description: XCVM1502-2HSIVFVC1760
Packaging: Bulk
Package / Case: 1760-BFBGA, FCBGA
Speed: 800MHz, 1.65GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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EK-U1-VCU108-G-J EK-U1-VCU108-G-J AMD xtp400-vcu108-quickstart.pdf Description: KIT EVAL VIRTEX FPGA VCU108 JP
Packaging: Box
For Use With/Related Products: XCVU095
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Virtex UltraScale FPGA VCU108 Japan PCIe Card
Produkt ist nicht verfügbar
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XCAU20P-1FFVB676E XCAU20P-1FFVB676E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU20P-1SFVB784E XCAU20P-1SFVB784E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU25P-1FFVB676E XCAU25P-1FFVB676E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU25P-1SFVB784E XCAU25P-1SFVB784E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU20P-1SFVB784I XCAU20P-1SFVB784I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU20P-2FFVB676E XCAU20P-2FFVB676E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU20P-L1FFVB676I XCAU20P-L1FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-L1SFVB784I XCAU20P-L1SFVB784I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-2SFVB784E XCAU20P-2SFVB784E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU25P-1SFVB784I XCAU25P-1SFVB784I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-L1FFVB676I XCAU25P-L1FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU25P-2FFVB676E XCAU25P-2FFVB676E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-L1SFVB784I XCAU25P-L1SFVB784I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-2SFVB784E XCAU25P-2SFVB784E AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-2FFVB676I XCAU25P-2FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC6SLX150-2FG484I XC6SLX150-2FG484I AMD ds162 Description: IC FPGA 338 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 147443
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 11519
Total RAM Bits: 4939776
Number of I/O: 338
DigiKey Programmable: Not Verified
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
1+731.81 EUR
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XCKU040-2FFVA1156I XCKU040-2FFVA1156I AMD ds922-kintex-ultrascale-plus Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 520
DigiKey Programmable: Not Verified
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
1+5537.35 EUR
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XCZU6CG-1FFVB1156E XCZU6CG-1FFVB1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU9CG-1FFVB1156E XCZU9CG-1FFVB1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU6CG-1FFVB1156I XCZU6CG-1FFVB1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XA7S25-2CSGA225I j6dhSNsTk1SGc2BkX0wKUg
XA7S25-2CSGA225I
Hersteller: AMD
Description: IC FPGA 150 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 225-CSPBGA (13x13)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XA7S25-1CSGA225Q j6dhSNsTk1SGc2BkX0wKUg
XA7S25-1CSGA225Q
Hersteller: AMD
Description: IC FPGA 150 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 225-CSPBGA (13x13)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XA7A12T-1CSG325Q s3NwarfUcQdgTa4CDreCuQ
Hersteller: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Number of I/O: 150
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XA7A25T-1CSG325I s3NwarfUcQdgTa4CDreCuQ
XA7A25T-1CSG325I
Hersteller: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XA7A25T-2CSG325I s3NwarfUcQdgTa4CDreCuQ
XA7A25T-2CSG325I
Hersteller: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XA3S1500-4FGG676I 3AZXjBRmzTgewD3IuB~V~g
XA3S1500-4FGG676I
Hersteller: AMD
Description: IC FPGA 487 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 3328
Total RAM Bits: 589824
Grade: Automotive
Number of I/O: 487
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XCVU13P-L2FIGD2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 676 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 676
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU13P-2FHGA2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 832 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 832
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC4028XLA-09BGG352C 4000.pdf?t.download=true&u=ovmfp3
XC4028XLA-09BGG352C
Hersteller: AMD
Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
auf Bestellung 302 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+207.47 EUR
Mindestbestellmenge: 3
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XC4028XL-3HQ208I 4000.pdf
XC4028XL-3HQ208I
Hersteller: AMD
Description: IC FPGA 160 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC4008E-3PQ208C
XC4008E-3PQ208C
Hersteller: AMD
Description: IC FPGA 144 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
auf Bestellung 335 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+256.1 EUR
Mindestbestellmenge: 2
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XC4008E-3PQ208C
XC4008E-3PQ208C
Hersteller: AMD
Description: IC FPGA 144 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC4044XL-1BG352C 4000.pdf
Hersteller: AMD
Description: IC FPGA 289 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 44000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3800
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1600
Total RAM Bits: 51200
Number of I/O: 289
DigiKey Programmable: Not Verified
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+300.84 EUR
Mindestbestellmenge: 2
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XC4062XL-1BG432C 4000.pdf
Hersteller: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC4062XL-1BG560C 4000.pdf
Hersteller: AMD
Description: IC FPGA 384 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC4062XL-1BG432I 4000.pdf
Hersteller: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC4062XL-09BG432C ~eXJ78~X0b0haIBXA~GNOw
Hersteller: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC4025E-3HQ240I XILIS01062-1.pdf?t.download=true&u=5oefqw
XC4025E-3HQ240I
Hersteller: AMD
Description: FIELD PROGRAMMABLE GATE ARRAY, 1
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 25000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 193
DigiKey Programmable: Not Verified
auf Bestellung 132 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+366.16 EUR
Mindestbestellmenge: 2
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XC4004A-6TQ144I 4000.pdf?t.download=true&u=ovmfp3
XC4004A-6TQ144I
Hersteller: AMD
Description: FPGA, 144 CLBS, 3200 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 85 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+63.51 EUR
Mindestbestellmenge: 8
Im Einkaufswagen  Stück im Wert von  UAH
XC4028XL-2HQ208C 4000.pdf
XC4028XL-2HQ208C
Hersteller: AMD
Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+114.11 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
XC4028XL-3BG352C 4000.pdf
Hersteller: AMD
Description: IC FPGA 256 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+373.17 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
XC4062XL-3BG432C 4000.pdf
Hersteller: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1MSEVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1LSEVFVC1760 versal-ai-core-product-selection-guide
XCVM1502-1LSEVFVC1760
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1MSIVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MSEVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1802-1MSEVFVC1760 ds950-versal-overview
XCVM1802-1MSEVFVC1760
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1MLIVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1LSIVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2LSEVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MLEVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1802-1LSEVFVC1760 ds950-versal-overview
XCVM1802-1LSEVFVC1760
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MSIVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1802-2MSEVFVC1760 ds950-versal-overview
XCVM1802-2MSEVFVC1760
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1802-1MSIVFVC1760 ds950-versal-overview
XCVM1802-1MSIVFVC1760
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-1LLIVFVC1760 versal-ai-core-product-selection-guide
XCVM1502-1LLIVFVC1760
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2LLEVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2MLIVFVC1760 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVM1502-2HSIVFVC1760
Hersteller: AMD
Description: XCVM1502-2HSIVFVC1760
Packaging: Bulk
Package / Case: 1760-BFBGA, FCBGA
Speed: 800MHz, 1.65GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-VCU108-G-J xtp400-vcu108-quickstart.pdf
EK-U1-VCU108-G-J
Hersteller: AMD
Description: KIT EVAL VIRTEX FPGA VCU108 JP
Packaging: Box
For Use With/Related Products: XCVU095
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Virtex UltraScale FPGA VCU108 Japan PCIe Card
Produkt ist nicht verfügbar
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XCAU20P-1FFVB676E ds890-ultrascale-overview
XCAU20P-1FFVB676E
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-1SFVB784E ds890-ultrascale-overview
XCAU20P-1SFVB784E
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-1FFVB676E ds890-ultrascale-overview
XCAU25P-1FFVB676E
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-1SFVB784E ds890-ultrascale-overview
XCAU25P-1SFVB784E
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-1SFVB784I ds890-ultrascale-overview
XCAU20P-1SFVB784I
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-2FFVB676E ds890-ultrascale-overview
XCAU20P-2FFVB676E
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-L1FFVB676I ds890-ultrascale-overview
XCAU20P-L1FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-L1SFVB784I ds890-ultrascale-overview
XCAU20P-L1SFVB784I
Hersteller: AMD
Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU20P-2SFVB784E ds890-ultrascale-overview
XCAU20P-2SFVB784E
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-1SFVB784I ds890-ultrascale-overview
XCAU25P-1SFVB784I
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-L1FFVB676I ds890-ultrascale-overview
XCAU25P-L1FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-2FFVB676E ds890-ultrascale-overview
XCAU25P-2FFVB676E
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-L1SFVB784I ds890-ultrascale-overview
XCAU25P-L1SFVB784I
Hersteller: AMD
Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-2SFVB784E ds890-ultrascale-overview
XCAU25P-2SFVB784E
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU25P-2FFVB676I ds890-ultrascale-overview
XCAU25P-2FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC6SLX150-2FG484I ds162
XC6SLX150-2FG484I
Hersteller: AMD
Description: IC FPGA 338 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 147443
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 11519
Total RAM Bits: 4939776
Number of I/O: 338
DigiKey Programmable: Not Verified
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+731.81 EUR
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XCKU040-2FFVA1156I ds922-kintex-ultrascale-plus
XCKU040-2FFVA1156I
Hersteller: AMD
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 520
DigiKey Programmable: Not Verified
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+5537.35 EUR
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XCZU6CG-1FFVB1156E ds891-zynq-ultrascale-plus-overview
XCZU6CG-1FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9CG-1FFVB1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU9CG-1FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU6CG-1FFVB1156I ds891-zynq-ultrascale-plus-overview
XCZU6CG-1FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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