| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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|---|---|---|---|---|---|---|---|
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XC3S250E-5TQG144C | AMD |
 Description: IC FPGA 108 I/O 144TQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 108 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC3S250E-4VQ100I | AMD |
Description: IC FPGA 66 I/O 100VQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 100-VQFP (14x14) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 66 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC3S250E-4TQ144C | AMD |
Description: IC FPGA 108 I/O 144TQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 108 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC3S250E-4FTG256I | AMD |
Description: IC FPGA 172 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 172 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC3S250E-4TQ144I | AMD |
Description: IC FPGA 108 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 108 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC3S250E-4CP132I | AMD |
Description: IC FPGA 92 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 92 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC3S250E-5FTG256C | AMD |
Description: IC FPGA 172 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 172 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC3S250E-4FT256C | AMD |
Description: IC FPGA 172 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 172 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC3S250E-4FT256I | AMD |
Description: IC FPGA 172 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 172 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC3S250E-4PQG208I | AMD |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 158 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC3S250E-5PQG208C | AMD |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 158 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC3S250E-4PQ208I | AMD |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 158 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC3S250E-5PQ208C | AMD |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 158 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU65DR-1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU67DR-1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU65DR-L1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU67DR-L1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU65DR-2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU43DR-L1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU47DR-L1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU48DR-1FSVG1517E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU47DR-1FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU49DR-1FSVF1760E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1760BGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU67DR-2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU48DR-1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU43DR-L1FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU47DR-L1FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU65DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU46DR-1FSVH1760I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1760BGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU67DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU48DR-1FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7A200T-L1FB676I | AMD |
Description: IC FPGA 400 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 400 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7A200T-2FB676I | AMD |
Description: IC FPGA 400 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 400 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7A200T-L2SBG484E | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 285 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7A200T-L1FB484I | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tube Package / Case: 484-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (23x23) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 285 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7A200T-2FB484I | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (23x23) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 285 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7A200T-1SB484I | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 285 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7A200T-L2FFG1156E | AMD |
Description: IC FPGA 500 I/O 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 500 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7A200T-1FF1156I | AMD |
Description: IC FPGA 500 I/O 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 500 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7A200T-2SB484I | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 285 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7A200T-2FF1156I | AMD |
Description: IC FPGA 500 I/O 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 500 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
 |
XCZU65DR-1FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU67DR-1FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU65DR-L1FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
 |
XCV150-4BG256C | AMD |
Description: IC FPGA 180 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 164674 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 3888 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 864 Total RAM Bits: 49152 Number of I/O: 180 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCV150-5BG256I | AMD |
Description: IC FPGA 180 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 164674 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 3888 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 864 Total RAM Bits: 49152 Number of I/O: 180 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCV150-6BG256C | AMD |
Description: IC FPGA 180 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 164674 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 3888 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 864 Total RAM Bits: 49152 Number of I/O: 180 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU4EV-2FBVB900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7S100-2FGGA676C | AMD |
Description: IC FPGA 400 I/O 676FPBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 102400 Supplier Device Package: 676-FPBGA (27x27) Number of LABs/CLBs: 8000 Total RAM Bits: 4423680 Number of I/O: 400 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7A75T-2FGG676I | AMD |
Description: IC FPGA 300 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 75520 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 5900 Total RAM Bits: 3870720 Number of I/O: 300 DigiKey Programmable: Not Verified |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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100-CG2031 | AMD | Processors - Application Specialised e64-Southbridge-SB820M- |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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100-438038 | AMD |
Video Modules E6760-1-GB-RoHs-AES-PCIe-Board |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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100-438020 | AMD |
Video Modules E6760-1-GB-RoHs-AES-PCIe-Board |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
 |
100-438019 | AMD |
Video Modules E6760-1-GB-RoHs-AES-PCIe-Board |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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SMG210UOAX3DVE | AMD | Microprocessors - MPU e64-Sempron-210U+-socket-BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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100-CG2024 | AMD |
Chipsets e64-Enterprise-I/O-Bridge-SR56 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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100-CG2261 | AMD | Video Modules E6460-512-MB-RoHS-AES-ASIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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100-K00172 | AMD |
Processors - Application Specialised E6760-1-GB-RoHS-AES-MXM-3.0-Ty |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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100-CG1291 | AMD | Processors - Application Specialised e64-Mobile-Southbridge-SB600 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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100-K00159 | AMD | Processors - Application Specialised |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| XC3S250E-5TQG144C |
|
Hersteller: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC3S250E-4VQ100I |
|
Hersteller: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC3S250E-4TQ144C |
|
Hersteller: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC FPGA 108 I/O 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC3S250E-4FTG256I |
|
Hersteller: AMD
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC3S250E-4TQ144I |
|
Hersteller: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC3S250E-4CP132I |
|
Hersteller: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC3S250E-5FTG256C |
|
Hersteller: AMD
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC3S250E-4FT256C |
|
Hersteller: AMD
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC3S250E-4FT256I |
|
Hersteller: AMD
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC3S250E-4PQG208I |
|
Hersteller: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC3S250E-5PQG208C |
|
Hersteller: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC3S250E-4PQ208I |
|
Hersteller: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC3S250E-5PQ208C |
|
Hersteller: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU65DR-1FSVE1156I |
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU67DR-1FSVE1156I |
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU65DR-L1FSVE1156I |
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU67DR-L1FSVE1156I |
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU65DR-2FSVE1156I |
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU43DR-L1FSVE1156I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU47DR-L1FSVE1156I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU48DR-1FSVG1517E |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU47DR-1FSVG1517I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU49DR-1FSVF1760E |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU67DR-2FSVE1156I |
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU48DR-1FSVE1156I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU43DR-L1FSVG1517I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU47DR-L1FSVG1517I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU65DR-L2FSVE1156I |
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU46DR-1FSVH1760I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU67DR-L2FSVE1156I |
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU48DR-1FSVG1517I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC7A200T-L1FB676I |
|
Hersteller: AMD
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 400
DigiKey Programmable: Not Verified
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC7A200T-2FB676I |
|
Hersteller: AMD
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 400
DigiKey Programmable: Not Verified
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC7A200T-L2SBG484E |
|
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC7A200T-L1FB484I |
|
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tube
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tube
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC7A200T-2FB484I |
|
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC7A200T-1SB484I |
|
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC7A200T-L2FFG1156E |
|
Hersteller: AMD
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC7A200T-1FF1156I |
|
Hersteller: AMD
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC7A200T-2SB484I |
|
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC7A200T-2FF1156I |
|
Hersteller: AMD
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU65DR-1FFVE1156I |
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU67DR-1FFVE1156I |
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU65DR-L1FFVE1156I |
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCV150-4BG256C |
|
Hersteller: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCV150-5BG256I |
|
Hersteller: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCV150-6BG256C |
|
Hersteller: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU4EV-2FBVB900I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC7S100-2FGGA676C |
|
Hersteller: AMD
Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC7A75T-2FGG676I |
|
Hersteller: AMD
Description: IC FPGA 300 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 300
DigiKey Programmable: Not Verified
Description: IC FPGA 300 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 300
DigiKey Programmable: Not Verified
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 315.99 EUR |
| 100-CG2031 |
Hersteller: AMD
Processors - Application Specialised e64-Southbridge-SB820M-
Processors - Application Specialised e64-Southbridge-SB820M-
Produkt ist nicht verfügbar
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| 100-438038 |
|
Hersteller: AMD
Video Modules E6760-1-GB-RoHs-AES-PCIe-Board
Video Modules E6760-1-GB-RoHs-AES-PCIe-Board
Produkt ist nicht verfügbar
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| 100-438020 |
|
Hersteller: AMD
Video Modules E6760-1-GB-RoHs-AES-PCIe-Board
Video Modules E6760-1-GB-RoHs-AES-PCIe-Board
Produkt ist nicht verfügbar
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| 100-438019 |
|
Hersteller: AMD
Video Modules E6760-1-GB-RoHs-AES-PCIe-Board
Video Modules E6760-1-GB-RoHs-AES-PCIe-Board
Produkt ist nicht verfügbar
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| SMG210UOAX3DVE |
Hersteller: AMD
Microprocessors - MPU e64-Sempron-210U+-socket-BGA
Microprocessors - MPU e64-Sempron-210U+-socket-BGA
Produkt ist nicht verfügbar
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| 100-CG2024 |
|
Hersteller: AMD
Chipsets e64-Enterprise-I/O-Bridge-SR56
Chipsets e64-Enterprise-I/O-Bridge-SR56
Produkt ist nicht verfügbar
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| 100-CG2261 |
Hersteller: AMD
Video Modules E6460-512-MB-RoHS-AES-ASIC
Video Modules E6460-512-MB-RoHS-AES-ASIC
Produkt ist nicht verfügbar
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| 100-K00172 |
|
Hersteller: AMD
Processors - Application Specialised E6760-1-GB-RoHS-AES-MXM-3.0-Ty
Processors - Application Specialised E6760-1-GB-RoHS-AES-MXM-3.0-Ty
Produkt ist nicht verfügbar
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| 100-CG1291 |
Hersteller: AMD
Processors - Application Specialised e64-Mobile-Southbridge-SB600
Processors - Application Specialised e64-Mobile-Southbridge-SB600
Produkt ist nicht verfügbar
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| 100-K00159 |
Hersteller: AMD
Processors - Application Specialised
Processors - Application Specialised
Produkt ist nicht verfügbar
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