| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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XCZU2CG-2UBVA530E | AMD |
 Description: IC SOC CORTEX-A53 530BGAPackaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU2EG-2UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU2EG-1UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU2CG-1UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 105 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU2CG-2UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| XC4006E-4PQ208C | AMD |
Description: IC FPGA 128 I/O 208QFP Packaging: Bulk Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 6000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 608 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 256 Total RAM Bits: 8192 Part Status: Obsolete Number of I/O: 128 DigiKey Programmable: Not Verified |
auf Bestellung 174 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7Z020-2CLG400E | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 85K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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SK-KR260-G | AMD |
Description: KRIA KR260 ROBOTIC START KIT Packaging: Box For Use With/Related Products: SM-K26, XCK26 Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Utilized IC / Part: SM-K26, XCK26 Platform: Kria KR260 Robotics Starter Part Status: Active |
auf Bestellung 85 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU1CG-1SBVA484I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU1CG-1SFVA625I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 635BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU1CG-2SBVA484I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU1EG-2SBVA484I | AMD |
Description: IC ZUP MPSOC EG A53 FPGA 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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EK-U1-ZCU670-V2-G | AMD |
Description: ZYNQ US+ RFSOC ZCU670 V2 EVK Packaging: Box For Use With/Related Products: XCZU67DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Utilized IC / Part: XCZU67DR Platform: Zynq UltraScale+ RFSoC ZCU670 V2 Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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XCKU035-1FBVA676I | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 444343 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Part Status: Active Number of I/O: 312 DigiKey Programmable: Not Verified |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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HW-SMARTLYNQ-PLUS-G-J | AMD |
Description: SMARTLYNQ+ PLUS VERSAL NO PWR Packaging: Box Type: Debugger, Programmer (In-Circuit/In-System) Contents: Board(s), Cable(s), Power Supply, Accessories Utilized IC / Part: FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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HW-PSA01-SK-G | AMD |
Description: KV260 ACC POWER & ADAPTER ONLY Packaging: Box For Use With/Related Products: Kria KV260 Accessory Type: Adapter Utilized IC / Part: Kria KV260 |
auf Bestellung 139 Stücke: Lieferzeit 10-14 Tag (e) |
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HW-BACCP01-SK-G | AMD |
Description: KV260 BASIC ACC PAC W/PWR &ADAPT Packaging: Box For Use With/Related Products: Kria KV260 Accessory Type: Accessory Pack Utilized IC / Part: Kria KV260 |
auf Bestellung 154 Stücke: Lieferzeit 10-14 Tag (e) |
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| A-U280-P32G-PQ-G | AMD |
Description: BOARD DCAB SERVER U280 PASSIVE Power (Watts): 225W Packaging: Box Memory Size: 16GB Interface: PCI Express Operating Temperature: 0°C ~ 45°C Cooling Type: Heat Sink |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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XC5204-5PQ160C0280 | AMD |
Description: FPGA, 120 CLBS, 4000 GATES, 83MH Packaging: Bulk Package / Case: 160-BQFP Mounting Type: Surface Mount Number of Gates: 6000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 480 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 120 Part Status: Active Number of I/O: 124 |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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XA7A12T-1CPG238Q | AMD |
Description: IC FPGA 112 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 12800 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1000 Total RAM Bits: 737280 Part Status: Active Number of I/O: 112 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 8 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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XA7A25T-1CPG238Q | AMD |
Description: IC FPGA 150 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 23360 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1825 Total RAM Bits: 1658880 Grade: Automotive Part Status: Active Number of I/O: 150 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 7 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU47DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU42DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU43DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU43DR-L2FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU42DR-L2FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU47DR-L2FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU57DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU55DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1402-2MLIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1402-2LSEVFVC1596 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-BGA (37.5x37.5) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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XCVM1302-2HSINBVB1024 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1024BGA Packaging: Tray Package / Case: 1024-BFBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1024-BGA (31x31) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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XCVM1302-1LSENSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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XCVM1802-2MSEVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1402-1LSIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU43DR-1FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU43DR-1FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVC1802-1MLIVSVA2197 | AMD |
Description: IC VERSAL AICORE FPGA 2197BGA Packaging: Tray Package / Case: 2197-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 2197-FCBGA (45x45) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU42DR-2FFVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU43DR-2FSVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVM1402-2MSINSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.4GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU42DR-1FFVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU46DR-1FFVH1760E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1760BGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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HW-ADK-2-0-G | AMD |
Description: DEBUG KIT ALVEO ADK2 CARD Packaging: Box Type: Debugger Contents: Board(s) Part Status: Active |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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XC6SLX75-2FG484I | AMD |
Description: IC FPGA 280 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74637 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 5831 Total RAM Bits: 3170304 Number of I/O: 280 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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XC4028XLA-09HQ160C | AMD |
Description: FPGA, 1024 CLBS, 18000 GATES Packaging: Bulk Package / Case: 160-BQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 28000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 2432 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 129 DigiKey Programmable: Not Verified |
auf Bestellung 72 Stücke: Lieferzeit 10-14 Tag (e) |
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| XC4028XL-2HQ160C | AMD |
Description: IC FPGA 129 I/O 160QFP Packaging: Bulk Package / Case: 160-BQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 28000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 2432 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 129 DigiKey Programmable: Not Verified |
auf Bestellung 106 Stücke: Lieferzeit 10-14 Tag (e) |
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| XC4036XL-2HQ160C | AMD |
Description: IC FPGA 129 I/O 160QFP Packaging: Bulk Package / Case: 160-BQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 36000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 3078 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 1296 Total RAM Bits: 41472 Number of I/O: 129 DigiKey Programmable: Not Verified |
auf Bestellung 172 Stücke: Lieferzeit 10-14 Tag (e) |
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A-U55C-P00G-PQ-G | AMD |
Description: BD U55C DCAB ALVEO QSFP28/2 PCIE Power (Watts): 150W Packaging: Box Memory Size: 16GB Interface: PCI Express Operating Temperature: 0°C ~ 55°C Bandwidth: 460GB/s Cooling Type: Heat Sink LUTs: 1304k |
auf Bestellung 31 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU1CG-2UBVA494I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU1CG-1UBVA494I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 58 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU1EG-2UBVA494I | AMD |
Description: IC ZUP MPSOC EG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active |
auf Bestellung 126 Stücke: Lieferzeit 10-14 Tag (e) |
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XA7A15T-1CSG325Q | AMD |
Description: IC FPGA 150 I/O 324CSBGA Packaging: Bulk Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Grade: Automotive Number of I/O: 150 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 126 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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XC3142-4TQ100C | AMD |
Description: FPGA, 144 CLBS, 3000 GATES Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Number of Gates: 3000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 144 Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 144 Total RAM Bits: 30784 Number of I/O: 82 DigiKey Programmable: Not Verified |
auf Bestellung 191 Stücke: Lieferzeit 10-14 Tag (e) |
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XC3142-3TQ100C | AMD |
Description: FPGA, 144 CLBS, 3000 GATES Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Number of Gates: 3000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 144 Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 144 Total RAM Bits: 30784 Number of I/O: 82 DigiKey Programmable: Not Verified |
auf Bestellung 903 Stücke: Lieferzeit 10-14 Tag (e) |
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XC3142-TQ144IPH | AMD |
Description: XC3142 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 3000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Logic Elements/Cells: 144 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 144 Total RAM Bits: 30784 Number of I/O: 96 DigiKey Programmable: Not Verified |
auf Bestellung 440 Stücke: Lieferzeit 10-14 Tag (e) |
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XC3142-5TQ100C | AMD |
Description: FPGA, 144 CLBS, 3000 GATES Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Number of Gates: 3000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 144 Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 144 Total RAM Bits: 30784 Number of I/O: 82 DigiKey Programmable: Not Verified |
auf Bestellung 167 Stücke: Lieferzeit 10-14 Tag (e) |
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XC3142-PQ100CPH | AMD |
Description: XC3142 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 100-BQFP Mounting Type: Surface Mount Number of Gates: 3000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 144 Supplier Device Package: 100-PQFP (20x14) Number of LABs/CLBs: 144 Total RAM Bits: 30784 Number of I/O: 82 DigiKey Programmable: Not Verified |
auf Bestellung 1941 Stücke: Lieferzeit 10-14 Tag (e) |
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XC3130-PG84CPH | AMD |
Description: XC3130 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 84-BCPGA Mounting Type: Through Hole Number of Gates: 2000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 100 Supplier Device Package: 84-CPGA (28x28) Number of LABs/CLBs: 100 Total RAM Bits: 22176 Number of I/O: 74 DigiKey Programmable: Not Verified |
auf Bestellung 213 Stücke: Lieferzeit 10-14 Tag (e) |
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| XC95144XV-7TQ144C | AMD |
Description: FLASH PLD, 7.5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| XCZU2CG-2UBVA530E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 752.06 EUR |
| XCZU2EG-2UBVA530I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1030.8 EUR |
| XCZU2EG-1UBVA530I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 804.67 EUR |
| XCZU2CG-1UBVA530I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 670.54 EUR |
| XCZU2CG-2UBVA530I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 859.88 EUR |
| XC4006E-4PQ208C |
Hersteller: AMD
Description: IC FPGA 128 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 608
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 256
Total RAM Bits: 8192
Part Status: Obsolete
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC FPGA 128 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 608
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 256
Total RAM Bits: 8192
Part Status: Obsolete
Number of I/O: 128
DigiKey Programmable: Not Verified
auf Bestellung 174 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 136.24 EUR |
| XC7Z020-2CLG400E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SK-KR260-G |
|
Hersteller: AMD
Description: KRIA KR260 ROBOTIC START KIT
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KR260 Robotics Starter
Part Status: Active
Description: KRIA KR260 ROBOTIC START KIT
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KR260 Robotics Starter
Part Status: Active
auf Bestellung 85 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 792.6 EUR |
| XCZU1CG-1SBVA484I |
|
Hersteller: AMD
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 623.21 EUR |
| XCZU1CG-1SFVA625I |
|
Hersteller: AMD
Description: IC ZUP MPSOC CG A53 FPGA 635BGA
Description: IC ZUP MPSOC CG A53 FPGA 635BGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU1CG-2SBVA484I |
|
Hersteller: AMD
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 696.47 EUR |
| XCZU1EG-2SBVA484I |
|
Hersteller: AMD
Description: IC ZUP MPSOC EG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC EG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 839 EUR |
| EK-U1-ZCU670-V2-G |
|
Hersteller: AMD
Description: ZYNQ US+ RFSOC ZCU670 V2 EVK
Packaging: Box
For Use With/Related Products: XCZU67DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU67DR
Platform: Zynq UltraScale+ RFSoC ZCU670 V2
Part Status: Active
Description: ZYNQ US+ RFSOC ZCU670 V2 EVK
Packaging: Box
For Use With/Related Products: XCZU67DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU67DR
Platform: Zynq UltraScale+ RFSoC ZCU670 V2
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 34501.13 EUR |
| XCKU035-1FBVA676I |
|
Hersteller: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Part Status: Active
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Part Status: Active
Number of I/O: 312
DigiKey Programmable: Not Verified
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 3400.09 EUR |
| HW-SMARTLYNQ-PLUS-G-J |
|
Hersteller: AMD
Description: SMARTLYNQ+ PLUS VERSAL NO PWR
Packaging: Box
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FPGA
Description: SMARTLYNQ+ PLUS VERSAL NO PWR
Packaging: Box
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| HW-PSA01-SK-G |
Hersteller: AMD
Description: KV260 ACC POWER & ADAPTER ONLY
Packaging: Box
For Use With/Related Products: Kria KV260
Accessory Type: Adapter
Utilized IC / Part: Kria KV260
Description: KV260 ACC POWER & ADAPTER ONLY
Packaging: Box
For Use With/Related Products: Kria KV260
Accessory Type: Adapter
Utilized IC / Part: Kria KV260
auf Bestellung 139 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 61.13 EUR |
| HW-BACCP01-SK-G |
Hersteller: AMD
Description: KV260 BASIC ACC PAC W/PWR &ADAPT
Packaging: Box
For Use With/Related Products: Kria KV260
Accessory Type: Accessory Pack
Utilized IC / Part: Kria KV260
Description: KV260 BASIC ACC PAC W/PWR &ADAPT
Packaging: Box
For Use With/Related Products: Kria KV260
Accessory Type: Accessory Pack
Utilized IC / Part: Kria KV260
auf Bestellung 154 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 144.3 EUR |
| A-U280-P32G-PQ-G |
|
Hersteller: AMD
Description: BOARD DCAB SERVER U280 PASSIVE
Power (Watts): 225W
Packaging: Box
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Cooling Type: Heat Sink
Description: BOARD DCAB SERVER U280 PASSIVE
Power (Watts): 225W
Packaging: Box
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Cooling Type: Heat Sink
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC5204-5PQ160C0280 |
|
Hersteller: AMD
Description: FPGA, 120 CLBS, 4000 GATES, 83MH
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 480
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 120
Part Status: Active
Number of I/O: 124
Description: FPGA, 120 CLBS, 4000 GATES, 83MH
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 480
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 120
Part Status: Active
Number of I/O: 124
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 62.32 EUR |
| XA7A12T-1CPG238Q |
|
Hersteller: AMD
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 8 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| XA7A25T-1CPG238Q |
|
Hersteller: AMD
Description: IC FPGA 150 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 150 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 7 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| XCZU47DR-L2FSVE1156I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU42DR-L2FSVE1156I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU43DR-L2FSVE1156I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU43DR-L2FFVE1156I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU42DR-L2FFVE1156I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU47DR-L2FFVE1156I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU57DR-L2FSVE1156I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU55DR-L2FSVE1156I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1402-2MLIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1402-2LSEVFVC1596 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 19078.38 EUR |
| XCVM1302-2HSINBVB1024 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 12646.13 EUR |
| XCVM1302-1LSENSVF1369 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 8416.16 EUR |
| XCVM1802-2MSEVSVD1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1402-1LSIVSVD1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU43DR-1FFVE1156I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU43DR-1FSVG1517I |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVC1802-1MLIVSVA2197 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU42DR-2FFVE1156E |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU43DR-2FSVE1156E |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCVM1402-2MSINSVF1369 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU42DR-1FFVE1156E |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XCZU46DR-1FFVH1760E |
|
Hersteller: AMD
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| HW-ADK-2-0-G |
|
Hersteller: AMD
Description: DEBUG KIT ALVEO ADK2 CARD
Packaging: Box
Type: Debugger
Contents: Board(s)
Part Status: Active
Description: DEBUG KIT ALVEO ADK2 CARD
Packaging: Box
Type: Debugger
Contents: Board(s)
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 978.8 EUR |
| XC6SLX75-2FG484I |
|
Hersteller: AMD
Description: IC FPGA 280 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74637
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5831
Total RAM Bits: 3170304
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA 280 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74637
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5831
Total RAM Bits: 3170304
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| XC4028XLA-09HQ160C |
|
Hersteller: AMD
Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
auf Bestellung 72 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 88.27 EUR |
| XC4028XL-2HQ160C |
|
Hersteller: AMD
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
auf Bestellung 106 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 177.75 EUR |
| XC4036XL-2HQ160C |
|
Hersteller: AMD
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 36000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3078
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1296
Total RAM Bits: 41472
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 36000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3078
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1296
Total RAM Bits: 41472
Number of I/O: 129
DigiKey Programmable: Not Verified
auf Bestellung 172 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 210.44 EUR |
| A-U55C-P00G-PQ-G |
|
Hersteller: AMD
Description: BD U55C DCAB ALVEO QSFP28/2 PCIE
Power (Watts): 150W
Packaging: Box
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 55°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
Description: BD U55C DCAB ALVEO QSFP28/2 PCIE
Power (Watts): 150W
Packaging: Box
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 55°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 9945.64 EUR |
| XCZU1CG-2UBVA494I |
|
Hersteller: AMD
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 662 EUR |
| XCZU1CG-1UBVA494I |
|
Hersteller: AMD
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 517.19 EUR |
| XCZU1EG-2UBVA494I |
|
Hersteller: AMD
Description: IC ZUP MPSOC EG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC EG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
auf Bestellung 126 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 797.61 EUR |
| XA7A15T-1CSG325Q |
|
Hersteller: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 126 Stücke
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| XC3142-4TQ100C |
|
Hersteller: AMD
Description: FPGA, 144 CLBS, 3000 GATES
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
Description: FPGA, 144 CLBS, 3000 GATES
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
auf Bestellung 191 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 26+ | 21.85 EUR |
| XC3142-3TQ100C |
|
Hersteller: AMD
Description: FPGA, 144 CLBS, 3000 GATES
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
Description: FPGA, 144 CLBS, 3000 GATES
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
auf Bestellung 903 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13+ | 46.52 EUR |
| XC3142-TQ144IPH |
|
Hersteller: AMD
Description: XC3142 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 144
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 96
DigiKey Programmable: Not Verified
Description: XC3142 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 144
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 440 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 23+ | 25.25 EUR |
| XC3142-5TQ100C |
|
Hersteller: AMD
Description: FPGA, 144 CLBS, 3000 GATES
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
Description: FPGA, 144 CLBS, 3000 GATES
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 30+ | 18.73 EUR |
| XC3142-PQ100CPH |
|
Hersteller: AMD
Description: XC3142 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-PQFP (20x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
Description: XC3142 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-PQFP (20x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
auf Bestellung 1941 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 18+ | 31.56 EUR |
| XC3130-PG84CPH |
|
Hersteller: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 84-BCPGA
Mounting Type: Through Hole
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-CPGA (28x28)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 84-BCPGA
Mounting Type: Through Hole
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-CPGA (28x28)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
auf Bestellung 213 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15+ | 36.72 EUR |
| XC95144XV-7TQ144C |
|
Hersteller: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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