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XC7A12T-1CPG238C XC7A12T-1CPG238C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 106 I/O 238BGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 106
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 11 Stücke
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XC17V08PC44C XC17V08PC44C AMD zeVecxGWTzd3iIaH3DvWzg Description: IC PROM SER C-TEMP 3.3V 44-PLCC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 44-PLCC (16.59x16.59)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Programmable Type: OTP
Memory Size: 8MB
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
auf Bestellung 815 Stücke:
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10+69.77 EUR
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XC17V02VQ44C XC17V02VQ44C AMD zeVecxGWTzd3iIaH3DvWzg Description: IC PROM SER 2MBIT 3.3V 44-VQFP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 44-VQFP (10x10)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Programmable Type: OTP
Memory Size: 2MB
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
auf Bestellung 536 Stücke:
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35+15.48 EUR
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XC17V02PC44C XC17V02PC44C AMD zeVecxGWTzd3iIaH3DvWzg Description: IC PROM SER 2MBIT 3.3V 44-PLCC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 44-PLCC (16.59x16.59)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Programmable Type: OTP
Memory Size: 2MB
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
auf Bestellung 1912 Stücke:
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35+15.48 EUR
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XC7A75T-1FGG484C XC7A75T-1FGG484C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7A75T-2FGG484I XC7A75T-2FGG484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 71 Stücke:
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1+371.89 EUR
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XC7A15T-1FGG484I XC7A15T-1FGG484I AMD ds180_7Series_Overview Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
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XC7A15T-1FGG484C XC7A15T-1FGG484C AMD ds180_7Series_Overview Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 203 Stücke:
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XC7A75T-2FGG676C XC7A75T-2FGG676C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 300 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 300
DigiKey Programmable: Not Verified
auf Bestellung 47 Stücke:
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1+375.4 EUR
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XCV200-5BG256C XCV200-5BG256C AMD Virtex_2.5_V.pdf Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 236666
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Part Status: Obsolete
Number of I/O: 180
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCV200-5BG256I XCV200-5BG256I AMD Virtex_2.5_V.pdf Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 236666
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Part Status: Obsolete
Number of I/O: 180
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AM28F020-200EC AMD Description: FLASH NOR 2MB 12V TSOP 200ns
Packaging: Tube
Package / Case: 32-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 200ns
Memory Interface: Parallel
Access Time: 200 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
auf Bestellung 1935 Stücke:
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100+4.19 EUR
200+4.08 EUR
300+3.97 EUR
500+3.77 EUR
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AM29LV160DT-90EC AMD Description: FLASH NOR 16MB TSOP Top Blk 3v
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 2607 Stücke:
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96+5.45 EUR
192+5.4 EUR
384+5.34 EUR
960+5.24 EUR
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AM29LV160DB-70EI AMD Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B
Packaging: Tube
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 949 Stücke:
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96+5.76 EUR
192+5.7 EUR
384+5.65 EUR
768+5.55 EUR
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XC3S5000-4FGG1156C XC3S5000-4FGG1156C AMD ds099.pdf?t.download=true&u=ovmfp3 Description: FPGA, 8320 CLBS, 5000000 GATES
DigiKey Programmable: Not Verified
Number of I/O: 633
Part Status: Active
Total RAM Bits: 1916928
Number of LABs/CLBs: 8320
Number of Logic Elements/Cells: 74880
Voltage - Supply: 1.14V ~ 1.26V
Number of Gates: 5000000
Mounting Type: Surface Mount
Packaging: Bulk
auf Bestellung 429 Stücke:
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2+581.14 EUR
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XC3S5000-4FG1156C XC3S5000-4FG1156C AMD ds099.pdf?t.download=true&u=ovmfp3 Description: FPGA, 8320 CLBS, 5000000 GATES
Number of Gates: 5000000
Mounting Type: Surface Mount
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 489
Part Status: Active
Number of LABs/CLBs: 8320
Number of Logic Elements/Cells: 74880
auf Bestellung 18 Stücke:
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2+226.34 EUR
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XCV400-4HQ240C0729 XCV400-4HQ240C0729 AMD ds022.pdf?t.download=true&u=ovmfp3 Description: FPGA, 2400 CLBS, 468252 GATES, 2
Part Status: Active
Packaging: Bulk
auf Bestellung 19 Stücke:
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1+778.07 EUR
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XCV400-5HQ240I AMD Virtex_2.5_V.pdf Description: IC FPGA 166 I/O 240QFP
DigiKey Programmable: Not Verified
Number of I/O: 166
Part Status: Obsolete
Total RAM Bits: 81920
Number of LABs/CLBs: 2400
Supplier Device Package: 240-PQFP (32x32)
Number of Logic Elements/Cells: 10800
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 468252
Mounting Type: Surface Mount
Package / Case: 240-BFQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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XCV400-5BG560C AMD Virtex_2.5_V.pdf Description: IC FPGA 404 I/O 560MBGA
DigiKey Programmable: Not Verified
Number of I/O: 404
Part Status: Obsolete
Total RAM Bits: 81920
Number of LABs/CLBs: 2400
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of Logic Elements/Cells: 10800
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 468252
Mounting Type: Surface Mount
Package / Case: 560-LBGA Exposed Pad, Metal
Packaging: Tray
Produkt ist nicht verfügbar
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XCV400-4BG560I AMD Virtex_2.5_V.pdf Description: IC FPGA 404 I/O 560MBGA
DigiKey Programmable: Not Verified
Number of I/O: 404
Part Status: Obsolete
Total RAM Bits: 81920
Number of LABs/CLBs: 2400
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of Logic Elements/Cells: 10800
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 468252
Mounting Type: Surface Mount
Package / Case: 560-LBGA Exposed Pad, Metal
Packaging: Tray
Produkt ist nicht verfügbar
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XCV400-4HQ240C AMD Virtex_2.5_V.pdf Description: IC FPGA 166 I/O 240QFP
Total RAM Bits: 81920
Number of LABs/CLBs: 2400
Supplier Device Package: 240-PQFP (32x32)
Number of Logic Elements/Cells: 10800
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 468252
Mounting Type: Surface Mount
Package / Case: 240-BFQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 166
Part Status: Obsolete
Produkt ist nicht verfügbar
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AM29DL323GT-90EF AMD Description: FLASH NOR 32 MB TOP BOOT 90NS TS
DigiKey Programmable: Not Verified
Memory Organization: 4M x 8, 2M x 16
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 90ns
Part Status: Active
Supplier Device Package: 48-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Memory Type: Non-Volatile
Memory Size: 32Mbit
Mounting Type: Surface Mount
Packaging: Tray
auf Bestellung 960 Stücke:
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96+6.28 EUR
192+6.07 EUR
384+5.87 EUR
768+5.76 EUR
960+5.65 EUR
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AM29DL324GB-70EI AMD Description: FLASH NOR 32MB 3V (Btm Bt-Blk) 7
DigiKey Programmable: Not Verified
Memory Organization: 4M x 8, 2M x 16
Access Time: 70 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 70ns
Part Status: Active
Supplier Device Package: 48-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Memory Type: Non-Volatile
Memory Size: 32Mbit
Mounting Type: Surface Mount
Packaging: Tray
auf Bestellung 9600 Stücke:
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960+6.28 EUR
1920+6.18 EUR
3840+6.07 EUR
9600+5.76 EUR
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XCZU15EG-L2FFVB1156E XCZU15EG-L2FFVB1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU15EG-1FFVC900I XCZU15EG-1FFVC900I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU15EG-2FFVB1156E XCZU15EG-2FFVB1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU15EG-2FFVB1156I XCZU15EG-2FFVB1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 6 Stücke:
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1+15304.94 EUR
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XCZU15EG-1FFVB1156E XCZU15EG-1FFVB1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU15EG-2FFVC900E XCZU15EG-2FFVC900E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU15EG-1FFVB1156I XCZU15EG-1FFVB1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU15EG-2FFVC900I XCZU15EG-2FFVC900I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU15EG-1FFVC900E XCZU15EG-1FFVC900E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU15EG-3FFVB1156E XCZU15EG-3FFVB1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AM29LV160DB-70EC AMD Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
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3840+4.4 EUR
7680+4.3 EUR
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XCZU3CG-1UBVA530I XCZU3CG-1UBVA530I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XC7A25T-1CPG238I XC7A25T-1CPG238I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TA)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCS40-4BG256C XCS40-4BG256C AMD ds060 Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCS40-3BG256C XCS40-3BG256C AMD ds060 Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCS40XL-5BG256C XCS40XL-5BG256C AMD ds060 Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCS40XL-4BG256C XCS40XL-4BG256C AMD ds060 Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCS40XL-4BG256I XCS40XL-4BG256I AMD ds060 Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC7A200T-2SBG484I XC7A200T-2SBG484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Part Status: Active
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-FBGA, FCBGA
Packaging: Tray
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XC7A200T-2FBG676C XC7A200T-2FBG676C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 400 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Part Status: Active
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
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XC7A200T-1FBG484C XC7A200T-1FBG484C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Part Status: Active
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tray
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XC7A200T-1FBG676C XC7A200T-1FBG676C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 400 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Part Status: Active
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
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XC7A200T-1FBG484I XC7A200T-1FBG484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Part Status: Active
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tray
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AM29LV160DT-90ED AMD Description: FLASH NOR 16 MB TOP BOOT 90NS TS
DigiKey Programmable: Not Verified
Memory Organization: 2M x 8, 1M x 16
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 90ns
Part Status: Active
Supplier Device Package: 48-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 3V
Operating Temperature: 0°C ~ 70°C
Memory Type: Non-Volatile
Memory Size: 16Mbit
Mounting Type: Surface Mount
Packaging: Tray
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384+5.34 EUR
960+5.24 EUR
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AM29F400BB-90SE AMD Description: FLASH NOR 4MB 5V PSOP (Btm Bt-Bl
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 5V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 44-SO
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
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1000+8.79 EUR
3000+8.59 EUR
5000+8.38 EUR
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XC3S250E-4TQG144C XC3S250E-4TQG144C AMD ds312 Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC3SD3400A-4FGG676C XC3SD3400A-4FGG676C AMD M9H7L1x~XaKv2mjDl7gW5g Description: IC FPGA 469 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 3400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 53712
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5968
Total RAM Bits: 2322432
Number of I/O: 469
DigiKey Programmable: Not Verified
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XC3S700AN-4FGG484C XC3S700AN-4FGG484C AMD kwrFxhQjlUQMgifB9lnihQ Description: IC FPGA 372 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Number of Gates: 700000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 13248
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1472
Total RAM Bits: 368640
Number of I/O: 372
DigiKey Programmable: Not Verified
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XC3S1000-4FGG456C XC3S1000-4FGG456C AMD ds099 Description: IC FPGA 333 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 333
DigiKey Programmable: Not Verified
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XC3S4000-4FGG676I XC3S4000-4FGG676I AMD ds099 Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
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XC3S200-4TQG144C XC3S200-4TQG144C AMD ds099 Description: IC FPGA 97 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 97
DigiKey Programmable: Not Verified
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XC3S100E-4TQG144C XC3S100E-4TQG144C AMD ds312 description Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 108
DigiKey Programmable: Not Verified
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XC3S200-4VQG100C XC3S200-4VQG100C AMD ds099 Description: IC FPGA 63 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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XCF32PVO48C XCF32PVO48C AMD XILIS00960-1.pdf?t.download=true&u=ovmfp3 Description: CONFIG MEMORY, 32MX1, SERIAL
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCF16PVO48C XCF16PVO48C AMD Description: CONFIG MEMORY, 16MX1, SERIAL
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XAZU1EG-1SBVA484I XAZU1EG-1SBVA484I AMD ds894-zynq-ultrascale-plus-overview Description: IC ZUP MPSOC A53 FPGA Q 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
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XAZU1EG-1SFVA625I XAZU1EG-1SFVA625I AMD ds894-zynq-ultrascale-plus-overview Description: IC ZUP MPSOC A53 FPGA Q 625BGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MPU, FPGA
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XC7A12T-1CPG238C ds181_Artix_7_Data_Sheet
XC7A12T-1CPG238C
Hersteller: AMD
Description: IC FPGA 106 I/O 238BGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 106
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC17V08PC44C zeVecxGWTzd3iIaH3DvWzg
XC17V08PC44C
Hersteller: AMD
Description: IC PROM SER C-TEMP 3.3V 44-PLCC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 44-PLCC (16.59x16.59)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Programmable Type: OTP
Memory Size: 8MB
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
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10+69.77 EUR
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XC17V02VQ44C zeVecxGWTzd3iIaH3DvWzg
XC17V02VQ44C
Hersteller: AMD
Description: IC PROM SER 2MBIT 3.3V 44-VQFP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 44-VQFP (10x10)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Programmable Type: OTP
Memory Size: 2MB
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
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35+15.48 EUR
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XC17V02PC44C zeVecxGWTzd3iIaH3DvWzg
XC17V02PC44C
Hersteller: AMD
Description: IC PROM SER 2MBIT 3.3V 44-PLCC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 44-PLCC (16.59x16.59)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Programmable Type: OTP
Memory Size: 2MB
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
auf Bestellung 1912 Stücke:
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AnzahlPrivatkunde
35+15.48 EUR
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XC7A75T-1FGG484C ds181_Artix_7_Data_Sheet
XC7A75T-1FGG484C
Hersteller: AMD
Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7A75T-2FGG484I ds181_Artix_7_Data_Sheet
XC7A75T-2FGG484I
Hersteller: AMD
Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
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XC7A15T-1FGG484I ds180_7Series_Overview
XC7A15T-1FGG484I
Hersteller: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 3 Stücke:
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1+105.2 EUR
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XC7A15T-1FGG484C ds180_7Series_Overview
XC7A15T-1FGG484C
Hersteller: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 203 Stücke:
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1+91.57 EUR
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XC7A75T-2FGG676C ds181_Artix_7_Data_Sheet
XC7A75T-2FGG676C
Hersteller: AMD
Description: IC FPGA 300 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 300
DigiKey Programmable: Not Verified
auf Bestellung 47 Stücke:
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AnzahlPrivatkunde
1+375.4 EUR
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XCV200-5BG256C Virtex_2.5_V.pdf
XCV200-5BG256C
Hersteller: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 236666
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Part Status: Obsolete
Number of I/O: 180
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCV200-5BG256I Virtex_2.5_V.pdf
XCV200-5BG256I
Hersteller: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 236666
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Part Status: Obsolete
Number of I/O: 180
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AM28F020-200EC
Hersteller: AMD
Description: FLASH NOR 2MB 12V TSOP 200ns
Packaging: Tube
Package / Case: 32-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 200ns
Memory Interface: Parallel
Access Time: 200 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
auf Bestellung 1935 Stücke:
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100+4.19 EUR
200+4.08 EUR
300+3.97 EUR
500+3.77 EUR
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AM29LV160DT-90EC
Hersteller: AMD
Description: FLASH NOR 16MB TSOP Top Blk 3v
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 2607 Stücke:
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AnzahlPrivatkunde
96+5.45 EUR
192+5.4 EUR
384+5.34 EUR
960+5.24 EUR
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AM29LV160DB-70EI
Hersteller: AMD
Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B
Packaging: Tube
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 949 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
96+5.76 EUR
192+5.7 EUR
384+5.65 EUR
768+5.55 EUR
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XC3S5000-4FGG1156C ds099.pdf?t.download=true&u=ovmfp3
XC3S5000-4FGG1156C
Hersteller: AMD
Description: FPGA, 8320 CLBS, 5000000 GATES
DigiKey Programmable: Not Verified
Number of I/O: 633
Part Status: Active
Total RAM Bits: 1916928
Number of LABs/CLBs: 8320
Number of Logic Elements/Cells: 74880
Voltage - Supply: 1.14V ~ 1.26V
Number of Gates: 5000000
Mounting Type: Surface Mount
Packaging: Bulk
auf Bestellung 429 Stücke:
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AnzahlPrivatkunde
2+581.14 EUR
Mindestbestellmenge: 2 Stücke
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XC3S5000-4FG1156C ds099.pdf?t.download=true&u=ovmfp3
XC3S5000-4FG1156C
Hersteller: AMD
Description: FPGA, 8320 CLBS, 5000000 GATES
Number of Gates: 5000000
Mounting Type: Surface Mount
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 489
Part Status: Active
Number of LABs/CLBs: 8320
Number of Logic Elements/Cells: 74880
auf Bestellung 18 Stücke:
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AnzahlPrivatkunde
2+226.34 EUR
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XCV400-4HQ240C0729 ds022.pdf?t.download=true&u=ovmfp3
XCV400-4HQ240C0729
Hersteller: AMD
Description: FPGA, 2400 CLBS, 468252 GATES, 2
Part Status: Active
Packaging: Bulk
auf Bestellung 19 Stücke:
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AnzahlPrivatkunde
1+778.07 EUR
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XCV400-5HQ240I Virtex_2.5_V.pdf
Hersteller: AMD
Description: IC FPGA 166 I/O 240QFP
DigiKey Programmable: Not Verified
Number of I/O: 166
Part Status: Obsolete
Total RAM Bits: 81920
Number of LABs/CLBs: 2400
Supplier Device Package: 240-PQFP (32x32)
Number of Logic Elements/Cells: 10800
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 468252
Mounting Type: Surface Mount
Package / Case: 240-BFQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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XCV400-5BG560C Virtex_2.5_V.pdf
Hersteller: AMD
Description: IC FPGA 404 I/O 560MBGA
DigiKey Programmable: Not Verified
Number of I/O: 404
Part Status: Obsolete
Total RAM Bits: 81920
Number of LABs/CLBs: 2400
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of Logic Elements/Cells: 10800
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 468252
Mounting Type: Surface Mount
Package / Case: 560-LBGA Exposed Pad, Metal
Packaging: Tray
Produkt ist nicht verfügbar
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XCV400-4BG560I Virtex_2.5_V.pdf
Hersteller: AMD
Description: IC FPGA 404 I/O 560MBGA
DigiKey Programmable: Not Verified
Number of I/O: 404
Part Status: Obsolete
Total RAM Bits: 81920
Number of LABs/CLBs: 2400
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of Logic Elements/Cells: 10800
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 468252
Mounting Type: Surface Mount
Package / Case: 560-LBGA Exposed Pad, Metal
Packaging: Tray
Produkt ist nicht verfügbar
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XCV400-4HQ240C Virtex_2.5_V.pdf
Hersteller: AMD
Description: IC FPGA 166 I/O 240QFP
Total RAM Bits: 81920
Number of LABs/CLBs: 2400
Supplier Device Package: 240-PQFP (32x32)
Number of Logic Elements/Cells: 10800
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 468252
Mounting Type: Surface Mount
Package / Case: 240-BFQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 166
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AM29DL323GT-90EF
Hersteller: AMD
Description: FLASH NOR 32 MB TOP BOOT 90NS TS
DigiKey Programmable: Not Verified
Memory Organization: 4M x 8, 2M x 16
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 90ns
Part Status: Active
Supplier Device Package: 48-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Memory Type: Non-Volatile
Memory Size: 32Mbit
Mounting Type: Surface Mount
Packaging: Tray
auf Bestellung 960 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
96+6.28 EUR
192+6.07 EUR
384+5.87 EUR
768+5.76 EUR
960+5.65 EUR
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AM29DL324GB-70EI
Hersteller: AMD
Description: FLASH NOR 32MB 3V (Btm Bt-Blk) 7
DigiKey Programmable: Not Verified
Memory Organization: 4M x 8, 2M x 16
Access Time: 70 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 70ns
Part Status: Active
Supplier Device Package: 48-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Memory Type: Non-Volatile
Memory Size: 32Mbit
Mounting Type: Surface Mount
Packaging: Tray
auf Bestellung 9600 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
960+6.28 EUR
1920+6.18 EUR
3840+6.07 EUR
9600+5.76 EUR
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XCZU15EG-L2FFVB1156E ds891-zynq-ultrascale-plus-overview
XCZU15EG-L2FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU15EG-1FFVC900I ds891-zynq-ultrascale-plus-overview
XCZU15EG-1FFVC900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU15EG-2FFVB1156E ds891-zynq-ultrascale-plus-overview
XCZU15EG-2FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU15EG-2FFVB1156I ds891-zynq-ultrascale-plus-overview
XCZU15EG-2FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 6 Stücke:
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AnzahlPrivatkunde
1+15304.94 EUR
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XCZU15EG-1FFVB1156E ds891-zynq-ultrascale-plus-overview
XCZU15EG-1FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU15EG-2FFVC900E ds891-zynq-ultrascale-plus-overview
XCZU15EG-2FFVC900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU15EG-1FFVB1156I ds891-zynq-ultrascale-plus-overview
XCZU15EG-1FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU15EG-2FFVC900I ds891-zynq-ultrascale-plus-overview
XCZU15EG-2FFVC900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU15EG-1FFVC900E ds891-zynq-ultrascale-plus-overview
XCZU15EG-1FFVC900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU15EG-3FFVB1156E ds891-zynq-ultrascale-plus-overview
XCZU15EG-3FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AM29LV160DB-70EC
Hersteller: AMD
Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 218894 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
480+4.71 EUR
960+4.61 EUR
3840+4.4 EUR
7680+4.3 EUR
Mindestbestellmenge: 480 Stücke
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XCZU3CG-1UBVA530I ds891-zynq-ultrascale-plus-overview
XCZU3CG-1UBVA530I
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XC7A25T-1CPG238I ds181_Artix_7_Data_Sheet
XC7A25T-1CPG238I
Hersteller: AMD
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TA)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCS40-4BG256C ds060
XCS40-4BG256C
Hersteller: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCS40-3BG256C ds060
XCS40-3BG256C
Hersteller: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCS40XL-5BG256C ds060
XCS40XL-5BG256C
Hersteller: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCS40XL-4BG256C ds060
XCS40XL-4BG256C
Hersteller: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCS40XL-4BG256I ds060
XCS40XL-4BG256I
Hersteller: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7A200T-2SBG484I ds181_Artix_7_Data_Sheet
XC7A200T-2SBG484I
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Part Status: Active
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-FBGA, FCBGA
Packaging: Tray
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)
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1+701.9 EUR
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XC7A200T-2FBG676C ds181_Artix_7_Data_Sheet
XC7A200T-2FBG676C
Hersteller: AMD
Description: IC FPGA 400 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Part Status: Active
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
auf Bestellung 151 Stücke:
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1+609.22 EUR
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XC7A200T-1FBG484C ds181_Artix_7_Data_Sheet
XC7A200T-1FBG484C
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Part Status: Active
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tray
auf Bestellung 294 Stücke:
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1+505.44 EUR
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XC7A200T-1FBG676C ds181_Artix_7_Data_Sheet
XC7A200T-1FBG676C
Hersteller: AMD
Description: IC FPGA 400 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Part Status: Active
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
auf Bestellung 161 Stücke:
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1+526.77 EUR
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XC7A200T-1FBG484I ds181_Artix_7_Data_Sheet
XC7A200T-1FBG484I
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Part Status: Active
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tray
auf Bestellung 41 Stücke:
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1+519.39 EUR
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AM29LV160DT-90ED
Hersteller: AMD
Description: FLASH NOR 16 MB TOP BOOT 90NS TS
DigiKey Programmable: Not Verified
Memory Organization: 2M x 8, 1M x 16
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 90ns
Part Status: Active
Supplier Device Package: 48-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 3V
Operating Temperature: 0°C ~ 70°C
Memory Type: Non-Volatile
Memory Size: 16Mbit
Mounting Type: Surface Mount
Packaging: Tray
auf Bestellung 7488 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
96+5.45 EUR
192+5.4 EUR
384+5.34 EUR
960+5.24 EUR
Mindestbestellmenge: 96 Stücke
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AM29F400BB-90SE
Hersteller: AMD
Description: FLASH NOR 4MB 5V PSOP (Btm Bt-Bl
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 5V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 44-SO
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
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AnzahlPrivatkunde
500+8.9 EUR
1000+8.79 EUR
3000+8.59 EUR
5000+8.38 EUR
Mindestbestellmenge: 500 Stücke
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XC3S250E-4TQG144C ds312
XC3S250E-4TQG144C
Hersteller: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XC3SD3400A-4FGG676C M9H7L1x~XaKv2mjDl7gW5g
XC3SD3400A-4FGG676C
Hersteller: AMD
Description: IC FPGA 469 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 3400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 53712
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5968
Total RAM Bits: 2322432
Number of I/O: 469
DigiKey Programmable: Not Verified
auf Bestellung 349 Stücke:
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1+274.06 EUR
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XC3S700AN-4FGG484C kwrFxhQjlUQMgifB9lnihQ
XC3S700AN-4FGG484C
Hersteller: AMD
Description: IC FPGA 372 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Number of Gates: 700000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 13248
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1472
Total RAM Bits: 368640
Number of I/O: 372
DigiKey Programmable: Not Verified
auf Bestellung 1037 Stücke:
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1+288.63 EUR
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XC3S1000-4FGG456C ds099
XC3S1000-4FGG456C
Hersteller: AMD
Description: IC FPGA 333 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 333
DigiKey Programmable: Not Verified
auf Bestellung 66 Stücke:
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1+287.15 EUR
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XC3S4000-4FGG676I ds099
XC3S4000-4FGG676I
Hersteller: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
auf Bestellung 239 Stücke:
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AnzahlPrivatkunde
1+508.14 EUR
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XC3S200-4TQG144C ds099
XC3S200-4TQG144C
Hersteller: AMD
Description: IC FPGA 97 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 97
DigiKey Programmable: Not Verified
auf Bestellung 1702 Stücke:
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1+72.42 EUR
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XC3S100E-4TQG144C description ds312
XC3S100E-4TQG144C
Hersteller: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 108
DigiKey Programmable: Not Verified
auf Bestellung 15629 Stücke:
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1+72.91 EUR
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XC3S200-4VQG100C ds099
XC3S200-4VQG100C
Hersteller: AMD
Description: IC FPGA 63 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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XCF32PVO48C XILIS00960-1.pdf?t.download=true&u=ovmfp3
XCF32PVO48C
Hersteller: AMD
Description: CONFIG MEMORY, 32MX1, SERIAL
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCF16PVO48C
XCF16PVO48C
Hersteller: AMD
Description: CONFIG MEMORY, 16MX1, SERIAL
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XAZU1EG-1SBVA484I ds894-zynq-ultrascale-plus-overview
XAZU1EG-1SBVA484I
Hersteller: AMD
Description: IC ZUP MPSOC A53 FPGA Q 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
auf Bestellung 53 Stücke:
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1+667.76 EUR
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XAZU1EG-1SFVA625I ds894-zynq-ultrascale-plus-overview
XAZU1EG-1SFVA625I
Hersteller: AMD
Description: IC ZUP MPSOC A53 FPGA Q 625BGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MPU, FPGA
auf Bestellung 45 Stücke:
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AnzahlPrivatkunde
1+699.89 EUR
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