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XCVE1752-1MSEVSVA2197 XCVE1752-1MSEVSVA2197 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVE1752-1LSENSVG1369 XCVE1752-1LSENSVG1369 AMD ds950-versal-overview Description: IC VERSAL AI-EDGE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVE1752-2MSENSVG1369 XCVE1752-2MSENSVG1369 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVE1752-1MSINSVG1369 XCVE1752-1MSINSVG1369 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVE1752-1LSEVSVA2197 XCVE1752-1LSEVSVA2197 AMD ds950-versal-overview Description: IC VERSAL AI-EDGE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVE1752-1MSIVSVA2197 XCVE1752-1MSIVSVA2197 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVE1752-2MSEVSVA2197 XCVE1752-2MSEVSVA2197 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVE1752-1LSINSVG1369 XCVE1752-1LSINSVG1369 AMD ds950-versal-overview Description: IC VERSAL AI-EDGE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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CK-U1-ZCU1285-G CK-U1-ZCU1285-G AMD ug1348-zcu1285-char-bd.pdf Description: KIT ZUP RFSOC ZCU1285
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU39DR
Platform: Zynq UltraScale+ RFSoC ZCU1285
Produkt ist nicht verfügbar
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XCZU7EV-2FBVB900I XCZU7EV-2FBVB900I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
auf Bestellung 3 Stücke:
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1+7007.77 EUR
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XCZU3EG-2SFVC784I XCZU3EG-2SFVC784I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 12 Stücke:
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1+1366.01 EUR
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XCZU4EV-1SFVC784I XCZU4EV-1SFVC784I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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1+2416.02 EUR
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XCZU5EV-2SFVC784I XCZU5EV-2SFVC784I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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1+4343.43 EUR
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XCZU4EG-2SFVE784I XCZU4EG-2SFVE784I AMD Description: FPGA MPSOC QUAD A53 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCZU4EV-2SFVC784I XCZU4EV-2SFVC784I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU5EG-1SFVC784I XCZU5EG-1SFVC784I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+3134.56 EUR
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XCZU5EV-1SFVC784I XCZU5EV-1SFVC784I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EV-1FBVB900E XCZU7EV-1FBVB900E AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU5EG-2SFVE784I XCZU5EG-2SFVE784I AMD Description: FPGA MPSOC QUAD A53 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCZU5EV-2SFVE784I XCZU5EV-2SFVE784I AMD Description: FPGA MPSOC QUADA53 H264/5 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCZU7EV-1FBVB900I XCZU7EV-1FBVB900I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU9EG-1FFVC900I XCZU9EG-1FFVC900I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU9EG-2FFVC900I XCZU9EG-2FFVC900I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+7505.85 EUR
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XC3S400-4PQG208C XC3S400-4PQG208C AMD ds099 Description: IC FPGA 141 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 141
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S1200E-4FGG320I XC3S1200E-4FGG320I AMD ds312 Description: IC FPGA 250 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1200000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 19512
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 2168
Total RAM Bits: 516096
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 304 Stücke:
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1+278.64 EUR
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XC3S2000-4FGG456C XC3S2000-4FGG456C AMD ds099 Description: IC FPGA 333 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S2000-4FGG676C XC3S2000-4FGG676C AMD ds099 Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S2000-4FG456C XC3S2000-4FG456C AMD ds099 Description: IC FPGA 333 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S2000-4FGG676I XC3S2000-4FGG676I AMD ds099 Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S2000-4FG456I XC3S2000-4FG456I AMD ds099 Description: IC FPGA 333 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S2000-4FG676C XC3S2000-4FG676C AMD ds099 Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S2000-4FG676I XC3S2000-4FG676I AMD ds099 Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S2000-4FG900I XC3S2000-4FG900I AMD ds099 Description: IC FPGA 565 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 565
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S700AN-5FGG484C XC3S700AN-5FGG484C AMD ds557 Description: IC FPGA 372 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Number of Gates: 700000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 13248
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1472
Total RAM Bits: 368640
Number of I/O: 372
DigiKey Programmable: Not Verified
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XC3S400A-4FT256C XC3S400A-4FT256C AMD ds529 Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 195
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FT256C XC3S400-4FT256C AMD ds099 Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 173
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400A-5FGG320C XC3S400A-5FGG320C AMD ds529 Description: IC FPGA 251 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 251
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400A-4FGG400I XC3S400A-4FGG400I AMD ds529 Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400AN-4FT256I XC3S400AN-4FT256I AMD ds557 Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 195
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FT256I XC3S400-4FT256I AMD ds099 Description: IC FPGA 173 I/O 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 173
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-5FT256C XC3S400-5FT256C AMD ds099 Description: IC FPGA 173 I/O 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 173
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400A-4FG320I XC3S400A-4FG320I AMD ds529 Description: IC FPGA 251 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 251
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400A-5FGG400C XC3S400A-5FGG400C AMD ds529 Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400A-4FG400C XC3S400A-4FG400C AMD ds529 Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FGG320C XC3S400-4FGG320C AMD ds099 Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400AN-4FGG400I XC3S400AN-4FGG400I AMD ds557 Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400AN-5FGG400C XC3S400AN-5FGG400C AMD ds557 Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400AN-4FG400C XC3S400AN-4FG400C AMD ds557 Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400A-4FG400I XC3S400A-4FG400I AMD ds529 Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-5FGG320C XC3S400-5FGG320C AMD ds099 Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FGG320I XC3S400-4FGG320I AMD ds099 Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FG320C XC3S400-4FG320C AMD ds099 Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400AN-4FG400I XC3S400AN-4FG400I AMD ds557 Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FG320I XC3S400-4FG320I AMD ds099 Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-5FG320C XC3S400-5FG320C AMD ds099 Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-5FGG456C XC3S400-5FGG456C AMD ds099 Description: IC FPGA 264 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FGG456I XC3S400-4FGG456I AMD ds099 Description: IC FPGA 264 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FG456C XC3S400-4FG456C AMD ds099 Description: IC FPGA 264 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FG456I XC3S400-4FG456I AMD ds099 Description: IC FPGA 264 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-5FG456C XC3S400-5FG456C AMD ds099 Description: IC FPGA 264 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVE1752-1MSEVSVA2197 ds950-versal-overview
XCVE1752-1MSEVSVA2197
Hersteller: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVE1752-1LSENSVG1369 ds950-versal-overview
XCVE1752-1LSENSVG1369
Hersteller: AMD
Description: IC VERSAL AI-EDGE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVE1752-2MSENSVG1369 ds950-versal-overview
XCVE1752-2MSENSVG1369
Hersteller: AMD
Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVE1752-1MSINSVG1369 ds950-versal-overview
XCVE1752-1MSINSVG1369
Hersteller: AMD
Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVE1752-1LSEVSVA2197 ds950-versal-overview
XCVE1752-1LSEVSVA2197
Hersteller: AMD
Description: IC VERSAL AI-EDGE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVE1752-1MSIVSVA2197 ds950-versal-overview
XCVE1752-1MSIVSVA2197
Hersteller: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVE1752-2MSEVSVA2197 ds950-versal-overview
XCVE1752-2MSEVSVA2197
Hersteller: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVE1752-1LSINSVG1369 ds950-versal-overview
XCVE1752-1LSINSVG1369
Hersteller: AMD
Description: IC VERSAL AI-EDGE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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CK-U1-ZCU1285-G ug1348-zcu1285-char-bd.pdf
CK-U1-ZCU1285-G
Hersteller: AMD
Description: KIT ZUP RFSOC ZCU1285
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU39DR
Platform: Zynq UltraScale+ RFSoC ZCU1285
Produkt ist nicht verfügbar
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XCZU7EV-2FBVB900I dfRkDKgzEvo5CsUiQJdEkg
XCZU7EV-2FBVB900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+7007.77 EUR
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XCZU3EG-2SFVC784I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU3EG-2SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1366.01 EUR
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XCZU4EV-1SFVC784I dfRkDKgzEvo5CsUiQJdEkg
XCZU4EV-1SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+2416.02 EUR
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XCZU5EV-2SFVC784I dfRkDKgzEvo5CsUiQJdEkg
XCZU5EV-2SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+4343.43 EUR
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XCZU4EG-2SFVE784I
XCZU4EG-2SFVE784I
Hersteller: AMD
Description: FPGA MPSOC QUAD A53 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU4EV-2SFVC784I dfRkDKgzEvo5CsUiQJdEkg
XCZU4EV-2SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU5EG-1SFVC784I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU5EG-1SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+3134.56 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU5EV-1SFVC784I dfRkDKgzEvo5CsUiQJdEkg
XCZU5EV-1SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7EV-1FBVB900E dfRkDKgzEvo5CsUiQJdEkg
XCZU7EV-1FBVB900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU5EG-2SFVE784I
XCZU5EG-2SFVE784I
Hersteller: AMD
Description: FPGA MPSOC QUAD A53 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU5EV-2SFVE784I
XCZU5EV-2SFVE784I
Hersteller: AMD
Description: FPGA MPSOC QUADA53 H264/5 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7EV-1FBVB900I dfRkDKgzEvo5CsUiQJdEkg
XCZU7EV-1FBVB900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9EG-1FFVC900I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU9EG-1FFVC900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9EG-2FFVC900I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU9EG-2FFVC900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+7505.85 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4PQG208C ds099
XC3S400-4PQG208C
Hersteller: AMD
Description: IC FPGA 141 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 141
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S1200E-4FGG320I ds312
XC3S1200E-4FGG320I
Hersteller: AMD
Description: IC FPGA 250 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1200000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 19512
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 2168
Total RAM Bits: 516096
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 304 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+278.64 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC3S2000-4FGG456C ds099
XC3S2000-4FGG456C
Hersteller: AMD
Description: IC FPGA 333 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S2000-4FGG676C ds099
XC3S2000-4FGG676C
Hersteller: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S2000-4FG456C ds099
XC3S2000-4FG456C
Hersteller: AMD
Description: IC FPGA 333 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S2000-4FGG676I ds099
XC3S2000-4FGG676I
Hersteller: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S2000-4FG456I ds099
XC3S2000-4FG456I
Hersteller: AMD
Description: IC FPGA 333 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S2000-4FG676C ds099
XC3S2000-4FG676C
Hersteller: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S2000-4FG676I ds099
XC3S2000-4FG676I
Hersteller: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S2000-4FG900I ds099
XC3S2000-4FG900I
Hersteller: AMD
Description: IC FPGA 565 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 565
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S700AN-5FGG484C ds557
XC3S700AN-5FGG484C
Hersteller: AMD
Description: IC FPGA 372 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Number of Gates: 700000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 13248
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1472
Total RAM Bits: 368640
Number of I/O: 372
DigiKey Programmable: Not Verified
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+245.04 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400A-4FT256C ds529
XC3S400A-4FT256C
Hersteller: AMD
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 195
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FT256C ds099
XC3S400-4FT256C
Hersteller: AMD
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 173
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S400A-5FGG320C ds529
XC3S400A-5FGG320C
Hersteller: AMD
Description: IC FPGA 251 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 251
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S400A-4FGG400I ds529
XC3S400A-4FGG400I
Hersteller: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400AN-4FT256I ds557
XC3S400AN-4FT256I
Hersteller: AMD
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 195
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FT256I ds099
XC3S400-4FT256I
Hersteller: AMD
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 173
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-5FT256C ds099
XC3S400-5FT256C
Hersteller: AMD
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 173
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400A-4FG320I ds529
XC3S400A-4FG320I
Hersteller: AMD
Description: IC FPGA 251 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 251
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400A-5FGG400C ds529
XC3S400A-5FGG400C
Hersteller: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400A-4FG400C ds529
XC3S400A-4FG400C
Hersteller: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FGG320C ds099
XC3S400-4FGG320C
Hersteller: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400AN-4FGG400I ds557
XC3S400AN-4FGG400I
Hersteller: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400AN-5FGG400C ds557
XC3S400AN-5FGG400C
Hersteller: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400AN-4FG400C ds557
XC3S400AN-4FG400C
Hersteller: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400A-4FG400I ds529
XC3S400A-4FG400I
Hersteller: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-5FGG320C ds099
XC3S400-5FGG320C
Hersteller: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FGG320I ds099
XC3S400-4FGG320I
Hersteller: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FG320C ds099
XC3S400-4FG320C
Hersteller: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400AN-4FG400I ds557
XC3S400AN-4FG400I
Hersteller: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FG320I ds099
XC3S400-4FG320I
Hersteller: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-5FG320C ds099
XC3S400-5FG320C
Hersteller: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-5FGG456C ds099
XC3S400-5FGG456C
Hersteller: AMD
Description: IC FPGA 264 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FGG456I ds099
XC3S400-4FGG456I
Hersteller: AMD
Description: IC FPGA 264 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FG456C ds099
XC3S400-4FG456C
Hersteller: AMD
Description: IC FPGA 264 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4FG456I ds099
XC3S400-4FG456I
Hersteller: AMD
Description: IC FPGA 264 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-5FG456C ds099
XC3S400-5FG456C
Hersteller: AMD
Description: IC FPGA 264 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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