| Foto | Bezeichnung | Hersteller | Beschreibung |
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XCVM1802-1MLIVSVD1760 | AMD |
 Description: IC VERSAL AICORE FPGA 1760BGAPackaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1802-2LSEVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1802-2MLEVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1802-1LSIVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1802-2MSIVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1802-2LLEVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1802-1LLIVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1802-2MLIVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1802-2HSIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 800MHz, 1.65GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1802-2LLIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVC1802-1MSEVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVC1902-1MSEVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVC1802-1LSEVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVC1802-1MSIVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVC1802-2MSEVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVC1902-1LSEVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVC1902-1MSIVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| LMS-MPSOC-BOOT-PM | AMD |
Description: ONDEMAND ZYNQ ULTRASCALE+ MPSOC: Packaging: Bulk |
Produkt ist nicht verfügbar |
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XC3S1600E-4FGG484C | AMD |
Description: IC FPGA 376 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Number of Gates: 1600000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 33192 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 3688 Total RAM Bits: 663552 Number of I/O: 376 DigiKey Programmable: Not Verified |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7A15T-1CPG236C | AMD |
Description: IC FPGA 106 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 106 DigiKey Programmable: Not Verified |
auf Bestellung 921 Stücke: Lieferzeit 10-14 Tag (e) |
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XC3S400-4PQG208I | AMD |
Description: IC FPGA 141 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 141 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC7A35T-2FGG484I | AMD |
Description: IC FPGA 250 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 33280 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2600 Total RAM Bits: 1843200 Number of I/O: 250 DigiKey Programmable: Not Verified |
auf Bestellung 2360 Stücke: Lieferzeit 10-14 Tag (e) |
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| XC3S400-4TQ144C | AMD |
Description: IC FPGA 97 I/O 144TQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 97 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XC3S400-4TQ144I | AMD |
Description: IC FPGA 97 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 97 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S200-5FTG256C | AMD |
Description: IC FPGA 173 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 200000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 4320 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 480 Total RAM Bits: 221184 Number of I/O: 173 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FGG676C | AMD |
Description: IC FPGA 489 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 489 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-5FGG676C | AMD |
Description: IC FPGA 489 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 489 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FGG676I | AMD |
Description: IC FPGA 489 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 489 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FGG900C | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Tray Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 633 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FG676I | AMD |
Description: IC FPGA 489 I/O 676FCBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 489 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-5FG676C | AMD |
Description: IC FPGA 489 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 489 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-5FGG900C | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Tray Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 633 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FGG900I | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Tray Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 633 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FG900C | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Tray Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 633 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FG900I | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Bulk Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 633 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-5FG900C | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Bulk Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 633 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EFR-DI-AES-IP-WW | AMD |
Description: LOGICORE, ADVANCED ENCRYPTION ST Packaging: Bulk |
Produkt ist nicht verfügbar |
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| EFR-DI-ERNIC-WW | AMD |
Description: DEV RNIC SITE LICENSE RENEWAL WW Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Worldwide Media Delivery Type: Electronically Delivered |
Produkt ist nicht verfügbar |
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XC18V01PC20C0100 | AMD |
Description: RE-PROGRAMMABLE 1MB PROM Packaging: Tape & Reel (TR) Package / Case: 20-LCC (J-Lead) Mounting Type: Surface Mount Memory Size: 1Mb Programmable Type: In System Programmable Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 20-PLCC (9x9) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC18V01PCG20C0100 | AMD |
Description: RE-PROGRAMMABLE 1MB PROM Packaging: Tape & Reel (TR) Package / Case: 20-LCC (J-Lead) Mounting Type: Surface Mount Memory Size: 1Mb Programmable Type: In System Programmable Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 20-PLCC (9x9) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC18V01SO20C0100 | AMD |
Description: RE-PROGRAMMABLE 1MB PROM Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Memory Size: 1Mb Programmable Type: In System Programmable Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 20-SOIC DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC18V01VQG44C0100 | AMD |
Description: XC18V01VQG44C0100 Packaging: Tape & Reel (TR) Package / Case: 44-TQFP Mounting Type: Surface Mount Memory Size: 1Mb Programmable Type: In System Programmable Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 44-VQFP (10x10) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC7A35T-1FGG484C | AMD |
Description: IC FPGA 250 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 33280 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2600 Total RAM Bits: 1843200 Number of I/O: 250 DigiKey Programmable: Not Verified |
auf Bestellung 324 Stücke: Lieferzeit 10-14 Tag (e) |
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| EFR-DI-FLASH-LDPC-SITE | AMD |
Description: LOGICORE, FLASH MEMORY LDPC ERRO Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Site Media Delivery Type: Electronically Delivered |
Produkt ist nicht verfügbar |
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| EFR-DI-FLASH-LDPC-WW | AMD |
Description: LOGICORE, FLASH MEMORY LDPC ERRO Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Worldwide Media Delivery Type: Electronically Delivered |
Produkt ist nicht verfügbar |
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| EF-DI-FLASH-LDPC-SITE | AMD |
Description: LOGICORE, FLASH MEMORY LDPC ERRO Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Site Media Delivery Type: Electronically Delivered |
Produkt ist nicht verfügbar |
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| EF-DI-FLASH-LDPC-WW | AMD |
Description: LOGICORE, FLASH MEMORY LDPC ERRO Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Worldwide Media Delivery Type: Electronically Delivered |
Produkt ist nicht verfügbar |
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| XCVP1402-1LSEVSVA3340 | AMD |
Description: IC VERSAL PREM ACAP FPGA 3340BGA Packaging: Tray Package / Case: 3340-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 3340-FCBGA (55x55) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVP1402-1LSIVSVA3340 | AMD |
Description: IC VERSAL PREM ACAP FPGA 3340BGA Packaging: Tray Package / Case: 3340-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 3340-FCBGA (55x55) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVP1402-2LSEVSVA3340 | AMD |
Description: IC VERSAL PREM ACAP FPGA 3340BGA Packaging: Tray Package / Case: 3340-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 3340-FCBGA (55x55) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVP1402-2LLEVSVA3340 | AMD |
Description: IC VERSAL PREM ACAP FPGA 3340BGA Packaging: Tray Package / Case: 3340-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 3340-FCBGA (55x55) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVP1402-1LLIVSVA3340 | AMD |
Description: IC VERSAL PREM ACAP FPGA 3340BGA Packaging: Tray Package / Case: 3340-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 3340-FCBGA (55x55) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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 |
XCVU57P-1FSVK2892E | AMD |
Description: IC FPGA VIRTEX-UP 2892BGA Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCVU57P-2FSVK2892E | AMD |
Description: IC FPGA VIRTEX-UP 2892BGA Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCVU57P-L2FSVK2892E | AMD |
Description: IC FPGA VIRTEX-UP LP 2892BGA Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCVU57P-3FSVK2892E | AMD |
Description: IC FPGA VIRTEX-UP 2892BGA Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.873V ~ 0.927V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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 |
XAZU1EG-1SFVA625Q | AMD |
Description: IC ZUP MPSOC A53 FPGA Q 625BGA Packaging: Tray Package / Case: 625-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 625-FCBGA (21x21) Architecture: MPU, FPGA |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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 |
XC7A15T-1CSG324I | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 210 DigiKey Programmable: Not Verified |
auf Bestellung 298 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7A15T-3CSG324E | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 210 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| DS-XPA-500K | AMD |
Description: XILINX PRODUCTIVITY ADVANTAGE 1 Packaging: Bulk Type: Design Software Applications: Programming |
Produkt ist nicht verfügbar |
| XCVM1802-1MLIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1802-2LSEVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1802-2MLEVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1802-1LSIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1802-2MSIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1802-2LLEVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1802-1LLIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1802-2MLIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1802-2HSIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 800MHz, 1.65GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 800MHz, 1.65GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1802-2LLIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVC1802-1MSEVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVC1902-1MSEVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVC1802-1LSEVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVC1802-1MSIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVC1802-2MSEVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVC1902-1LSEVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVC1902-1MSIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| LMS-MPSOC-BOOT-PM |
Produkt ist nicht verfügbar
| XC3S1600E-4FGG484C |
|
Hersteller: AMD
Description: IC FPGA 376 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Number of Gates: 1600000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 33192
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3688
Total RAM Bits: 663552
Number of I/O: 376
DigiKey Programmable: Not Verified
Description: IC FPGA 376 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Number of Gates: 1600000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 33192
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3688
Total RAM Bits: 663552
Number of I/O: 376
DigiKey Programmable: Not Verified
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 475.36 EUR |
| XC7A15T-1CPG236C |
|
Hersteller: AMD
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
auf Bestellung 921 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 69.56 EUR |
| XC3S400-4PQG208I |
|
Hersteller: AMD
Description: IC FPGA 141 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 141
DigiKey Programmable: Not Verified
Description: IC FPGA 141 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 141
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC7A35T-2FGG484I |
|
Hersteller: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 2360 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 147.63 EUR |
| XC3S400-4TQ144C |
|
Hersteller: AMD
Description: IC FPGA 97 I/O 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 97
DigiKey Programmable: Not Verified
Description: IC FPGA 97 I/O 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 97
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S400-4TQ144I |
|
Hersteller: AMD
Description: IC FPGA 97 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 97
DigiKey Programmable: Not Verified
Description: IC FPGA 97 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 97
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S200-5FTG256C |
|
Hersteller: AMD
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 173
DigiKey Programmable: Not Verified
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 173
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FGG676C |
|
Hersteller: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-5FGG676C |
|
Hersteller: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FGG676I |
|
Hersteller: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FGG900C |
|
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FG676I |
|
Hersteller: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-5FG676C |
|
Hersteller: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-5FGG900C |
|
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FGG900I |
|
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FG900C |
|
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FG900I |
|
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-5FG900C |
|
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EFR-DI-AES-IP-WW |
|
Produkt ist nicht verfügbar
| EFR-DI-ERNIC-WW |
Hersteller: AMD
Description: DEV RNIC SITE LICENSE RENEWAL WW
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Description: DEV RNIC SITE LICENSE RENEWAL WW
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
| XC18V01PC20C0100 |
|
Hersteller: AMD
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC18V01PCG20C0100 |
|
Hersteller: AMD
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC18V01SO20C0100 |
|
Hersteller: AMD
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-SOIC
DigiKey Programmable: Not Verified
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-SOIC
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC18V01VQG44C0100 |
|
Hersteller: AMD
Description: XC18V01VQG44C0100
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
DigiKey Programmable: Not Verified
Description: XC18V01VQG44C0100
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC7A35T-1FGG484C |
|
Hersteller: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 324 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 111.58 EUR |
| EFR-DI-FLASH-LDPC-SITE |
Hersteller: AMD
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
| EFR-DI-FLASH-LDPC-WW |
Hersteller: AMD
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
| EF-DI-FLASH-LDPC-SITE |
|
Hersteller: AMD
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
| EF-DI-FLASH-LDPC-WW |
|
Hersteller: AMD
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
| XCVP1402-1LSEVSVA3340 |
|
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVP1402-1LSIVSVA3340 |
|
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVP1402-2LSEVSVA3340 |
|
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVP1402-2LLEVSVA3340 |
|
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVP1402-1LLIVSVA3340 |
|
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVU57P-1FSVK2892E |
|
Hersteller: AMD
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU57P-2FSVK2892E |
|
Hersteller: AMD
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU57P-L2FSVK2892E |
|
Hersteller: AMD
Description: IC FPGA VIRTEX-UP LP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA VIRTEX-UP LP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU57P-3FSVK2892E |
|
Hersteller: AMD
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XAZU1EG-1SFVA625Q |
|
Hersteller: AMD
Description: IC ZUP MPSOC A53 FPGA Q 625BGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA Q 625BGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MPU, FPGA
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1067.46 EUR |
| XC7A15T-1CSG324I |
|
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
auf Bestellung 298 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 84.52 EUR |
| XC7A15T-3CSG324E |
|
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| DS-XPA-500K |
Hersteller: AMD
Description: XILINX PRODUCTIVITY ADVANTAGE 1
Packaging: Bulk
Type: Design Software
Applications: Programming
Description: XILINX PRODUCTIVITY ADVANTAGE 1
Packaging: Bulk
Type: Design Software
Applications: Programming
Produkt ist nicht verfügbar