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XAZU1EG-1SBVA484Q XAZU1EG-1SBVA484Q AMD ds894-zynq-ultrascale-plus-overview Description: IC ZUP MPSOC A53 FPGA Q 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
1+1023.55 EUR
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XCZU5EG-2SFVC784I XCZU5EG-2SFVC784I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+4238.84 EUR
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XC3S1000-4FG320C XC3S1000-4FG320C AMD ds099 Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EFR-DI-25GEMAC-PROJ AMD 10g_25g-HighSpeedEthernet_Jun6_2018.pdf Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-25G-TSN-802-1-CM-PROJ AMD 10g_25g-HighSpeedEthernet_Jun6_2018.pdf Description: 10G/25G TSN 802.1CM WIRELESS PRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Produkt ist nicht verfügbar
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EFR-DI-25GEMAC-SITE AMD 10g_25g-HighSpeedEthernet_Jun6_2018.pdf Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-25G-TSN-802-1-CM-SITE AMD 10g_25g-HighSpeedEthernet_Jun6_2018.pdf Description: 10G/25G TSN 802.1CM WIRELESS SIT
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Produkt ist nicht verfügbar
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EFR-DI-25G-RS-FEC-PROJ AMD Description: LOGICORE, 25G IEEE 802.3 REED-SO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-25GBASE-KR-PROJ AMD 10g_25g-HighSpeedEthernet_Jun6_2018.pdf Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-25G-RS-FEC-SITE AMD Description: LOGICORE, 25G IEEE 802.3 REED-SO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-25GBASE-KR-SITE AMD 10g_25g-HighSpeedEthernet_Jun6_2018.pdf Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-25GBASE-KR-WW AMD 10g_25g-HighSpeedEthernet_Jun6_2018.pdf Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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XC7A35T-2CSG324I XC7A35T-2CSG324I AMD ds180_7Series_Overview Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 210
DigiKey Programmable: Not Verified
auf Bestellung 232 Stücke:
Lieferzeit 10-14 Tag (e)
1+119.56 EUR
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XC7A75T-2CSG324I XC7A75T-2CSG324I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 210
DigiKey Programmable: Not Verified
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
1+250.71 EUR
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XC7A75T-L1CSG324I XC7A75T-L1CSG324I AMD ds180_7Series_Overview Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 210
DigiKey Programmable: Not Verified
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+240.45 EUR
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XCAU15P-2FFVB676I XCAU15P-2FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
DigiKey Programmable: Not Verified
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
1+490.64 EUR
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XCZU5EG-L2SFVC784E XCZU5EG-L2SFVC784E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+4270.22 EUR
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XCZU2CG-1UBVA530E XCZU2CG-1UBVA530E AMD ds890-ultrascale-overview Description: IC ZUP MPSOC A53 FPGA 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AM29LV160DT-70EC AMD Description: FLASH NOR 16MB TSOP TOP BLK 3V 7
Packaging: Tube
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 1032 Stücke:
Lieferzeit 10-14 Tag (e)
96+4.11 EUR
192+4.08 EUR
384+4.03 EUR
960+3.95 EUR
Mindestbestellmenge: 96
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AM29LV160DT-70EC/T AMD Description: FLASH NOR 16MB TSOP TOP BLK 3V 7
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 565 Stücke:
Lieferzeit 10-14 Tag (e)
100+4.11 EUR
200+4.08 EUR
300+4.05 EUR
500+4.03 EUR
Mindestbestellmenge: 100
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XC7A15T-2FGG484I XC7A15T-2FGG484I AMD ds180_7Series_Overview Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 250
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCZU47DR-2FSVE1156E XCZU47DR-2FSVE1156E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU43DR-2FSVE1156I XCZU43DR-2FSVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU47DR-2FFVE1156I XCZU47DR-2FFVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU43DR-2FFVE1156I XCZU43DR-2FFVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU47DR-2FSVE1156I XCZU47DR-2FSVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU47DR-2FFVG1517E XCZU47DR-2FFVG1517E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU47DR-2FSVG1517E XCZU47DR-2FSVG1517E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU43DR-2FSVG1517E XCZU43DR-2FSVG1517E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU43DR-2FFVG1517E XCZU43DR-2FFVG1517E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU48DR-2FFVE1156E XCZU48DR-2FFVE1156E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU48DR-2FSVE1156E XCZU48DR-2FSVE1156E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU47DR-2FFVG1517I XCZU47DR-2FFVG1517I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU43DR-2FFVG1517I XCZU43DR-2FFVG1517I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU43DR-2FSVG1517I XCZU43DR-2FSVG1517I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU47DR-2FSVG1517I XCZU47DR-2FSVG1517I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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EK-VPK120-G-ED EK-VPK120-G-ED AMD vpk120-product-brief.pdf Description: KIT VERSAL VPK120 VP1202 ACAP ED
Packaging: Box
For Use With/Related Products: XCVP1202
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Versal Premium Adaptive SoC VPK120 Encryption Disabled PCIe Card
Produkt ist nicht verfügbar
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EK-U1-ZCU111-G-ED AMD zcu111-product-brief.pdf Description: ZYNQUS+ XCZU28DR EVAL BRD ED
Packaging: Box
For Use With/Related Products: XCZU28DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU111 Encryption Disabled
Produkt ist nicht verfügbar
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VCK5000-AI-INF-P-G-ED AMD amd-xilinx-vck5000-product-brief.pdf Description: EVAL VERSAL AI ENGINE CARD ED
Packaging: Bulk
For Use With/Related Products: XCVC1902
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: VCK5000 Versal AI Core Adaptive SoC Encryption Disabled PCIe Card
Produkt ist nicht verfügbar
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XC7A15T-2CSG325I XC7A15T-2CSG325I AMD ds180_7Series_Overview Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 150
DigiKey Programmable: Not Verified
auf Bestellung 76 Stücke:
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XCZU2CG-L1UBVA530I XCZU2CG-L1UBVA530I AMD ds890-ultrascale-overview Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XAZU1EG-L1SBVA484I XAZU1EG-L1SBVA484I AMD ds894-zynq-ultrascale-plus-overview Description: ZUP MPSOC A53 FPGA Q LP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCZU2CG-L2UBVA530E XCZU2CG-L2UBVA530E AMD ds890-ultrascale-overview Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XAZU1EG-L1SFVA625I XAZU1EG-L1SFVA625I AMD ds894-zynq-ultrascale-plus-overview Description: ZUP MPSOC A53 FPGA Q LP 625BGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XAZU1EG-L1SFVC784I XAZU1EG-L1SFVC784I AMD ds894-zynq-ultrascale-plus-overview Description: ZUP MPSOC A53 FPGA Q LP 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU3CG-L1UBVA530I XCZU3CG-L1UBVA530I AMD ds890-ultrascale-overview Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU3CG-L2UBVA530E XCZU3CG-L2UBVA530E AMD ds890-ultrascale-overview Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XAZU5EV-L1SFVC784I XAZU5EV-L1SFVC784I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC FPGA SOC ZUEV LP Q100 784SBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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LMS-EMBD-HET AMD embd-het Description: ONDEMAND EMBEDDED HETEROGENOUS D
Packaging: Bulk
Produkt ist nicht verfügbar
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XCKU060-2FFVA1156I XCKU060-2FFVA1156I AMD ds892-kintex-ultrascale-data-sheet Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 725550
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 41460
Total RAM Bits: 38912000
Number of I/O: 520
DigiKey Programmable: Not Verified
auf Bestellung 49 Stücke:
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1+8968.82 EUR
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XCAU15P-L1UBVA368I XCAU15P-L1UBVA368I AMD ug575-ultrascale-pkg-pinout Description: IC FPGA ARTIXUP LP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 128
DigiKey Programmable: Not Verified
auf Bestellung 6 Stücke:
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1+400.82 EUR
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XCAU25P-1FFVB676I XCAU25P-1FFVB676I AMD root Description: IC FPGA ARTIXUP 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 4928307
Number of I/O: 280
DigiKey Programmable: Not Verified
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1+799.46 EUR
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XC7A100T-1CSG324CES9937 XC7A100T-1CSG324CES9937 AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 101440
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 7925
Total RAM Bits: 4976640
Number of I/O: 210
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU10P-1UBVA368I XCAU10P-1UBVA368I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 128
DigiKey Programmable: Not Verified
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1+260.64 EUR
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XCAU10P-2UBVA368I XCAU10P-2UBVA368I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU10P-1FFVB676I XCAU10P-1FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 228
DigiKey Programmable: Not Verified
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1+280.35 EUR
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XCAU10P-1UBVA368E XCAU10P-1UBVA368E AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU10P-1FFVB676E XCAU10P-1FFVB676E AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU10P-L1UBVA368I XCAU10P-L1UBVA368I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP LP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCAU10P-2UBVA368E XCAU10P-2UBVA368E AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XAZU1EG-1SBVA484Q ds894-zynq-ultrascale-plus-overview
XAZU1EG-1SBVA484Q
Hersteller: AMD
Description: IC ZUP MPSOC A53 FPGA Q 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
auf Bestellung 27 Stücke:
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Anzahl Preis
1+1023.55 EUR
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XCZU5EG-2SFVC784I jDqbmrrvy_u9hmwDv1iWBQ
XCZU5EG-2SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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Anzahl Preis
1+4238.84 EUR
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XC3S1000-4FG320C ds099
XC3S1000-4FG320C
Hersteller: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EFR-DI-25GEMAC-PROJ 10g_25g-HighSpeedEthernet_Jun6_2018.pdf
Hersteller: AMD
Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-25G-TSN-802-1-CM-PROJ 10g_25g-HighSpeedEthernet_Jun6_2018.pdf
Hersteller: AMD
Description: 10G/25G TSN 802.1CM WIRELESS PRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Produkt ist nicht verfügbar
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EFR-DI-25GEMAC-SITE 10g_25g-HighSpeedEthernet_Jun6_2018.pdf
Hersteller: AMD
Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-25G-TSN-802-1-CM-SITE 10g_25g-HighSpeedEthernet_Jun6_2018.pdf
Hersteller: AMD
Description: 10G/25G TSN 802.1CM WIRELESS SIT
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Produkt ist nicht verfügbar
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EFR-DI-25G-RS-FEC-PROJ
Hersteller: AMD
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-25GBASE-KR-PROJ 10g_25g-HighSpeedEthernet_Jun6_2018.pdf
Hersteller: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-25G-RS-FEC-SITE
Hersteller: AMD
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-25GBASE-KR-SITE 10g_25g-HighSpeedEthernet_Jun6_2018.pdf
Hersteller: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-25GBASE-KR-WW 10g_25g-HighSpeedEthernet_Jun6_2018.pdf
Hersteller: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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XC7A35T-2CSG324I ds180_7Series_Overview
XC7A35T-2CSG324I
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 210
DigiKey Programmable: Not Verified
auf Bestellung 232 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+119.56 EUR
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XC7A75T-2CSG324I ds181_Artix_7_Data_Sheet
XC7A75T-2CSG324I
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 210
DigiKey Programmable: Not Verified
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+250.71 EUR
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XC7A75T-L1CSG324I ds180_7Series_Overview
XC7A75T-L1CSG324I
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 210
DigiKey Programmable: Not Verified
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+240.45 EUR
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XCAU15P-2FFVB676I ds890-ultrascale-overview
XCAU15P-2FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
DigiKey Programmable: Not Verified
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+490.64 EUR
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XCZU5EG-L2SFVC784E jDqbmrrvy_u9hmwDv1iWBQ
XCZU5EG-L2SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+4270.22 EUR
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XCZU2CG-1UBVA530E ds890-ultrascale-overview
XCZU2CG-1UBVA530E
Hersteller: AMD
Description: IC ZUP MPSOC A53 FPGA 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AM29LV160DT-70EC
Hersteller: AMD
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7
Packaging: Tube
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 1032 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
96+4.11 EUR
192+4.08 EUR
384+4.03 EUR
960+3.95 EUR
Mindestbestellmenge: 96
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AM29LV160DT-70EC/T
Hersteller: AMD
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 565 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
100+4.11 EUR
200+4.08 EUR
300+4.05 EUR
500+4.03 EUR
Mindestbestellmenge: 100
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XC7A15T-2FGG484I ds180_7Series_Overview
XC7A15T-2FGG484I
Hersteller: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 250
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCZU47DR-2FSVE1156E ds889-zynq-usp-rfsoc-overview
XCZU47DR-2FSVE1156E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU43DR-2FSVE1156I ds889-zynq-usp-rfsoc-overview
XCZU43DR-2FSVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU47DR-2FFVE1156I ds889-zynq-usp-rfsoc-overview
XCZU47DR-2FFVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-2FFVE1156I ds889-zynq-usp-rfsoc-overview
XCZU43DR-2FFVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU47DR-2FSVE1156I ds889-zynq-usp-rfsoc-overview
XCZU47DR-2FSVE1156I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU47DR-2FFVG1517E ds889-zynq-usp-rfsoc-overview
XCZU47DR-2FFVG1517E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU47DR-2FSVG1517E ds889-zynq-usp-rfsoc-overview
XCZU47DR-2FSVG1517E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-2FSVG1517E ds889-zynq-usp-rfsoc-overview
XCZU43DR-2FSVG1517E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU43DR-2FFVG1517E ds889-zynq-usp-rfsoc-overview
XCZU43DR-2FFVG1517E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU48DR-2FFVE1156E ds889-zynq-usp-rfsoc-overview
XCZU48DR-2FFVE1156E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU48DR-2FSVE1156E ds889-zynq-usp-rfsoc-overview
XCZU48DR-2FSVE1156E
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU47DR-2FFVG1517I ds889-zynq-usp-rfsoc-overview
XCZU47DR-2FFVG1517I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU43DR-2FFVG1517I ds889-zynq-usp-rfsoc-overview
XCZU43DR-2FFVG1517I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU43DR-2FSVG1517I ds889-zynq-usp-rfsoc-overview
XCZU43DR-2FSVG1517I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU47DR-2FSVG1517I ds889-zynq-usp-rfsoc-overview
XCZU47DR-2FSVG1517I
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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EK-VPK120-G-ED vpk120-product-brief.pdf
EK-VPK120-G-ED
Hersteller: AMD
Description: KIT VERSAL VPK120 VP1202 ACAP ED
Packaging: Box
For Use With/Related Products: XCVP1202
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Versal Premium Adaptive SoC VPK120 Encryption Disabled PCIe Card
Produkt ist nicht verfügbar
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EK-U1-ZCU111-G-ED zcu111-product-brief.pdf
Hersteller: AMD
Description: ZYNQUS+ XCZU28DR EVAL BRD ED
Packaging: Box
For Use With/Related Products: XCZU28DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU111 Encryption Disabled
Produkt ist nicht verfügbar
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VCK5000-AI-INF-P-G-ED amd-xilinx-vck5000-product-brief.pdf
Hersteller: AMD
Description: EVAL VERSAL AI ENGINE CARD ED
Packaging: Bulk
For Use With/Related Products: XCVC1902
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: VCK5000 Versal AI Core Adaptive SoC Encryption Disabled PCIe Card
Produkt ist nicht verfügbar
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XC7A15T-2CSG325I ds180_7Series_Overview
XC7A15T-2CSG325I
Hersteller: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 150
DigiKey Programmable: Not Verified
auf Bestellung 76 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+116.99 EUR
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XCZU2CG-L1UBVA530I ds890-ultrascale-overview
XCZU2CG-L1UBVA530I
Hersteller: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XAZU1EG-L1SBVA484I ds894-zynq-ultrascale-plus-overview
XAZU1EG-L1SBVA484I
Hersteller: AMD
Description: ZUP MPSOC A53 FPGA Q LP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCZU2CG-L2UBVA530E ds890-ultrascale-overview
XCZU2CG-L2UBVA530E
Hersteller: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XAZU1EG-L1SFVA625I ds894-zynq-ultrascale-plus-overview
XAZU1EG-L1SFVA625I
Hersteller: AMD
Description: ZUP MPSOC A53 FPGA Q LP 625BGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XAZU1EG-L1SFVC784I ds894-zynq-ultrascale-plus-overview
XAZU1EG-L1SFVC784I
Hersteller: AMD
Description: ZUP MPSOC A53 FPGA Q LP 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCZU3CG-L1UBVA530I ds890-ultrascale-overview
XCZU3CG-L1UBVA530I
Hersteller: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCZU3CG-L2UBVA530E ds890-ultrascale-overview
XCZU3CG-L2UBVA530E
Hersteller: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XAZU5EV-L1SFVC784I dfRkDKgzEvo5CsUiQJdEkg
XAZU5EV-L1SFVC784I
Hersteller: AMD
Description: IC FPGA SOC ZUEV LP Q100 784SBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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LMS-EMBD-HET embd-het
Hersteller: AMD
Description: ONDEMAND EMBEDDED HETEROGENOUS D
Packaging: Bulk
Produkt ist nicht verfügbar
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XCKU060-2FFVA1156I ds892-kintex-ultrascale-data-sheet
XCKU060-2FFVA1156I
Hersteller: AMD
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 725550
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 41460
Total RAM Bits: 38912000
Number of I/O: 520
DigiKey Programmable: Not Verified
auf Bestellung 49 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+8968.82 EUR
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XCAU15P-L1UBVA368I ug575-ultrascale-pkg-pinout
XCAU15P-L1UBVA368I
Hersteller: AMD
Description: IC FPGA ARTIXUP LP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 128
DigiKey Programmable: Not Verified
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+400.82 EUR
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XCAU25P-1FFVB676I root
XCAU25P-1FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIXUP 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 4928307
Number of I/O: 280
DigiKey Programmable: Not Verified
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+799.46 EUR
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XC7A100T-1CSG324CES9937 ds181_Artix_7_Data_Sheet
XC7A100T-1CSG324CES9937
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 101440
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 7925
Total RAM Bits: 4976640
Number of I/O: 210
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU10P-1UBVA368I ds890-ultrascale-overview
XCAU10P-1UBVA368I
Hersteller: AMD
Description: IC FPGA ARTIXUP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 128
DigiKey Programmable: Not Verified
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+260.64 EUR
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XCAU10P-2UBVA368I ds890-ultrascale-overview
XCAU10P-2UBVA368I
Hersteller: AMD
Description: IC FPGA ARTIXUP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU10P-1FFVB676I ds890-ultrascale-overview
XCAU10P-1FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 228
DigiKey Programmable: Not Verified
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+280.35 EUR
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XCAU10P-1UBVA368E ds890-ultrascale-overview
XCAU10P-1UBVA368E
Hersteller: AMD
Description: IC FPGA ARTIXUP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU10P-1FFVB676E ds890-ultrascale-overview
XCAU10P-1FFVB676E
Hersteller: AMD
Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU10P-L1UBVA368I ds890-ultrascale-overview
XCAU10P-L1UBVA368I
Hersteller: AMD
Description: IC FPGA ARTIXUP LP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCAU10P-2UBVA368E ds890-ultrascale-overview
XCAU10P-2UBVA368E
Hersteller: AMD
Description: IC FPGA ARTIXUP 368BGA
Packaging: Tray
Package / Case: 368-WFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 368-FCBGA (10.5x10.5)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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