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XC3S50-4CP132I XC3S50-4CP132I AMD ds099.pdf?t.download=true&u=ovmfp3 Description: FPGA, 192 CLBS, 50000 GATES
Packaging: Bulk
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S50-4CPG132C0974 XC3S50-4CPG132C0974 AMD ds099.pdf?t.download=true&u=ovmfp3 Description: IC FPGA 89 I/O 132CSBGA
Packaging: Bulk
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S50-5CPG132C0974 XC3S50-5CPG132C0974 AMD ds099.pdf?t.download=true&u=ovmfp3 Description: IC FPGA 89 I/O 132CSBGA
Packaging: Bulk
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S50-4VQG100I XC3S50-4VQG100I AMD ds099 Description: IC FPGA 63 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 12 Stücke:
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1+49.32 EUR
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XC3S500E-4PQG208C XC3S500E-4PQG208C AMD ds312 Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
auf Bestellung 970 Stücke:
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1+572.63 EUR
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XC3S500E-4PQG208I XC3S500E-4PQG208I AMD ds312 Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
auf Bestellung 4594 Stücke:
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1+659.16 EUR
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XC3S500E-4PQ208I XC3S500E-4PQ208I AMD ds312 Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
auf Bestellung 416 Stücke:
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1+797.17 EUR
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XC3S500E-4PQ208C XC3S500E-4PQ208C AMD ds312 Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95288XL-10CS280I AMD ds055 Description: IC CPLD 288MC 10NS 280CSBGA
Packaging: Bulk
Package / Case: 280-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 280-CSBGA (16x16)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95288XL-10BG256C AMD GTHnyVMVaIJYQdBwKSx6iw Description: IC CPLD 288MC 10NS 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-PBGA (27x27)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95288XL-10FG256C XC95288XL-10FG256C AMD GTHnyVMVaIJYQdBwKSx6iw Description: IC CPLD 288MC 10NS 256FBGA
Packaging: Bulk
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95288XL-7BG256C XC95288XL-7BG256C AMD ds055 Description: IC CPLD 288MC 7.5NS 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-PBGA (27x27)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95288XL-7BG256I XC95288XL-7BG256I AMD ds055 Description: IC CPLD 288MC 7.5NS 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-PBGA (27x27)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SK-KD240-G SK-KD240-G AMD kria-bist Description: KRIA KD240 DRIVES STARTER KIT
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Kria KD240 Drives Starter
Utilized IC / Part: SM-K24-XCL2G
auf Bestellung 431 Stücke:
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1+703.84 EUR
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XC3S500E-4VQG100C XC3S500E-4VQG100C AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 5 Stücke:
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1+130.29 EUR
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XC3S500E-4FGG320I XC3S500E-4FGG320I AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 232 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
auf Bestellung 3 Stücke:
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1+226.88 EUR
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XC3S500E-4CPG132I XC3S500E-4CPG132I AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 92
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S500E-5CPG132C XC3S500E-5CPG132C AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 92
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S500E-4CP132I XC3S500E-4CP132I AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 92 I/O 132CSBGA
Packaging: Bulk
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 92
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-4FTG256I XC3S500E-4FTG256I AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 190 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 190
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S500E-4FT256C XC3S500E-4FT256C AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 190 I/O 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 190
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S500E-5FGG320C XC3S500E-5FGG320C AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 232 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S500E-4FT256I XC3S500E-4FT256I AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 190 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 190
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S500E-4FG320C XC3S500E-4FG320C AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 232 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-4FG320I XC3S500E-4FG320I AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 232 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S500E-5PQG208C XC3S500E-5PQG208C AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S500E-5PQ208C XC3S500E-5PQ208C AMD 2Q1ujx53XGev4neIVdL3hw Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4VLX60-10FF1148C XC4VLX60-10FF1148C AMD ds112 Description: IC FPGA 640 I/O 1148FCBGA
Packaging: Bulk
Package / Case: 1148-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 59904
Supplier Device Package: 1148-FCPBGA (35x35)
Number of LABs/CLBs: 6656
Total RAM Bits: 2949120
Number of I/O: 640
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7A12T-1CSG325I XC7A12T-1CSG325I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Number of I/O: 150
DigiKey Programmable: Not Verified
auf Bestellung 1089 Stücke:
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1+80.56 EUR
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HW-MUSB-3090136 HW-MUSB-3090136 AMD Description: CABLE MICRO USB ALVEO U200/U250
Packaging: Bag
Accessory Type: Cable Assembly
auf Bestellung 74 Stücke:
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1+19.27 EUR
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XC3S400-5TQG144C XC3S400-5TQG144C AMD ds099 Description: IC FPGA 97 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 97
DigiKey Programmable: Not Verified
auf Bestellung 6 Stücke:
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1+111.83 EUR
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XC3S400-4TQG144I XC3S400-4TQG144I AMD ds099 Description: IC FPGA 97 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 97
DigiKey Programmable: Not Verified
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1+111.83 EUR
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XC3S400A-4FGG320I XC3S400A-4FGG320I AMD ds529 Description: IC FPGA 251 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 251
DigiKey Programmable: Not Verified
auf Bestellung 121 Stücke:
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1+118.08 EUR
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XC3S4000-4FGG676C XC3S4000-4FGG676C AMD ds099 Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
auf Bestellung 3 Stücke:
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1+379.77 EUR
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XC3S4000-5FGG676C XC3S4000-5FGG676C AMD ds099 Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S4000-4FG676C XC3S4000-4FG676C AMD ds099 Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S4000-4FGG900C XC3S4000-4FGG900C AMD ds099 Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S4000-4FG676I XC3S4000-4FG676I AMD ds099 Description: IC FPGA 489 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S4000-5FG676C XC3S4000-5FG676C AMD ds099 Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S4000-4FG900C XC3S4000-4FG900C AMD ds099 Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S4000-4FG900I XC3S4000-4FG900I AMD ds099 Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC4VLX40-10FF668C AMD ds112 Description: IC FPGA 448 I/O 668FCBGA
Packaging: Tray
Package / Case: 668-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 41472
Supplier Device Package: 668-FCBGA (27x27)
Number of LABs/CLBs: 4608
Total RAM Bits: 1769472
Number of I/O: 448
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC4VLX40-10FF1148C XC4VLX40-10FF1148C AMD ds112 Description: IC FPGA 640 I/O 1148FCBGA
Packaging: Bulk
Package / Case: 1148-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 41472
Supplier Device Package: 1148-FCPBGA (35x35)
Number of LABs/CLBs: 4608
Total RAM Bits: 1769472
Number of I/O: 640
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XAAU15P-1FFVB676Q XAAU15P-1FFVB676Q AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XAAU10P-1FFVB676I XAAU10P-1FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 228
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XAAU10P-L1SBVB484I XAAU10P-L1SBVB484I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP AUTO 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 204
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XAAU10P-L1FFVB676I XAAU10P-L1FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 228
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XAAU15P-1SBVB484I XAAU15P-1SBVB484I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP AUTO 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 204
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XAAU15P-1FFVB676I XAAU15P-1FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XAAU15P-L1FFVB676I XAAU15P-L1FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XAAU10P-1FFVB676Q XAAU10P-1FFVB676Q AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 228
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3SD1800A-4CSG484C XC3SD1800A-4CSG484C AMD M9H7L1x~XaKv2mjDl7gW5g Description: IC FPGA 309 I/O 484CSBGA
Packaging: Tray
Package / Case: 484-FBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 1800000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 37440
Supplier Device Package: 484-CSPBGA (19x19)
Number of LABs/CLBs: 4160
Total RAM Bits: 1548288
Number of I/O: 309
DigiKey Programmable: Not Verified
auf Bestellung 4 Stücke:
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1+167.02 EUR
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XC3SD1800A-4FGG676C XC3SD1800A-4FGG676C AMD M9H7L1x~XaKv2mjDl7gW5g Description: IC FPGA 519 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1800000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 37440
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 4160
Total RAM Bits: 1548288
Number of I/O: 519
DigiKey Programmable: Not Verified
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1+192.07 EUR
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XC3SD1800A-4FGG676I XC3SD1800A-4FGG676I AMD M9H7L1x~XaKv2mjDl7gW5g Description: IC FPGA 519 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1800000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 37440
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 4160
Total RAM Bits: 1548288
Number of I/O: 519
DigiKey Programmable: Not Verified
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1+220.79 EUR
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XCAU15P-1FFVB676I XCAU15P-1FFVB676I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCS30-4BG256C XCS30-4BG256C AMD ds060 Description: IC FPGA 192 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 30000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1368
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 576
Total RAM Bits: 18432
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC7A200T-1SBG484C XC7A200T-1SBG484C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
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1+479.07 EUR
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XCVM1502-1MSENFVB1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-1LSENFVB1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2MSENFVB1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XC3S50-4CP132I ds099.pdf?t.download=true&u=ovmfp3
XC3S50-4CP132I
Hersteller: AMD
Description: FPGA, 192 CLBS, 50000 GATES
Packaging: Bulk
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S50-4CPG132C0974 ds099.pdf?t.download=true&u=ovmfp3
XC3S50-4CPG132C0974
Hersteller: AMD
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Bulk
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S50-5CPG132C0974 ds099.pdf?t.download=true&u=ovmfp3
XC3S50-5CPG132C0974
Hersteller: AMD
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Bulk
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3S50-4VQG100I ds099
XC3S50-4VQG100I
Hersteller: AMD
Description: IC FPGA 63 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 63
DigiKey Programmable: Not Verified
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Anzahl Preis
1+49.32 EUR
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XC3S500E-4PQG208C ds312
XC3S500E-4PQG208C
Hersteller: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
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1+572.63 EUR
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XC3S500E-4PQG208I ds312
XC3S500E-4PQG208I
Hersteller: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
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Anzahl Preis
1+659.16 EUR
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XC3S500E-4PQ208I ds312
XC3S500E-4PQ208I
Hersteller: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
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1+797.17 EUR
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XC3S500E-4PQ208C ds312
XC3S500E-4PQ208C
Hersteller: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95288XL-10CS280I ds055
Hersteller: AMD
Description: IC CPLD 288MC 10NS 280CSBGA
Packaging: Bulk
Package / Case: 280-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 280-CSBGA (16x16)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95288XL-10BG256C GTHnyVMVaIJYQdBwKSx6iw
Hersteller: AMD
Description: IC CPLD 288MC 10NS 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-PBGA (27x27)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95288XL-10FG256C GTHnyVMVaIJYQdBwKSx6iw
XC95288XL-10FG256C
Hersteller: AMD
Description: IC CPLD 288MC 10NS 256FBGA
Packaging: Bulk
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95288XL-7BG256C ds055
XC95288XL-7BG256C
Hersteller: AMD
Description: IC CPLD 288MC 7.5NS 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-PBGA (27x27)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC95288XL-7BG256I ds055
XC95288XL-7BG256I
Hersteller: AMD
Description: IC CPLD 288MC 7.5NS 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-PBGA (27x27)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SK-KD240-G kria-bist
SK-KD240-G
Hersteller: AMD
Description: KRIA KD240 DRIVES STARTER KIT
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Kria KD240 Drives Starter
Utilized IC / Part: SM-K24-XCL2G
auf Bestellung 431 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+703.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-4VQG100C 2Q1ujx53XGev4neIVdL3hw
XC3S500E-4VQG100C
Hersteller: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+130.29 EUR
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XC3S500E-4FGG320I 2Q1ujx53XGev4neIVdL3hw
XC3S500E-4FGG320I
Hersteller: AMD
Description: IC FPGA 232 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+226.88 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-4CPG132I 2Q1ujx53XGev4neIVdL3hw
XC3S500E-4CPG132I
Hersteller: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 92
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-5CPG132C 2Q1ujx53XGev4neIVdL3hw
XC3S500E-5CPG132C
Hersteller: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 92
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-4CP132I 2Q1ujx53XGev4neIVdL3hw
XC3S500E-4CP132I
Hersteller: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Bulk
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 92
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-4FTG256I 2Q1ujx53XGev4neIVdL3hw
XC3S500E-4FTG256I
Hersteller: AMD
Description: IC FPGA 190 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 190
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-4FT256C 2Q1ujx53XGev4neIVdL3hw
XC3S500E-4FT256C
Hersteller: AMD
Description: IC FPGA 190 I/O 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 190
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-5FGG320C 2Q1ujx53XGev4neIVdL3hw
XC3S500E-5FGG320C
Hersteller: AMD
Description: IC FPGA 232 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-4FT256I 2Q1ujx53XGev4neIVdL3hw
XC3S500E-4FT256I
Hersteller: AMD
Description: IC FPGA 190 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 190
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-4FG320C 2Q1ujx53XGev4neIVdL3hw
XC3S500E-4FG320C
Hersteller: AMD
Description: IC FPGA 232 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-4FG320I 2Q1ujx53XGev4neIVdL3hw
XC3S500E-4FG320I
Hersteller: AMD
Description: IC FPGA 232 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-5PQG208C 2Q1ujx53XGev4neIVdL3hw
XC3S500E-5PQG208C
Hersteller: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S500E-5PQ208C 2Q1ujx53XGev4neIVdL3hw
XC3S500E-5PQ208C
Hersteller: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC4VLX60-10FF1148C ds112
XC4VLX60-10FF1148C
Hersteller: AMD
Description: IC FPGA 640 I/O 1148FCBGA
Packaging: Bulk
Package / Case: 1148-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 59904
Supplier Device Package: 1148-FCPBGA (35x35)
Number of LABs/CLBs: 6656
Total RAM Bits: 2949120
Number of I/O: 640
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC7A12T-1CSG325I ds181_Artix_7_Data_Sheet
XC7A12T-1CSG325I
Hersteller: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Number of I/O: 150
DigiKey Programmable: Not Verified
auf Bestellung 1089 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+80.56 EUR
Im Einkaufswagen  Stück im Wert von  UAH
HW-MUSB-3090136
HW-MUSB-3090136
Hersteller: AMD
Description: CABLE MICRO USB ALVEO U200/U250
Packaging: Bag
Accessory Type: Cable Assembly
auf Bestellung 74 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.27 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-5TQG144C ds099
XC3S400-5TQG144C
Hersteller: AMD
Description: IC FPGA 97 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 97
DigiKey Programmable: Not Verified
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+111.83 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400-4TQG144I ds099
XC3S400-4TQG144I
Hersteller: AMD
Description: IC FPGA 97 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 97
DigiKey Programmable: Not Verified
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+111.83 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC3S400A-4FGG320I ds529
XC3S400A-4FGG320I
Hersteller: AMD
Description: IC FPGA 251 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 251
DigiKey Programmable: Not Verified
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+118.08 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC3S4000-4FGG676C ds099
XC3S4000-4FGG676C
Hersteller: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+379.77 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC3S4000-5FGG676C ds099
XC3S4000-5FGG676C
Hersteller: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S4000-4FG676C ds099
XC3S4000-4FG676C
Hersteller: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S4000-4FGG900C ds099
XC3S4000-4FGG900C
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S4000-4FG676I ds099
XC3S4000-4FG676I
Hersteller: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S4000-5FG676C ds099
XC3S4000-5FG676C
Hersteller: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S4000-4FG900C ds099
XC3S4000-4FG900C
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3S4000-4FG900I ds099
XC3S4000-4FG900I
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC4VLX40-10FF668C ds112
Hersteller: AMD
Description: IC FPGA 448 I/O 668FCBGA
Packaging: Tray
Package / Case: 668-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 41472
Supplier Device Package: 668-FCBGA (27x27)
Number of LABs/CLBs: 4608
Total RAM Bits: 1769472
Number of I/O: 448
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC4VLX40-10FF1148C ds112
XC4VLX40-10FF1148C
Hersteller: AMD
Description: IC FPGA 640 I/O 1148FCBGA
Packaging: Bulk
Package / Case: 1148-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 41472
Supplier Device Package: 1148-FCPBGA (35x35)
Number of LABs/CLBs: 4608
Total RAM Bits: 1769472
Number of I/O: 640
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XAAU15P-1FFVB676Q ds890-ultrascale-overview
XAAU15P-1FFVB676Q
Hersteller: AMD
Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XAAU10P-1FFVB676I ds890-ultrascale-overview
XAAU10P-1FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 228
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XAAU10P-L1SBVB484I ds890-ultrascale-overview
XAAU10P-L1SBVB484I
Hersteller: AMD
Description: IC FPGA ARTIXUP AUTO 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 204
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XAAU10P-L1FFVB676I ds890-ultrascale-overview
XAAU10P-L1FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 228
Produkt ist nicht verfügbar
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XAAU15P-1SBVB484I ds890-ultrascale-overview
XAAU15P-1SBVB484I
Hersteller: AMD
Description: IC FPGA ARTIXUP AUTO 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 204
Produkt ist nicht verfügbar
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XAAU15P-1FFVB676I ds890-ultrascale-overview
XAAU15P-1FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
Produkt ist nicht verfügbar
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XAAU15P-L1FFVB676I ds890-ultrascale-overview
XAAU15P-L1FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
Produkt ist nicht verfügbar
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XAAU10P-1FFVB676Q ds890-ultrascale-overview
XAAU10P-1FFVB676Q
Hersteller: AMD
Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Number of I/O: 228
Produkt ist nicht verfügbar
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XC3SD1800A-4CSG484C M9H7L1x~XaKv2mjDl7gW5g
XC3SD1800A-4CSG484C
Hersteller: AMD
Description: IC FPGA 309 I/O 484CSBGA
Packaging: Tray
Package / Case: 484-FBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 1800000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 37440
Supplier Device Package: 484-CSPBGA (19x19)
Number of LABs/CLBs: 4160
Total RAM Bits: 1548288
Number of I/O: 309
DigiKey Programmable: Not Verified
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+167.02 EUR
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XC3SD1800A-4FGG676C M9H7L1x~XaKv2mjDl7gW5g
XC3SD1800A-4FGG676C
Hersteller: AMD
Description: IC FPGA 519 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1800000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 37440
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 4160
Total RAM Bits: 1548288
Number of I/O: 519
DigiKey Programmable: Not Verified
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+192.07 EUR
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XC3SD1800A-4FGG676I M9H7L1x~XaKv2mjDl7gW5g
XC3SD1800A-4FGG676I
Hersteller: AMD
Description: IC FPGA 519 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1800000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 37440
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 4160
Total RAM Bits: 1548288
Number of I/O: 519
DigiKey Programmable: Not Verified
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+220.79 EUR
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XCAU15P-1FFVB676I ds890-ultrascale-overview
XCAU15P-1FFVB676I
Hersteller: AMD
Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCS30-4BG256C ds060
XCS30-4BG256C
Hersteller: AMD
Description: IC FPGA 192 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 30000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1368
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 576
Total RAM Bits: 18432
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7A200T-1SBG484C ds181_Artix_7_Data_Sheet
XC7A200T-1SBG484C
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+479.07 EUR
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XCVM1502-1MSENFVB1369 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-1LSENFVB1369 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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XCVM1502-2MSENFVB1369 ds950-versal-overview
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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